NewAI Engineer - Medical Imaging & Surgical Robotics PhilipsAI Engineer - Medical Imaging & Surgical RoboticsCambridge, MA$129,000–$205,000 / yearThe actual base pay offered may vary within the posted ranges depending on multiple factors including job-related knowledge/skills, experience, business needs, geographical location, and internal equity. You're the right fit if: You have a Master's degree with 2+ years of experience OR a PhD in Computer Science, Biomedical Engineering, Electrical Engineering, Robotics, Artificial Intelligence, or a related field.
Principal Engineer South Shore StaffingPrincipal EngineerWeymouth, MAThis hands-on leadership role is responsible for driving hardware, firmware, and software development from concept through production while supporting manufacturing, testing, and continuous improvement initiatives. Principal Engineer Weymouth Mass We are seeking a highly skilled Principal Electronic & Software Engineer to lead the design, development, and support of embedded electronic systems and products.
Civil Engineering Project Manager Haley WardCivil Engineering Project ManagerMaynard, MA$115,670–$149,349 / yearThe Project Manager will be responsible for planning, organizing, designing, and controlling the activities of projects to best accomplish the successful completion while operating within established schedules, budgets, and Quality Assurance/Quality Control (QA/QC) policy constraints. Relevant expertise encompasses hydraulic modeling, hydrology modeling programs, storm drainage systems, equipment selection, specification writing, cost estimation, feasibility studies, master planning, construction document development, and proficiency in AutoCAD and Civil 3D.
HPC & AI - Power & Cooling Product Manager Hewlett Packard EnterpriseHPC & AI - Power & Cooling Product ManagerAndover, MA$152,000–$349,000 / yearDefines the value proposition, target customer segments, and business case to bring innovative and disruptive power & cooling products to market aligned to HPE's HPC & AI portfolio (product configuration mix, revenue/margins, financials, market share). Responsibilities: Leads and drives the end-to-end strategy and operational product roadmap for liquid cooling and power distribution solutions (Rear Door Heat Exchangers (RDHX), ARCS rack, DLC cold plates, CDUs, PDUs, rack manifolds).
Staff Photonics Design & PDK Modeling Engineer LightmatterStaff Photonics Design & PDK Modeling EngineerBoston, MA$179,000–$219,000 / yearThe company invented the world's first 3D-stacked photonics engine, Passage, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads. If you're passionate about tackling complex challenges, making an impact, and being an expert in your craft, join our team of brilliant scientists, engineers, and accomplished industry leaders.
Integrated Photonics Design Engineer, Device Components HyperLightIntegrated Photonics Design Engineer, Device ComponentsCambridge, MA$120,000–$225,000 / yearHyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance, scalable optical components across AI/datacom infrastructure, hyperscale computing, quantum computing, sensing, and beyond. · Own the end-to-end design and delivery of high-performance, robust device components such as fiber couplers, optical taps, optical crossings, thermo-optic phase shifters, photodiodes, and high speed electro-optic modulators.
Integrated Photonics Design Engineer, CPO PDK HyperLightIntegrated Photonics Design Engineer, CPO PDKCambridge, MA$150,000–$225,000 / yearHyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance, scalable optical components across AI/datacom infrastructure, hyperscale computing, quantum computing, sensing, and beyond. Contribute to the development of design, layout and verification enablement toolsets in open source and commercial tools including GDSFactory, Cadence Virtuoso, Synopsys Optocompiler and ICV, and Siemens Calibre.
Senior Photonics Process Engineer HyperLightSenior Photonics Process EngineerCambridge, MA$125,000–$185,000 / yearAs a Senior Photonics Process Development Engineer , you will be a key player in driving the development, optimization, and scaling of fabrication processes on the TFLN platform, working closely with customers from quantum computing and other emerging applications to understand their needs and translating them practically to scalable fabrication processes. HyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance, scalable optical components across AI/datacom infrastructure, hyperscale computing, quantum computing, sensing, and more.
