NewDry Etch module development engineer INTELDry Etch module development engineerPortland, OR$148,100–$209,100 / yearExperience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration. You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance.
NewHBI Module Development Engineer INTELHBI Module Development EngineerVernonia, OR$172,200–$243,000 / yearAs a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Material Sciences - Graduates - AI Training - Portland, US Prolific Academic LtdMaterial Sciences - Graduates - AI Training - Portland, USPortland, ORWe've built a unique platform that connects researchers and companies with a global pool of participants, enabling the collection of high-quality, ethically sourced human behavioural data and feedback. We're looking for Materials Science Specialists to join our Expert Network to help train and evaluate cutting-edge AI models using real scientific expertise.
Materials Scientist 4 Lam Research CorpMaterials Scientist 4Tualatin, ORThe Deposition Product Group Materials Science & Technology Group is responsible for the innovation, development, and validation of high-performance advanced materials and surface treatments for use in the challenging environmental operating conditions inside of semiconductor wafer fabrication equipment. Successful innovation requires advanced materials science and engineering knowledge, a deep problem-solving mindset, and a high aptitude for working in cross-functional teams (CFTs).
Assistant Staff Scientist Oregon Health & Science UniversityAssistant Staff ScientistPortland, OregonKnowledge of how to operate various instrumentation and basic engineering principles for applications and troubleshooting with instrumentation (including at least a few of the following: Mechanical testing: universal testing machine (flexural strength, fracture toughness, dynamic mechanical analysis, rheology); Spectroscopic techniques (IR and UV-Vis, mass spec, GPC, HPLC); Imaging (SEM and confocal microscopy). Doctoral degree in Biomedical Sciences or related fields and a minimum of 3 years of post-doctoral work experience in a research lab with a focus on material-tissue/biofilm interactions.
Process Integration Development Engineer Intel CorpProcess Integration Development EngineerHillsboro, OR$115,110–$219,550 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum Qualifications: The ideal candidate must possess at least one of the following: Bachelor's degree in Computer/Data Science, Physics, Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Nuclear Engineering, Optics, Chemistry, or any related field (with focus on hands-on experimental research) with 4+ years of Engineering Industry experience; OR.
Foveros Direct Pathfinding Integration Intel CorpFoveros Direct Pathfinding IntegrationHillsboro, OR$141,910–$269,100 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Manage the packaging development process including packaging artwork development, concepts, prototypes, qualification testing, specification documentation, coordination with manufacturing, regulatory, logistics, and supply chain partners, vendor selection and qualification, manufacturing startup, and benchmarking.
Lead Designer (Men s & Women s ACG Footwear Expression Materials Design) MindlanceLead Designer (Men s & Women s ACG Footwear Expression Materials Design)Beaverton, ORThey ll be focused on elevating the consumer experience by creating materials that are performance and trend-relevant for a range of products while driving an emotional connection through the use of narrative and storytelling and by pushing the edges of sustainable footwear material design. Bachelor s degree in design, art or related field; fashion design, product design, industrial design, accessory and footwear design, or textile design or related field or equivalent combination of education, experience, and training.
Postdoctoral Scholar Oregon Health & Science UniversityPostdoctoral ScholarPortland, ORExperience in two or more of the following is required: molecular biology and microbiology assays, chemical synthesis of small molecules, liquid chromatography, bioconjugation reactions, nanoparticle synthesis and characterization, drug delivery, and small animal models. We have been able to be successful in this quest thanks to a multi-disciplinary team of highly collaborative individuals, including materials scientists, clinicians, engineers, chemists and microbiologists.
Senior Technologist, Hybrid Bonding Module Intel CorpSenior Technologist, Hybrid Bonding ModuleHillsboro, OR$180,770–$255,200 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
Module Development Engineer Intel CorpModule Development EngineerHillsboro, OR$155,520–$298,440 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.
NewMaterials Development | Materials Specialist Product Development Macpower Digital Assets Edge Private LimitedMaterials Development | Materials Specialist Product DevelopmentBeaverton, OR$22–$26.67 / hourYou will manage documentation, sampling, prototyping, and technical advisement, while monitoring market trends and collaborating closely with cross-functional teams for successful commercialization. Job Summary: We are seeking a Materials Specialist to oversee the end-to-end materials creation process for internal or external product production.
Module Development Defect Inspection Engineer Intel CorpModule Development Defect Inspection EngineerHillsboro, OR$115,110–$219,550 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.
Field Applications Engineer III, IV, or V Brewer Science, Inc.Field Applications Engineer III, IV, or VPortland, Oregon$103,820–$124,583 / yearAs key technical liaisons, FAEs work directly with the fab engineers to troubleshoot issues, qualify new products, and drive adoption of company solutions through hands-on evaluations and strategic collaboration. Field Application Engineers play a critical role in bridging advanced materials development with semiconductor customer needs by providing on-site technical support, process optimization, and product integration expertise.
Senior Member of Technical Staff, Thin Films Engineer Intel CorpSenior Member of Technical Staff, Thin Films EngineerHillsboro, OR$155,520–$298,440 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.
Senior Thin Films Engineer Intel CorpSenior Thin Films EngineerHillsboro, OR$133,800–$255,200 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.
