Own end-to-end system-level architecture and seamless integration at rack-scale and tray-scale, incorporating compute nodes, high-speed networking, power distribution, advanced cooling, and software layers to achieve high-density, low-latency and high-reliability performance. Deep domain expertise in two or more of: PCIe, high-speed interconnects (e.g., NVLink equivalents), networking fabrics, memory subsystems (DRAM/HBM), flash/storage, CPUs, accelerators, or AI silicon.