Thermal Mechanical Test Engineer, Silicon Packaging (Starlink)

Spacex

  • Wausau, WI
  • 1 day ago
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    Skills

    • Aerospace Engineeringunmatched
    • Broadbandunmatched
    • Data Analysisunmatched
    • Data Modelingunmatched
    • Electronicsunmatched
    • Finite Element Analysisunmatched
    • Government Regulationsunmatched
    • Hardware Designunmatched
    • High Reliabilityunmatched
    • IR (Infrared)unmatched
    • Instrumentationunmatched
    • Integrated Circuit Packagingunmatched
    • MATLABunmatched
    • Manufacturingunmatched
    • Material Scienceunmatched
    • Mathematicsunmatched
    • Mechanical Engineeringunmatched
    • Mechanical Testingunmatched
    • Physicsunmatched
    • Printed Circuit Board Designunmatched
    • Process Engineeringunmatched
    • Process Modelingunmatched
    • Product Developmentunmatched
    • Product Testingunmatched
    • Product/Service Launchunmatched
    • Production Supportunmatched
    • Production Volumeunmatched
    • Python Programming/Scripting Languageunmatched
    • Semiconductorsunmatched
    • Simulationunmatched
    • Test Dataunmatched
    • Test Designunmatched
    • Test Equipmentunmatched
    • Test Programunmatched
    • Testingunmatched
    • Thermal Analysisunmatched
    • United States Citizenunmatched

    Description

    SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.THERMAL MECHANICAL TEST ENGINEER, SILICON PACKAGING (STARLINK)SpaceX is leveraging its experience building rockets and spacecraft to deploy Starlink, the world's largest satellite constellation and most advanced broadband internet system. We provide reliable and fast internet to millions of users worldwide, including populations with little or no connectivity, rural communities, aircraft, watercraft, and places where existing services are unreliable, too expensive, or disconnected by natural disasters. We design, build, test, and operate all parts of the system, thousands of satellites and consumer dishes that allow users to connect within minutes of unboxing. The Starlink team is seeking out the best‑in‑class professionals to maximize Starlink's potential for communities and businesses around the globe.As a Thermal Mechanical Test Engineer for Silicon Packaging at SpaceX, you will develop and execute thermal and mechanical modeling and test programs for advanced semiconductor packaging and board‑level assemblies. You will support the silicon packaging process engineering organization by characterizing package and board thermal performance, validating mechanical robustness, and correlating simulation results with physical test data to enable high‑volume production of reliable Starlink hardware.RESPONSIBILITIESDevelop and run thermal and mechanical finite element models, and thermal simulations, to predict package and board‑level behavior under operational and environmental conditionsDevelop process models to support new production line bring‑up and investigations into packaging processesDesign, set up, and execute thermal and mechanical test campaignsPerform board‑level thermal characterization and testing to evaluate heat spreading, junction temperatures, and system‑level thermal performanceOperate and maintain thermal and mechanical test equipment, such as thermal chambers, along with instrumentation, including thermocouples and infrared camerasAnalyze test data, correlate models with empirical results, and provide actionable feedback to packaging, silicon design, and manufacturing teamsSupport new package and board designs through test planning, execution, and data reportingCollaborate cross‑functionally with packaging process engineers, hardware design teams, production operations, and quality to integrate test insights into product development and production rampBASIC QUALIFICATIONSBachelor's degree in an engineering, math, or science discipline1+ years of experience with thermal or mechanical modeling and testing in an industry or academic settingPREFERRED SKILLS AND EXPERIENCEBachelor's in mechanical engineering, materials science, aerospace engineering, physics, applied mathematics, or other STEM disciplineAdvanced degree in an engineering, math, or science disciplineExperience with board‑level thermal testing and characterization using thermocouple mapping, power dissipation testing, or infrared thermographyExperience using finite element analysis or thermal simulation tools such as ANSYS, Abaqus, COMSOL, Flotherm, or IcepakExperience with 3D and reduced‑order thermal and mechanical modelingExperience correlating simulation models with physical test dataExperience in simulation and characterization of IC packaging thermal resistance parametersProficiency in Python or MATLAB for data analysis and post‑processingBackground in semiconductor packaging or high‑reliability electronics environmentsExperience working in a fast‑paced, high‑volume manufacturing or new product introduction settingADDITIONAL REQUIREMENTSAbility to work extended hours or weekends as needed for mission critical deadlinesITAR REQUIREMENTSTo conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. * 1157, or (iv) Asylee under 8 U.S.C. * 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.Applicants wishing to view a copy of SpaceX's affirmative action plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to EEOCompliance@spacex.com.#J-18808-Ljbffr

    Numbers & Facts

    LocationWausau, WI

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