Embedded Software Engineer ExtropicEmbedded Software EngineerWaltham, MassachusettsThe ideal candidate should have a strong background working with heterogeneous multi-core RISC-V or ARM processors (e.g., Cortex-R5, Cortex-A53), excel in C/C++ and Python programming languages, and be comfortable developing across the entire embedded software stack—from low-level drivers to Linux user-space applications to host-side tooling. Work with heterogeneous multi-core SoCs (e.g., Cortex-R5 real-time cores and Cortex-A53 application cores), enabling inter-processor communication, synchronization, and resource sharing.
Sr Engineer, Failure Analysis Engg (Manufacturing/Quality) Analog DevicesSr Engineer, Failure Analysis Engg (Manufacturing/Quality)Wilmington, MassachusettsMust also possess the following (quantitative experience requirements not applicable to this section): Demonstrated Expertise (“DE”) performing evaluation and characterization using bench test equipment including signal generators, spectrum analyzers, oscilloscopes, and power meters controlled and automated by Python, LabView, and Zero Code GUI; DE with analog and mixed-signal ICs, MEMS sensors, IMU or automotive-grade components; DE performing mixed integrated circuit (IC) and modeling and simulation using Cadence and Avalon; DE performing failure analysis of analog and mixed signal integrated circuits by conducting fault isolation using techniques including OBIRCH, EMMI, TDR, X-Ray and Thermal Hotspot and leveraging principles of semiconductor device physics and transistor level analog circuit; and. DE performing mechanical and chemical de-processing, parallel polishing, utilizing high-resolution scanning electron microscope (SEM) and focused ion beam (FIB) and related techniques including passive voltage contrast (PVC), Energy-dispersive X-ray spectroscopy (EDX), and in-situ nanoprobing to characterize and interpret the microstructure and material properties of the semiconductor device.
Senior Engineer, Product Applications Analog DevicesSenior Engineer, Product ApplicationsWilmington, MassachusettsRequirements: Must have a Master’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering or closely related technical field (willing to accept a foreign educational equivalent) and two (2) years of experience as Apps Engr or related occupation performing h/w, s/w, & system testing, debugging & troubleshooting in the development of power, mixed signal, or electronic products as part of project team. Demonstrated Expertise (“DE”) using ADCs, DACs, amplifiers, analog and digital filters, I2C, SPI, microcontrollers, circuit design, or PCB layout; collaborating with firmware/API/GUI development teams to guide software integration; or testing PCBs to validate products and demonstrate IC performance.
IMU Design Evaluation Engineer Analog DevicesIMU Design Evaluation EngineerWilmington, MassachusettsFor positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world.
Fpga Verification Engineer ANDURIL INDUSTRIESFpga Verification EngineerWaltham, MA$166,000–$220,000 / yearThis third-party service provider provides risk-intelligence services that may include analysis of sanctions and watchlists, adverse media, public-record information, and other lawful open-source or commercial data sources. To ensure your safety and help you navigate your job search with confidence, please keep the following critical points in mind: No Financial Requests: Anduril will never solicit payment or demand personal financial details (such as banking information, credit card numbers, or social security numbers) at any stage of our hiring process.
Materials Microelectronics Engineer MIT Lincoln LaboratoryMaterials Microelectronics EngineerLexington, MA$116,400–$140,000 / yearOur system application space is equally broad, encompassing low-cost picosatellites fabricated in a silicon foundry, additive manufacturing of radiation shields for protecting electronic systems, persistent monitoring of wide areas of ocean using arrays of sensors and hydrophones, and specialized microchips to test and validate cooling solutions for highly integrated high-performance microprocessors. Our activities range from developing new approaches to materials discovery, pioneering work on specialized microelectronic process technologies, embedding electronic devices in fibers and fabrics, and creating new materials and new processes for additive manufacturing.