Mechanical Engineer 3 Lam Research CorpMechanical Engineer 3Tualatin, ORYou will be challenged to solve multi-disciplinary problems involving mechanical design, heat transfer, fluid dynamics, material science, electro-mechanical systems, sensors, and other areas through a combination of analysis and experimentation. Conduct detailed analysis including structural, finite element analysis (FEA), thermal, heat transfer, stress, vibrations, fluid and gas flow dynamics, and manufacturability to properly specify designs.
Application Scientist (Electron Microscopy) - Talent Community Thermo Fisher ScientificApplication Scientist (Electron Microscopy) - Talent CommunityHillsboro, OregonWe are seeking candidates with a background working with Transmission Electron Microscopes, Scanning Electron Microscopes, X-ray Photoelectron Spectrometers or Dual Beam/Focused Ion Beam Technology and are familiar in one of those scientific areas: Life Sciences (Cell and Structural Biology). The America’s NanoPort team runs a state-of-the-art Electron Microscopy Centre of Excellence, supporting account managers and external Thermo Fisher Scientific customers in the Sciences and Industry markets.
NewProduct Manager Exyte GmbHProduct ManagerPortland, ORThe Exentec team in Tualatin, OR is seeking a dynamic Product Manager for Slurry Delivery Systems to lead and evolve our flagship product line, driving innovation and scalability as we expand toward global market leadership. This position will be actively mentored by senior leadership and is designed for a high-potential leader ready to elevate their impact, sharpen their product instincts, and grow into a world-class product leader.
Staff Chemical Mechanical Planarization (CMP) Engineer Intel CorpStaff Chemical Mechanical Planarization (CMP) EngineerHillsboro, OR$133,800–$255,200 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Senior Process Integration Development Engineer Intel CorpSenior Process Integration Development EngineerHillsboro, OR$133,800–$255,200 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Working within Intel's Manufacturing Development and Customer Engineering (MDCE) organization, you will leverage industry-leading tools, collaborate across multidisciplinary teams, and tackle complex engineering challenges that advance Intel's IDM 2.0 strategy.
Technology Development Quality and Reliability Engineer Intel CorpTechnology Development Quality and Reliability EngineerHillsboro, OR$133,800–$255,200 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Intel Foundry Yield Development Engineer Intel CorpIntel Foundry Yield Development EngineerHillsboro, OR$133,800–$255,200 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Senior Member of Technical Staff (CMP) Engineer Intel CorpSenior Member of Technical Staff (CMP) EngineerHillsboro, OR$155,520–$298,440 / yearJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Director, Process Engineer - Dry Etch Intel CorpDirector, Process Engineer - Dry EtchHillsboro, OR$211,400–$298,440 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. The Dry Etch Engineer will be a strong technical contributor with expertise in plasma processing, etch equipment, process integration, metrology interpretation, and collaboration with Integration, Lithography, Thin Films, Cleans, Yield, Defect Metrology, and supplier teams to deliver modular solutions that meet technology targets.
Director, Process Engineer – Dry Etch IntelDirector, Process Engineer – Dry EtchHillsboro, OregonJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. The Dry Etch Engineer will be a strong technical contributor with expertise in plasma processing, etch equipment, process integration, metrology interpretation, and collaboration with Integration, Lithography, Thin Films, Cleans, Yield, Defect Metrology, and supplier teams to deliver modular solutions that meet technology targets.
Process Engineer I-IV HitachiProcess Engineer I-IVHillsboro, OregonThe Productivity Team supports the ramp of advanced high-volume manufacturing (HVM) etch processes through development, sustaining, troubleshooting, and customer escalation support ensuring etch module performance meets productivity, defectivity, availability, and cost-of-ownership requirements. The Demo Team supports development of advanced dry etch processes that win customer tool-of-record selections by rapidly executing process development, optimization, and DOE-driven tuning to meet customer specifications, performance targets, and device integration requirements.
Vice President, Global Footwear Design & Innovation Arc'teryx Equipment Inc.Vice President, Global Footwear Design & InnovationPortland, OR$224,000–$336,000 / yearIn addition to base pay, Arc'teryx supports people through benefits designed to sustain both work and life: Health & wellbeing - Extended health, dental, and vision coverage, including mental health support, fertility benefits, and a 24/7 Employee Assistance Program (EAP). You lead a world-class global team and partner deeply across Design, Product Management, Development, Sourcing, Manufacturing, Merchandising, and Brand to deliver footwear that redefines what's possible in the outdoors.
Senior Engineer I, Field Process ASM International NVSenior Engineer I, Field ProcessHillsboro, ORAs a Senior Engineer, Field Process, you will help expand ASMs advanced film technologies at our customers Oregon site by developing, optimizing, and transferring innovative ALD, PEALD, PECVD, Epitaxy, and LPCVD processes. Hands-on experience through internships, research, or academic projects involving processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors.
Senior Engineer I, Field Process ASMSenior Engineer I, Field ProcessHillsboro, OregonAs a Senior Engineer, Field Process, you will help expand ASM’s advanced film technologies at our customer’s Oregon site by developing, optimizing, and transferring innovative ALD, PEALD, PECVD, Epitaxy, and LPCVD processes. Hands-on experience through internships, research, or academic projects involving processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors.