Market Expansion: Identify and develop new business opportunities for SiC in advanced packaging applications — including backside cooling layers, passive interposers, and active interposers — across a range of high-growth markets such as AI accelerators and HPC, co-packaged optics and optical I/O, quantum computing systems, and AR/VR platforms (e.g., compact high-density modules, optical engines, photonic interposers, and display driver integration for headsets and smart glasses). Ecosystem Partnerships: Build executive-level relationships with leading AI chip designers (e.g., hyperscalers, GPU/ASIC OEMs), foundries (e.g., TSMC), OSATs, EDA players, photonics/CPO and optical-module suppliers, quantum hardware developers, and AR/VR OEMs and silicon teams to secure design-ins, joint development programs, and long-term supply agreements.