Chip Packaging Architect GoogleChip Packaging ArchitectSunnyvale, CAYou will collaborate with product architects, design teams, and Signal Integrity/Power Integrity (SI/PI), thermal, mechanical, assembly, and Printed Circuit Board (PCB) engineers to create high-performance packages. As a Chip Packaging Architect on our Silicon Integration team, you will drive advanced packaging solutions (2.5D/3D/3.5D) and technologies for Machine Learning (ML) chips and custom Application-Specific Integrated Circuits (ASICs).
Packaging Design Engineer GooglePackaging Design EngineerSunnyvale, CAFrom software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. Utilize advanced Three-Dimensional/Two-Dimensional Computer-Aided Design software (SolidWorks, Artios CAD, Creo, etc.) to architect complex structural packaging solutions and generate precise technical drawings, assembly instructions, and cushion layouts.
Packaging Technical Leader CiscoPackaging Technical LeaderSan Jose, CaliforniaThe applicable full salary ranges for this position, by specific state, are listed below: New York City Metro Area: $168,800.00 - $277,400.00 Non-Metro New York state & Washington state: $148,800.00 - $248,200.00 * For quota-based sales roles on Cisco’s sales plan, the ranges provided in this posting include base pay and sales target incentive compensation combined. Minimum Qualifications: * 6+ years of progressive industry experience in Semiconductor Packaging or Photonic packaging or Assembly process development or integration, with demonstrable track record of technical leadership and successful project execution.
Process Engineer, Advanced Packaging Applied MaterialsProcess Engineer, Advanced PackagingSanta Clara, CA$124,000–$171,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
Senior Power Integrity Engineer - LPU Packaging NvidiaSenior Power Integrity Engineer - LPU PackagingSanta Clara, CAWe have some of the most forward-thinking and hardworking people in the world working with us and our product lines are growing fast in some of the hottest state of the art fields such as Artificial Intelligence, Deep Learning, Autonomous Vehicles, and Robotics. A deep understanding of board-level PDN design, including stack-up definition, plane partitioning, and VRM placement on high-layer-count accelerator boards.
Senior Signal Integrity Engineer - LPU Packaging NvidiaSenior Signal Integrity Engineer - LPU PackagingSanta Clara, CADevelop and execute simulation flows for advanced packaging technologies, including 2.5D, 3D, and multi-die integration, with strong focus on channel loss, discontinuities, return path behavior, and crosstalk. We have some of the most forward-thinking and hardworking people in the world working for us and, due to unprecedented growth, our world-class engineering teams are growing fast.
NewPackaging And Print Marketing Designer QuincePackaging And Print Marketing DesignerSan Francisco, CARemote$85,000–$110,000 / yearWorking at the intersection of creative, marketing, and operations, the designer will manage the end-to-end design process for both packaging and print marketing-from concept through final production-while partnering closely with cross-functional teams to ensure brand elevation, performance, and manufacturing viability. As Quince scales both direct mail and branded packaging, the Packaging and Print Marketing Designer will play a critical role in delivering exceptional creative across these two interconnected channels.
Packaging Engineer LancesoftPackaging EngineerFoster City, CA$70–$96.30 / hourThis position resides within the Packaging Development team, with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. Degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering, or a related scientific field.
NewSenior Pricing & Packaging Manager FastlySenior Pricing & Packaging ManagerSan Francisco, CA$143,860–$172,632 / yearFastly’s edge cloud platform enables customers to create great digital experiences quickly, securely, and reliably by processing, serving, and securing our customers’ applications as close to their end-users as possible — at the edge of the Internet. End-to-end commercialization and operationalization delivering programs from concept to launch partnering with Sales and Marketing, Legal, Finance, Business systems and others, owning every step along the way driving consensus cross-functionally.
Sr Director, Power Packaging & Module Development onsemiSr Director, Power Packaging & Module DevelopmentSan Jose, CAWith a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Products include power and signal management, logic, discrete, and custom devices for automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power applications.
Associate Creative Director, Packaging & Print The Clorox CompanyAssociate Creative Director, Packaging & PrintOakland, CA$131,200–$258,500 / yearExperience partnering with strategy and content creatives to create a consistent brand experience across all touch points, from physical and digital shelf to owned digital and social media. We serve a diverse consumer base which is why we believe teams that reflect our consumers bring fresh perspectives, drive innovation, and help us stay attuned to the world around us.
