Preferred Qualifications: Technical Knowledge of Die Attach, Wire bond, Epoxy Dispense, flip Chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach, etc. Job Responsibilities: Technical Knowledge of Die Attach, Wire bond, Epoxy Dispense, flip Chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach.