Productization and cross-functional execution (15%): Partner with product, program, manufacturing, test, quality, reliability, firmware, sourcing, foundry, OSAT, contract-manufacturing, and supplier teams to manage technical risks and deliver DFM/DFT, production calibration, yield learning, cost, schedule, and volume-ramp objectives. Cross-domain co-design and integration (25%): Lead design tradeoffs across SiPh PICs, coherent DSP/ASICs, drivers and TIAs, lasers and passive optics, high-speed electrical interfaces, package/interconnect, PCB, thermal/mechanical design, and embedded control.