Packaging Engineer I Exelixis Inc.Packaging Engineer IAlameda, CA$75,000–$106,500 / yearESSENTIAL DUTIES/RESPONSIBILITIES: Provide on-site/remote technical support for project activities such as commercial packaging, implementation/qualification of new packaging line equipment and introduction of components changes. EDUCATION/EXPERIENCE/KNOWLEDGE & SKILLS: Education: Bachelor's degree in related discipline and a minimum of 1 year of related experience; or, Equivalent combination of education and experience.
FEA Packaging Engineer CspeedFEA Packaging EngineerPalo Alto, CaliforniaOur executive team has a demonstrated track record of building and scaling category-defining semiconductor and infrastructure businesses at companies like Broadcom, Lumentum, Tesla, Apple, Samsung, Intel, and VMware. Expert proficiency in one commercial FEA or CFD tool and working proficiency in a second covering the other domain — for example Ansys Mechanical or Abaqus alongside Icepak, Fluent, Flotherm, or Celsius.
Advanced Packaging Engineer — Fiber Array Integration CspeedAdvanced Packaging Engineer — Fiber Array IntegrationPalo Alto, CaliforniaA permanently bonded fiber array constrains the downstream flow in three respects: the engine cannot be optically qualified before fiber attach, a single failed channel scraps an assembly containing multiple high-value die, and manual fiber handling limits automation. This position owns the detachable optical interface for CspeedIO optical engines: the on-package element, the coupling optics, the alignment features, and the high-volume assembly process that joins fiber to engine without per-unit active alignment.
NewPackaging Tech Lead Design Engineer Astera LabsPackaging Tech Lead Design EngineerSan Jose, CA$185,000–$240,000 / yearAstera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
Product Assembly And Packaging Technician 034MotorsportProduct Assembly And Packaging TechnicianFremont, CaliforniaWe are looking for an enthusiastic and hard-working team member to accurately pick sub-component inventory, precisely assemble finished products and securely pack products attractively to ensure our customers receive their purchases in excellent condition. Candidates that will be successful in this role will be driven to meet our Manufacturing Department's daily goals, be professional and accountable in their role and interacting with fellow employees, be customer focused, a team player, and show up every day with a positive attitude.
Head of Consumer Electronics Packaging Engineering (Requires Relocation) Shanghai BSF Human Resources Co.Head of Consumer Electronics Packaging Engineering (Requires Relocation)San Jose, CaliforniaCommunication Skills: Experience in directly communicating with key personnel involved in Apples packaging products or engineering processes is preferred. Familiarity with Apple Products: Applicants should be well-versed in the manufacturing processes, automated machinery, and materials used in Apples packaging solutions.
Senior Mechanical Simulation Engineer – Avionics & Electronics Packaging ZiplineSenior Mechanical Simulation Engineer – Avionics & Electronics PackagingSan Francisco, CA$130,000–$180,000 / yearOur customers include the world's largest and most prominent healthcare systems, governments, retailers, restaurants and global businesses who rely on us to save lives, reduce emissions, increase economic opportunity, and provide delivery from point A to point B as fast as possible. Develop structural finite element models for electronics housings, PCB assemblies, brackets, connectors, flex circuits, fasteners, heat sinks, shields, and integrated avionics modules.
Process Engineer - Advanced Packaging Applied MaterialsProcess Engineer - Advanced PackagingSanta Clara, CA$147,000–$202,500 / yearRole Responsibilities: Design, collect data, analyze, and compile results for complex process engineering experiments across multiple process modules; apply findings to establish process baseline, monitor performance and stability. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor.
Structural, Thermal & Packaging Analyst (Semiconductor Fea) V Applied MaterialsStructural, Thermal & Packaging Analyst (Semiconductor Fea) VSanta Clara, CA$176,000–$242,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. Function as specialist for physics/scientists issues, while influencing and utilizing expertise in interfacing with external and internal customers, lead and/or develop and execute system projects, troubleshooting system problems, and defining system specifications and schedules.