Physical Attributes: Bending at Waist, Bending at Waist, Carrying, Climbing, Crouching, Dust or gases, Electrical Hazards, Feeling, Foot Controls, Fumes or Odors, Handling, Hearing, Kneeling, Lifting, Mechanical Hazards, Noise and/or vibration, Piece Work, Poor Ventilation, Pulling, Pushing, Reaching, Seeing, Slippery surfaces, Stooping, Talking {+ 1 more}. Determines cause of low yields at parametric and wafer sort test, introduces new products into production, supports product and process transfers, and continuously improves product yields and reliability.