Associate Staff - Lead Test Engineer (Lexington, MA, US) MIT Lincoln LaboratoryAssociate Staff - Lead Test Engineer (Lexington, MA, US)Lexington, MA$116,400–$140,000 / yearExamples of recent projects include the prototyping of electronic systems and effects, hardware-in-the-loop testing of tactically relevant payloads with surrogate threat systems, developing RF subsystems for satellites, and analysis of spacecraft mission dynamics, environments, and resiliency. The final salary offered to a selected candidate will depend on various factors, including—but not limited to—the scope and responsibilities of the role, the candidate’s experience, skills and education/training, internal equity considerations and applicable legal requirements.
PCB Process Engineer - Specialist II MIT Lincoln LaboratoryPCB Process Engineer - Specialist IILexington, MA$100,600–$136,200 / yearResponsibilities may include but are not limited to solder paste jet printer programming, pick-and-place system package programming, reflow process generation and optimization, component processing including gold/tin mitigation and lead-forming, rework planning and assessment, and direct collaboration with engineering staff to solve complex assembly and repair challenges. Experience with Mycronic SMT equipment including the MY700 solder paste jet printer, the MY200 and MY300 pick-and-place systems, and the Mycronic solder paste inspection (SPI) and automated optical inspection (AOI) platforms.
Quantum Optics Technology Engineer-Technical Staff (Lexington, MA, US) MIT Lincoln LaboratoryQuantum Optics Technology Engineer-Technical Staff (Lexington, MA, US)Lexington, MA$145,200–$170,000 / yearExamples of near-term field tests include terabit-per-second direct-to-Earth small-satellite constellations, near-Earth wideband relay laser communication terminal hardware for space and ground terminal use, and next-generation beam-director prototypes that are inherently scalable to deep-space optical comm systems, and quantum state transfer across a regional quantum network testbed. Primary areas of research include the development of novel entangled-photon source technologies and quantum memory systems; novel quantum link architectures; sensitive single-photon receivers; novel modulation and coding approaches; multi-format laser-comm modems; robust and compact free-space optical beam directors; and precision beam pointing, link acquisition and tracking systems.
Embedded Systems Engineer, Humanoid Robotics FieldAIEmbedded Systems Engineer, Humanoid RoboticsBoston, MassachusettsWe bring deep experience from organizations such as DeepMind, NASA JPL, Boston Dynamics, NVIDIA, Amazon, Tesla Autopilot, Cruise, Zoox, Toyota Research Institute, and SpaceX, along with a track record of field deployments and strong performance in DARPA challenge segments. Embedded Systems Experience: Experience bringing up and customizing bare-metal and RTOS firmware, Linux kernel and device drivers, and board support packages (BSPs), across platforms such as Jetson or custom SBCs.
NewSenior Digital Integration Solutions - Field Service Engineer Eaton CorporationSenior Digital Integration Solutions - Field Service EngineerFranklin, MA$104,000–$145,000 / yearJoin Eaton's Electrical Engineering Services & Systems team and be part of a dynamic group delivering innovative solutions across the entire power system lifecycle-from design and build to long-term support. Provide applied engineering and consultation to customers in the areas of system integration, installation, start-up, maintenance, repair, training and modification of power management, control, and mission critical systems.
Nanofabrication Process Engineer MIT Lincoln LaboratoryNanofabrication Process EngineerLexington, MA$100,200–$120,000 / yearbe key unit process focal point coordinating and communicating with all affected areas, including operations, maintenance, and process integration teams, maintain and improve process capability, lot quality, and operations efficiency, define and implement statistical process control; respond to process shifts, excursions, misprocess events, and tool downs, coordinate with process integration owners and develop new unit process steps as needed, create and maintain required process procedures and documentation, work with maintenance to maintain and improve equipment performance and capability. Knowledge and experience in one or more of the following process areas is preferred: physical vapor deposition, epitaxy, atomic layer deposition, chemical vapor deposition (CVD), chemical mechanical polish (CMP), ion implantation, reactive ion etch, wet processing, thermal oxidation, lithography, silicon wafer thinning, or wafer bonding.