The Starship Avionics team is responsible for designing a Starship avionics system that is optimized for high reliability at a low mass and cost. Our charter is to develop highly producible mechanical designs and packaging solutions that protect our electronics from the harsh mechanical and thermal environments of launch vehicle operations.
RESPONSIBILITIES:
Design packaging solutions for electro-mechanical assemblies
Thermal, structural, and tolerance analysis for electro-mechanical assemblies using both hand calculations and finite element analysis
Participate in initial mechanical design, 3D modeling, creation of production drawings and maintenance of design data
Failure analysis of components as it relates to thermal, loads, vibration and shock
Interface with machine shops and production teams to ensure final designs can be produced in accordance with overall project goals
Own the hardware delivery timeline and success through inception, design, assembly, test, and integration
Lead design reviews internally and participate in reviews with suppliers and customers
Ensure structural designs are capable of both weight and rate targets using innovative design and manufacturing approaches
BASIC QUALIFICATIONS:
Bachelor's degree in mechanical, aerospace, or other engineering discipline
5+ years of professional experience with mechanical or electromechanical design and analysis
PREFERRED SKILLS AND EXPERIENCE:
Self-motivated with strong organizational, written, and oral communication skills
Experience with CAD and FEA software packages
Proficient and frequent use of hand calculations, finite element analyses (FEA), and computer-aided designs (CAD)
Exposure to high volume production designs with a focus on design for manufacturability
Exposure to designing for high vibration environments
Demonstrated understanding of structural analysis and failure modes
Working knowledge of thermal and structural FEA studies
Experience with fatigue and thermal testing of electro-mechanical assemblies
Solid understanding and application of GD&T (e.g. ANSYS, ABAQUS, NASTRAN)
Experience working with PCB designers and exposure to PCB layout
Experience with structural and thermal analysis of rocket components
ADDITIONAL REQUIREMENTS:
Extended hours and weekend work may be required to support critical project and mission milestones