Wiresaw Process Engineer - Wafer Slicing (Diamond Wire & Slurry)

Wiresaw Process Engineer - Wafer Slicing (Remote)

Location: Remote, United States

Travel: Heavy, primarily to US customer sites, with occasional international travel

Customer regions: Texas, Arizona, California, and the East Coast

Compensation: $120,000 - $130,000 base

Most wafering engineers spend their careers tuning someone else’s wire saw. This role puts you on the builder’s side of the machine, in front of the customers who run it.

Our client, a global manufacturer of precision equipment for wafer slicing, grinding, lapping, and polishing, serves semiconductor and solar wafer producers across the US. As their Wiresaw Process Engineer, you’ll be the go-to wire slicing expert for their customers: getting new tools installed and cutting well, helping customers tune their processes, and answering the hard questions when a cut isn’t running right.

What You’ll Do

• Support new wire saw installs and startups at US customer sites, from first cuts through process qualification
• Be the customer’s technical resource for tuning: wire speed, tension, feed rate, coolant and slurry, and consumables
• Troubleshoot wafer quality issues (TTV, bow, warp, breakage, surface damage) and throughput or wire usage problems
• Run test cuts and process work that show what the equipment can do for customers and prospects
• Bring field feedback back to engineering to improve the equipment
• Document recipes, procedures, and customer findings

What You Bring

• Hands-on process engineering experience with diamond-coated wire (DCW) and/or slurry wire saws
• Wire saw experience in semiconductor wafer slicing, solar wafering, or both
• A customer-first personality: you’re comfortable on-site with customer engineers, explaining what’s happening and why
• A practical, hands-on approach to troubleshooting and process tuning
• Willingness to travel heavily to customer sites in Texas, Arizona, California, and the East Coast, with occasional international trips
• Bachelor’s degree in Engineering, Materials Science, or a related technical field, or equivalent hands-on experience

Nice to Have

• Semiconductor wafer slicing experience, including silicon or silicon carbide (SiC)
• Experience on the equipment side: applications engineering, field process support, or work at an equipment OEM
• DOE, SPC, and structured root cause analysis
• Experience with wafer metrology and process characterization

Is This You?

This role is a strong fit if you like being the person customers call when a cut isn’t running right, you enjoy being on the road and in front of people, and you want to see your process knowledge built into the equipment itself. It is not a fit if you’re looking for a fixed-site, single-fab role.