NewPrincipal PCB & Substrate Layout Engineer GCR Professional ServicesPrincipal PCB & Substrate Layout EngineerPhoenix, ArizonaContractorHands on high-speed, multi-layer packaging, high-density interconnects (HDI), blind and buried vias, ball grid arrays (BGAs), RF, design for test (DFT), impedance calculations, cross talk, differential pairs, PCB stack-ups, PCB via structures, electromagnetic compatibility (EMC), material studies/selection, etc. You are responsible for: Providing technical leadership to the engineering team specifically focused on High-Speed Interfaces and High Density Substrates layout techniques and understanding and improving our layout development processes to ensure we produce quality products using your expertise in PCB and Substrate layout engineering.
Packaging Engineer iMPact Business GroupPackaging EngineerTempe, AZAnalyzing engineering drawings and specifications to determine the required types of packaging materials and to maximize convenience, utility, and function based on the product's physical characteristics, safety, and special-handling requirements. Our client, a Global Leader in the Medical Device Industry, has an immediate opening for a R&D Packaging Engineer(Medical Products) for a 6-month + Contract.
Senior Packaging Engineer (Microelectronics) Kforce Inc.Senior Packaging Engineer (Microelectronics)Tempe, AZ$180,000–$220,000In this role, you would lead all aspects of microelectronics packaging development, working closely with RFIC, MMIC, and module design teams to create advanced packaging solutions for devices ranging from ICs and System-in-Package (SiP) designs to complex modules and sub-assemblies. Summary: This position would place you as the key Microelectronics Packaging Engineer on a talented space electronics engineering team, responsible for developing next-generation packaging solutions for advanced RF communications products supporting cutting-edge space systems.
Packaging Engineer JBL ResourcesPackaging EngineerTempe, AZJBL Resources is proud to have earned the reputation of being a premier provider of top talent professionals in the fields of engineering, human resources, logistics, operations, and supply chain management. Working here means joining a team of top technical professionals bringing cutting-edge products to the forefrontoffering driven individuals the opportunity to make a meaningful impact every day.
NewSr. Thermal & Mechanical Packaging Engineer, Annapurna Labs AmazonSr. Thermal & Mechanical Packaging Engineer, Annapurna LabsPhoenix, AZThermal & Mechanical Packaging Engineer, Annapurna LabsAs a member of the Machine Learning Acceleration team you'll be responsible for the design and optimization of hardware in our data centers, leading new technology adoption for large‑scale server deployments to deliver a world‑class customer experience. Proficiency with FEA/CFD simulation tools: ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK.Preferred QualificationsExperience with advanced packaging metrologies, laboratory thermal/mechanical measurements, infrared thermography, acoustic chambers, and thermal test setups.
NewMSI/MSIX Packaging Engineer Jobs via DiceMSI/MSIX Packaging EngineerPhoenix, AZThe ideal candidate will have strong hands-on experience with InstallShield and must have skills in packaging, scripting, and troubleshooting. A collaborative approach in working with application developers and infrastructure teams is essential for the role.#J-18808-Ljbffr.
NewSenior Thermal & Mechanical Packaging Engineer - Data Center Systems AmazonSenior Thermal & Mechanical Packaging Engineer - Data Center SystemsPhoenix, AZFamiliarity with simulation tools is crucial for this role, which involves collaboration across multiple technology domains.#J-18808-Ljbffr. You will design and optimize hardware for our data centers, driving new technology adoption to enhance customer experience.
Packaging Engineer Mount IndiePackaging EngineerTempe, ArizonaThis role is responsible for planning, designing, and delivering innovative packaging solutions across a range of technologies, including integrated circuits (ICs), system-in-package (SiP), sub-assemblies, and modules. You will own the full packaging lifecycle—from concept and definition through design, modeling, testing, and production release—while partnering closely with cross-functional engineering teams and external vendors.
RF/Microelectronics Packaging Engineer ViaSat IncRF/Microelectronics Packaging EngineerTempe, AZ$185,500–$278,500 / yearThe packaging development process includes: • Package definition • Stack-up • Substrate layout • Bond diagram • Drawings • Predictive modeling combined with system testing • Technical risk/cost assessment • Materials and process characterization • Compilation of formal documentation • Collaborating with sub-contractors and internal assembly and reliability resources • Final release of product. For specific work locations within San Jose, the San Francisco Bay area, and New York City metropolitan area, the base pay range for this role is $185,500.00 - $278,500.00 / annually.
