Job Overview Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization. You will lead a team responsible for driving package design execution to ensure first-pass success across customer programs. In this role, you will act as a trusted technical partner to customers, enabling successful adoption of Intel's advanced packaging technologies (EMIB, Foveros, chiplet architectures).Responsibilities Leadership and Management: Lead and manage a group of IC Packaging Engineers, providing guidance, mentorship, and support to ensure successful project execution. Oversee planning, scheduling, and execution of package design projects, ensuring milestones and deadlines are met. Foster a collaborative and innovative team environment, encouraging continuous learning and professional development. Lead design groups, coordinating efforts across multiple teams to achieve project goals.Technical Expertise: Serve as the primary package design technical lead and guide customers through end-to-end package design flow. Drive the development of advanced packaging designs, ensuring compliance with industry standards and best practices. Collaborate with cross-functional teams to define and implement design specifications. Leverage extensive experience in advanced packaging designs to meet design KPIs. Ensure products are designed and developed with high quality standards by overseeing design processes, risk management, and compliance throughout the product lifecycle, identifying and addressing potential quality issues early.Project Management: Develop and maintain detailed project plans, including resource allocation, risk management, and progress tracking. Coordinate with stakeholders to align on project goals, deliverables, and timelines. Conduct regular project reviews and provide status updates to senior management.Innovation and Improvement: Identify and implement process improvements to enhance the efficiency and quality of package designs and development. Stay current with industry trends and emerging technologies, incorporating new methodologies and tools into the design process. Drive innovation in product design to achieve competitive advantages.Qualifications Minimum qualifications:Bachelor's degree in Electrical Engineering or STEM field with 9+ years of relevant experience, OR Master's degree with 6+ years, OR PhD with 4+ years of relevant experience.Experience in IC Package, chiplet/SOC design, or heterogeneous integration, with at least 3 years in a leadership role.Proven leadership or management experience, with a track record of guiding engineering teams and delivering complex projects within timelines.Experience in performance, manufacturability, and yield-aware design methodologies.Experience with design flows and methodologies (physical design, analysis, verification).Experience working with IC Packaging EDA tools from Siemens and/or Cadence.Experience with packaging technologies and heterogeneous integration.Preferred Qualifications:Experience with IC Packaging designs for HPC/AI-class products.Join Intel and contribute to shaping the future of technology. Apply to take the next step in your career.#J-18808-Ljbffr