Formulate and tune CMP consumables and process conditions, including slurry chemistry (oxidizers, complexing agents, corrosion inhibitors, pH control, abrasives, surfactants), pads, conditioners, and post-CMP clean chemistries to meet performance and yield targets. Drive improvements in critical CMP outputs including removal rate (RR), within-wafer non-uniformity (WIWNU), across-wafer uniformity, edge performance, dishing/erosion, scratch/particle levels, residue control, and corrosion mitigation.