Andover (CDP), MA30+ days ago
This job will have the following responsibilities:Will work NPI products that are designed and built using in house highly automated lines working with technologies such as multi-layer high density PCB designs, leading edge SMT assembly, advanced packaging magnetics assembly, thermal transfer molding, state of the art PCB processing/plating fabrication, laser marking, singulation, and test. Will be work with advanced packaging and processing strategies for system in a package device (SIP) incorporating high layer count laminate (PCB) and ceramic substrates, ferrites, flip chips, BGA’s, lead-free soldering, MSL, transfer molding and encapsulation- Experience with these materials is a plus.