Silicon Packaging Design Engineer Intel CorpSilicon Packaging Design EngineerPhoenix, AZ$105,650–$200,340 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Advanced IC Packaging Engineer Powerlattice TechnologiesAdvanced IC Packaging EngineerChandler, ArizonaWe’re looking for a hands-on technical leader to pioneer industry-first packaging solutions that integrate power delivery chiplets directly into advanced substrates. Drive assembly process development, including novel flows for chiplet integration, substrate embedding, advanced interconnects and structure for reliability tests.
Packaging Process Engineer - Microdisplay Snap IncPackaging Process Engineer - MicrodisplayChandler, AZ$142,000–$214,000 / yearThe Company's three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles. Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.
Packaging Process Engineer – Microdisplay SnapPackaging Process Engineer – MicrodisplayChandler, ArizonaThe Company operates Snapchat , a visual messaging app that enhances your relationships with friends, family, and the world, and Specs Inc. , a wholly-owned subsidiary dedicated to making computing more human, in addition to Bitmoji , Saturn, and other digital services. Additionally you will: Own and optimize a backend packaging process for LCOS advanced displays, from early development through high-volume manufacturing, ensuring stable, high-yield output.
Packaging Module Development Engineer Intel CorpPackaging Module Development EngineerChandler, AZ$115,110–$219,550 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum Qualifications: Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.
Packaging Module Equipment Development Engineer Intel CorpPackaging Module Equipment Development EngineerChandler, AZ$133,800–$188,890 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Current and future Metrology Engineers are expected to develop strong technical capabilities in the following areas: Operating, programming, troubleshooting, and optimizing automated inspection equipment, including hands-on interaction with hardware components such as lighting systems, cameras, transducers, robotic systems, and conveyors.
Foundry Services Advanced Packaging Account Technical Solutions Engineer Intel CorpFoundry Services Advanced Packaging Account Technical Solutions EngineerChandler, AZ$220,320–$311,040 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
NewMechanical Design Engineer - Semiconductor Packaging IntelMechanical Design Engineer - Semiconductor PackagingPhoenix, AZ$105,650–$149,150 / yearJob Type:Experienced Hire## Shift:Shift 1 (United States of America)## Primary Location:US, Arizona, Phoenix## Additional Locations:## Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.
Advanced Packaging SI/PI Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 3+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 2+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Advanced Packaging SI/PI Senior Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Senior Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Semiconductor Packaging Modeling and Simulation Engineer onsemiSemiconductor Packaging Modeling and Simulation EngineerScottsdale, AZWith a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
NewSenior Mechanical Tooling Engineer - Advanced Packaging IntelSenior Mechanical Tooling Engineer - Advanced PackagingPhoenix, AZIntel is seeking a highly motivated Mechanical Tooling Engineer in Phoenix, Arizona, to define, design, and deploy tooling solutions for advanced semiconductor packaging. Qualified candidates will possess a master's degree in Mechanical Engineering or related fields, with 4+ years of experience, or a Ph.
NewPackaging Equipment Engineer: Innovate & Optimize IntelPackaging Equipment Engineer: Innovate & OptimizePhoenix, AZIntel Corporation is seeking a Packaging Module Equipment Development Engineer in Phoenix, Arizona. This role involves developing and optimizing assembly processes and technologies.
Senior Packaging Engineer-Phoenix AZ-Hybrid Roth Staffing CompaniesSenior Packaging Engineer-Phoenix AZ-HybridGuadalupe, Arizona$0–$61.86 / hourAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. Our collaborative culture, focus on continuous improvement, and passion for making a meaningful impact set us apart as an employer of choice within the industry.
NewSr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging Amazon.com IncSr. Package Layout Engineer, Annapurna Labs - AI Silicon PackagingTempe, AZPerform detailed RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates and silicon interposers. You"ll drive the physical implementation of complex multi-die and advanced packaging architectures, working closely with silicon, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet dynamic performance, density, and reliability targets.
NewPackaging Equipment Engineer AI-Enhanced Inspection IntelPackaging Equipment Engineer AI-Enhanced InspectionChandler, AZ$133,800–$188,890 / yearIntel Corporation is seeking an experienced engineer in Chandler, Arizona to develop assembly processes and optimize manufacturing quality for silicon and package technologies. Ideal candidates will have a Bachelor's degree in Engineering or similar, with significant experience in inspection equipment, and a passion for innovation in manufacturing processes.
NewPackaging Modeling & Simulation Engineer (Digital Twin) OnsemiPackaging Modeling & Simulation Engineer (Digital Twin)Scottsdale, AZ$146,970–$249,780 / yearThis role involves conducting thermal-mechanical simulations for microelectronic packaging and improving modeling methodologies. A competitive salary ranging from $146,970 to $249,780 is offered along with a comprehensive benefits package.#J-18808-Ljbffr.
