Process Engineer - RF Test INTELProcess Engineer - RF TestLafayette, OR$172,200–$243,000 / yearAs a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Materials Engineer, Sr Staff A-dec IncMaterials Engineer, Sr StaffNewberg, ORApplies extensive and diversified knowledge of advanced materials science and engineering techniques, procedures, and criteria to carry out complex engineering assignments toward the development of new or refined equipment, materials, processes, and new products. JOB DUTIES AND RESPONSIBILITIES: Independently applies advanced principles of materials science and processing techniques to develop innovative solutions for new product development, research and development, process engineering, manufacturing support, and quality issue resolution.
Material Sciences - Graduates - AI Training - Portland, US Prolific Academic LtdMaterial Sciences - Graduates - AI Training - Portland, USPortland, ORWe've built a unique platform that connects researchers and companies with a global pool of participants, enabling the collection of high-quality, ethically sourced human behavioural data and feedback. We're looking for Materials Science Specialists to join our Expert Network to help train and evaluate cutting-edge AI models using real scientific expertise.
Materials Scientist 4 Lam Research CorpMaterials Scientist 4Tualatin, ORThe Deposition Product Group Materials Science & Technology Group is responsible for the innovation, development, and validation of high-performance advanced materials and surface treatments for use in the challenging environmental operating conditions inside of semiconductor wafer fabrication equipment. Successful innovation requires advanced materials science and engineering knowledge, a deep problem-solving mindset, and a high aptitude for working in cross-functional teams (CFTs).
NewMaterials Development | Materials Specialist Product Development Macpower Digital Assets Edge Private LimitedMaterials Development | Materials Specialist Product DevelopmentBeaverton, OR$22–$26.67 / hourYou will manage documentation, sampling, prototyping, and technical advisement, while monitoring market trends and collaborating closely with cross-functional teams for successful commercialization. Job Summary: We are seeking a Materials Specialist to oversee the end-to-end materials creation process for internal or external product production.
Module Development Engineer - CMP Intel Corp.Module Development Engineer - CMPHillsboro, OR$133,800–$255,200 / yearMinimum Qualifications: Bachelors degree in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related Scientific STEM (Science Technology Engineering Math) field of study with 5+ years of Semiconductor Industry experience (semiconductor processing and semiconductor fabrication). Lead design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
Assistant Staff Scientist Oregon Health & Science UniversityAssistant Staff ScientistPortland, OregonKnowledge of how to operate various instrumentation and basic engineering principles for applications and troubleshooting with instrumentation (including at least a few of the following: Mechanical testing: universal testing machine (flexural strength, fracture toughness, dynamic mechanical analysis, rheology); Spectroscopic techniques (IR and UV-Vis, mass spec, GPC, HPLC); Imaging (SEM and confocal microscopy). Doctoral degree in Biomedical Sciences or related fields and a minimum of 3 years of post-doctoral work experience in a research lab with a focus on material-tissue/biofilm interactions.
NewProcess Integration Development Engineer IntelProcess Integration Development EngineerHillsboro, OregonThe ideal candidate must possess at least one of the following: Bachelor's degree in Computer/Data Science, Physics, Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Nuclear Engineering, Optics, Chemistry, or any related field (with focus on hands-on experimental research) with 4+ years of Engineering Industry experience; OR. Master's degree in Computer/Data Science, Physics, Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Nuclear Engineering, Optics, Chemistry, or any related field (with focus on hands-on experimental research) with 3+ years of Engineering Industry experience; OR.
Foveros Direct Pathfinding Integration IntelFoveros Direct Pathfinding IntegrationHillsboro, OregonJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Manage the packaging development process including packaging artwork development, concepts, prototypes, qualification testing, specification documentation, coordination with manufacturing, regulatory, logistics, and supply chain partners, vendor selection and qualification, manufacturing startup, and benchmarking.
Dry Etch module development engineer IntelDry Etch module development engineerHillsboro, Oregon$133,800–$255,200 / yearExperience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration.- You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance.
Senior Technologist, Hybrid Bonding Module IntelSenior Technologist, Hybrid Bonding ModuleHillsboro, Oregon$180,770–$255,200 / yearJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
NewNIKE, Inc. Apparel Development, Global Apparel Materials, Undergraduate Internship NikeNIKE, Inc. Apparel Development, Global Apparel Materials, Undergraduate InternshipBeaverton, OregonAs the Global Apparel Materials (GLAM) Developer Intern, you will be part of the Textiles, Trims, and Print & Pattern Teams that partner with Global Categories and Design Teams on delivering materials from concept to commercialization. Currently pursuing a bachelor’s degree in Apparel Design, Pattern Making, Merchandising, Textile Science, Materials Science or related field with a graduation date of Winter 2027 or Spring/Summer 2028.
Technology Development Foundry Engineering – Staff Yield Engineer IntelTechnology Development Foundry Engineering – Staff Yield EngineerHillsboro, OregonDevelop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM).
Technology Development Foundry Engineering - Staff Yield Engineer Intel Corp.Technology Development Foundry Engineering - Staff Yield EngineerHillsboro, OR$155,520–$255,200 / yearDevelop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM).
Application Scientist (Electron Microscopy) - Talent Community Thermo Fisher ScientificApplication Scientist (Electron Microscopy) - Talent CommunityHillsboro, OregonWe are seeking candidates with a background working with Transmission Electron Microscopes, Scanning Electron Microscopes, X-ray Photoelectron Spectrometers or Dual Beam/Focused Ion Beam Technology and are familiar in one of those scientific areas: Life Sciences (Cell and Structural Biology). The America’s NanoPort team runs a state-of-the-art Electron Microscopy Centre of Excellence, supporting account managers and external Thermo Fisher Scientific customers in the Sciences and Industry markets.
NewManager V, Physicist/Scientist Applied Materials IncManager V, Physicist/ScientistHillsboro, OR$156,000–$214,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
Module Development Engineering Manager IntelModule Development Engineering ManagerHillsboro, Oregon$133,800–$219,550 / yearJob Description: The Role and Impact: Join Intel's Module Development Engineering team as a manager, where you will lead a group of talented engineers in crafting innovative solutions for next-generation technology development in wafer processing, assembly/test, and module repair factories. - Bachelor’s degree in engineering, Materials Science, Physics, or related fields with 6+ years of experience- Master’s degree in engineering, Materials Science, Physics, or related fields with 4+ years of experience.- PhD in Optics, Physics, Engineering, Materials Science, or related fields with 2+ years of experience.
Mechanical Engineer 3 Lam Research CorpMechanical Engineer 3Tualatin, ORYou will be challenged to solve multi-disciplinary problems involving mechanical design, heat transfer, fluid dynamics, material science, electro-mechanical systems, sensors, and other areas through a combination of analysis and experimentation. Conduct detailed analysis including structural, finite element analysis (FEA), thermal, heat transfer, stress, vibrations, fluid and gas flow dynamics, and manufacturability to properly specify designs.
Customer Engagement Applications Engineer (Capres) - USA KLA CorporationCustomer Engagement Applications Engineer (Capres) - USAHillsboro, OR$102,000–$173,400 / yearEnabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world's leading technology providers to accelerate the delivery of tomorrow's electronic devices.
Customer Engagement Applications Engineer (Capres) - USA KLA CorpCustomer Engagement Applications Engineer (Capres) - USAHillsboro, OR$102,000–$173,400 / yearEnabling the movement towards advanced chip design, KLA''s Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world's leading technology providers to accelerate the delivery of tomorrow's electronic devices.