Role Overview
We are seeking a staff-level Thermal & Thermo-Mechanical Analysis Engineer to lead the simulation, modeling, and architectural definition of our next-generation AI data center hardware. In this role, you will be responsible for the end-to-end thermal integrity of high-power AI systems. Your work will directly impact advanced CoWoS (Silicon Interposer) architectures, complex substrate packaging, and high-layer-count data center-class PCBs.
The ideal candidate will possess deep expertise in semiconductor thermal management and will develop innovative cooling solutions spanning chip/package/PCB/system stack including traditional air cooling, cold plates, direct-to-chip liquid cooling, immersion cooling, microchannel cooling, advanced TIMs, and emerging thermal technologies required to support future AI compute platforms.
What you'll do
- Thermal Analysis & Modeling: Build high-fidelity static and dynamic thermal models for AI workloads spanning silicon, advanced packaging, and system levels.
- Thermo-Mechanical Simulation: Predict and mitigate structural risks including warpage, die-tilt, thermal stress, and solder joint reliability (BLR/BGA).
- Workload-Driven Characterization: Simulate transient thermal behavior under varying data center workloads, calculating time-dependent nodal temperatures, and plotting thermal contours.
- Mitigation Strategies: Develop, propose, and implement innovative cooling and mechanical mitigation techniques (e.g., TIM selection, stiffener rings, optimized copper balancing).
- System level solution: Perform thermal modeling and CFD analysis for die, package, board, and system designs. Develop cooling solutions for high-power AI/HPC devices (>1kW TDP).
- Cross-Functional Collaboration: Partner with Silicon Architecture, Package Design, and System Hardware teams to co-optimize the thermal-mechanical-electrical envelope. Engage with ODMs and cooling ecosystem partners
What We're Looking For
- Experience:5+ years of industry experience in thermal and structural analysis of semiconductor packages and systems.
- Advanced Simulation Tool Mastery: Proficient in industry-standard thermal and thermo-mechanical tools, specifically Ansys Icepak and Cadence Celsius. Fluent, Star-CCM+, FLOEFD, RedHawk-SC ET
- Advanced Packaging Expertise: Proven experience modeling high-density packaging architectures, specifically TSMC CoWoS-L (with Silicon Interposers).
- Substrate & PCB Knowledge: Deep understanding of complex package substrates and heavy data center-class PCBs.
- Data Center Experience: Hands-on experience analyzing high-power GPU workloads (700W–1000W+) under both static steady-state and dynamic transient states.
- Data Visualization: Ability to extract, analyze, and present complex simulation metrics, including multi-layer thermal contours and structural warpage profiles.
Good to Have
- Package Design Capabilities: Hands-on experience designing physical package layouts and substrate routing using Cadence APD (Allegro Package Designer) or Allegro X.
- Multi-Physics Integration: Familiarity with structural analysis tools like Ansys Mechanical for deep-dive finite element analysis (FEA).