Principal Engineer, Electrical Engineering - Advanced Packaging ASM International NVPrincipal Engineer, Electrical Engineering - Advanced PackagingPhoenix, AZThe Principal Electrical Engineer is a technical leader responsible for defining, designing, and governing the electrical architecture of advanced semiconductor packaging equipment (etch, deposition, etc.). With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.
NewPackaging Process Engineer, Microdisplay Backend (RSU) SnapPackaging Process Engineer, Microdisplay Backend (RSU)Chandler, AZThe role requires a BS degree and over 7 years in a related field, focusing on automated production equipment and yield improvement. Snap is looking for an experienced engineer to own the backend packaging process for LCOS advanced displays in Chandler, Arizona.
Principal Engineer, Electrical Engineering – Advanced Packaging ASMPrincipal Engineer, Electrical Engineering – Advanced PackagingPhoenix, ArizonaThe Principal Electrical Engineer is a technical leader responsible for defining, designing, and governing the electrical architecture of advanced semiconductor packaging equipment (etch, deposition, etc.). With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.
Senior Engineer, Packaging Engineering Apidel TechnologiesSenior Engineer, Packaging EngineeringTempe, AZContractorAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. This is an individual contributor role that requires the use of judgement in applying professional expertise and is expected to work independently with minimal supervision.
NewProcess Engineer II - Microelectronics Packaging & SPC MED MedtronicProcess Engineer II - Microelectronics Packaging & SPCTempe, AZMedtronic Inc in Tempe, Arizona, is seeking a Process Engineer II who will be responsible for scouting materials and developing manufacturing processes. The role requires a Bachelor's or Master's degree in a related field and experience in microelectronics processes.
Packaging Development Engineer Staffmark Group LlcPackaging Development EngineerPhoenix, AZRemoteconfirm the suitability of packaging on mass production and filling lines; they will provide expert technical support to troubleshoot and resolve. At Staffmark, we connect hardworking people with great companies, creating opportunities that make a lasting impact.
ADCE Packaging Design Architect Intel CorpADCE Packaging Design ArchitectChandler, AZ$220,920–$311,890 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
Silicon Packaging Engineering Manager Intel CorpSilicon Packaging Engineering ManagerPhoenix, AZ$190,610–$269,100 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum Qualifications: Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience OR- Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience OR- PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience.
(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging ASM International NV(Senior) Member of Technical Staff / Director, Process Engineering, Advanced PackagingPhoenix, AZYoull lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.
(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging ASM(Senior) Member of Technical Staff / Director, Process Engineering, Advanced PackagingPhoenix, ArizonaYou’ll lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. · Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.
NewATD Laser Development Engineer Intel CorpATD Laser Development EngineerChandler, AZ$85,200–$162,500 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
NewATD Experienced Laser Development Engineer Intel CorpATD Experienced Laser Development EngineerPhoenix, AZ$115,110–$219,550 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Test Module Development Engineer Intel CorpTest Module Development EngineerChandler, AZPrimary Focus: • Advanced semiconductor packaging technologies beyond conventional approaches • 3D packaging innovations and chiplet integration • High-performance computing packaging for data centers and AI applications • Heterogeneous integration across diverse chip technologies • Scaling packaging density while enhancing thermal and electrical performance. Test Module Development Engineer responsibilities include but are not limited to: • Executes test technology development and enablement for high-mix, low-volume testing and future technologies, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
Thermal data Analysis Engineer Intel CorpThermal data Analysis EngineerChandler, AZ$164,470–$232,190 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. PhD in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, Chemical Engineering, or a related technical field; OR a Master's degree in one of these disciplines with 2+ years of experience in thermal engineering, thermal sciences, or a related field.
PCB & Substrate Layout Engineer (On-Site Preferred) HRU-TechPCB & Substrate Layout Engineer (On-Site Preferred)Phoenix, ArizonaWe are seeking an experienced Principal PCB & Substrate Layout Engineer to provide technical leadership and hands-on expertise in the design and development of advanced printed circuit boards, high-density substrates, and microelectronic packaging solutions. The successful candidate will serve as a technical leader, driving layout excellence, supporting multidisciplinary engineering teams, and ensuring designs are optimized for performance, manufacturability, reliability, and quality.
Mechanical Project Engineer Intel CorpMechanical Project EngineerChandler, AZ$118,150–$166,800 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Design Automation Engineer (TFM/EDA) Intel CorpDesign Automation Engineer (TFM/EDA)Phoenix, AZ$100,550–$194,270 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. About This Role: This role encompasses installation, maintenance, and technical support of design environment (automation scripts, front-end and back-end design tools, flows, processes, and licenses) as well as compute environment (storage, compute, netbatch, ION, etc.).
