Senior Reliability Technician

Job Title

Senior Reliability Technician

Job Title

Reliability Senior Technician

Key responsibilities

• 1. Stress Testing & Qualification: Set up, execute, and monitor industry-standard semiconductor reliability stress tests, including HTOL (High-Temperature Operating Life), THB (Temperature Humidity Bias), Thermal Cycling, etc
• 2. Lab Equipment Operation & Maintenance: Program, operate, and troubleshoot environmental chambers, burn-in boards, socket fixtures, and test equipment or benchtop instruments (SMUs, oscilloscopes, multi-meters, etc).
• 3. Failure Isolation & Initial Analysis: Perform preliminary electrical characterization on stressed or failed devices to isolate failure modes (e.g., curve tracing, leakage measurement, shorts/opens analysis).
• 4. Data Management & Reporting: Collect and organize test datasets.
• 5. Cross-Functional Support: Collaborate daily with Reliability Engineer(s), Design Engineers, and Test Development team to troubleshoot equipment discrepancies/ abnormalities during/after stress tests/etc.

Qualifications & Requirements

• 1. Experience: 3+ years of hands-on technical experience in a semiconductor reliability, failure analysis, or high-reliability manufacturing lab environment.
• 2. Technical Knowledge:
• Basic working knowledge of semiconductor physics, device packaging, and failure mechanisms.
• Familiarity with industry reliability standards such as JEDEC/Telcordia/etc
• Comfort using PC-based test interfaces and operating pre-existing Python programs or scripts to initialize test stations, run DUTs, and capture data.
• 3. Tool Proficiency:
• Proficiency with lab instruments (Source Measure Units, signal generators, curve tracers, oscilloscopes, etc).
• Experience programming and managing environmental test chambers and burn-in systems.
• Basic familiarity with failure analysis tools (Optical Microscopy, electrical verification, etc).

Preferable (but not obligatory) skills

• 1. PCB Repair & Soldering: Capability to perform fine-pitch surface-mount (SMT) and through-hole soldering, component-level troubleshooting, and custom modification or repair of test boards and printed circuit boards (PCBs).
• 2. Wire Bonding: Experience with manual or semi-automated wedge/wedge wire bonders for sample preparation, samples rewiring, or repairing broken connections on test devices