NewMixed Signal Logic Design Engineer IntelMixed Signal Logic Design EngineerPhoenix, AZ$141,910–$269,100 / yearExperience with multiple clock-domain designPreferred Qualifications:* BS degree in Electrical Engineering or Computer Engineering or similar field of study with 10+ years relevant experience* -OR- MS degree in Electrical Engineering or Computer Engineering or similar field of study with 8+ years relevant experience.* Able to work highly independently, guide other junior team members and make contributions that increase the productivity of the entire design team* Excellent communication and interpersonal skills* Experience with both logic and analog circuits as well as with analog behavioral modeling* Knowledge of mixed-signal validation, signal and systems analysis* Knowledge of High-Speed I/O protocol stacks (UCIe, PCIe, USB, etc.)* Experience with scripting languages e.g. Perl, bash/csh and Python is highly desirable* Proven record of coordinating/guiding other designers to deliver large complex logic blocks* Experience using RTL quality tools such as linting and CDC analysis and supporting team adoption and usage* Experience with low-power design, power gating and multiple power-domain design* Experience with writing, testing, packaging and releasing firmware* Experience writing, testing and supporting front-end automation and packaging flows* Experience using AI tools as a productivity booster in all aspects of the IP design process* Strong analytical debugging skills, with a creative approach to problem-solvingJoin us in redefining technology and engineering challenges.
DFT Application Engineer IntelDFT Application EngineerChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: US, California, Santa Clara, US, Oregon, Hillsboro Business group: The Central Engineering Group (CEG) is Intel's data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). 3+ years of combined experience in the following: implementing ASIC DFT/DFM insertion (MBIST, LBIST, SCAN, JTAG) at both ASIC design block level and full chip level, including ATPG validation and DFT timing/signoff at SOC level.
Design Technology Tool Enablement Engineer Intel CorpDesign Technology Tool Enablement EngineerPhoenix, AZ$173,660–$284,580 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. As an EDA Tools Software Engineer, you will play a pivotal role in designing, developing, testing, and debugging software tools and flows that empower design teams to innovate faster and meet complex manufacturability requirements.
Senior Applications and Solutions Engineer - Foundry Services Intel CorpSenior Applications and Solutions Engineer - Foundry ServicesPhoenix, AZ$122,440–$232,190 / yearWe seek a Senior ASIC Design Engineer to provide technical support to Intel Foundry Services customers on PDKs through ASIC design implementation flows and to perform ASIC physical design execution with specialized focus on complex multi-voltage domain (UPF/CPF) designs and power-intent (VCLP and Conformal LP) verification signoff. Business group: The Central Engineering Group (CEG) is Intel''s data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies).
Senior AI Engineer - Agentic Systems DPR Construction IncSenior AI Engineer - Agentic SystemsAZTechnical direction-setting across the Agentic AI track: design reviews, architectural guidance, raising the bar on what "production-ready" means for agents, and mentoring engineers earlier in their agentic AI journey. You will work closely with cross-functional teams, including business stakeholders, data engineers, and technical leads, to ensure alignment between business needs and data architecture and define data models for specific focus areas.
Level 2/3 Control Systems Engineer - Phoenix Logical SystemsLevel 2/3 Control Systems Engineer - PhoenixPhoenix, ArizonaThe engineer uses knowledge and experience in instrumentation, control valves, Motors/VFDs, control system electrical design, and PLC/DCS programming to deliver an automation system that meets the user’s needs utilizing the minimum essential design. Industry experience in Food and Beverage, Chemical, Pharma, Semiconductor, Water & Wastewater, Refining, Pulp and Paper, Oil/Gas Pipeline, Power Generation, Electrical Transmission & Distribution, Material Handling, or Packaging.
Level 2/3 Control Systems Engineer (Mandarin Fluency) - Phoenix Logical SystemsLevel 2/3 Control Systems Engineer (Mandarin Fluency) - PhoenixPhoenix, ArizonaThe engineer uses knowledge and experience in instrumentation, control valves, Motors/VFDs, control system electrical design, and PLC/DCS programming to deliver an automation system that meets the user’s needs utilizing the minimum essential design. Industry experience in Food and Beverage, Chemical, Pharma, Semiconductor, Water & Wastewater, Refining, Pulp and Paper, Oil/Gas Pipeline, Power Generation, Electrical Transmission & Distribution, Material Handling, or Packaging.