Engineering Technician II, Metrology ASM International NVEngineering Technician II, MetrologyPhoenix, AZThis is an ideal first step for a motivated graduate with a Bachelor's or Associate's degree, preferably in Materials Science, or equivalent experience and training, who's eager to enter the semiconductor industry and learn from top experts. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.
Ph.D. Intern - Advanced Packaging & Physical Integration MarvellPh.D. Intern - Advanced Packaging & Physical IntegrationChandler, AZThe team developed an industry-first modular RDL interposer platform that enables multi-die AI accelerator designs 2.8x larger than the largest possible single-chip implementation - integrating over 1,390mm² of silicon alongside HBM3/3E memory stacks across six redistribution layers, with shorter die-to-die interconnects and supply chain flexibility that traditional silicon interposers cannot match. The problems this team works on - signal integrity at 224G+ SerDes speeds across multi-die substrates, power delivery for XPU packages approaching 1,000W, thermal management for chiplet stacks with HBM, mechanical reliability across advanced 2.5D and 3D integration schemes - are among the most technically demanding in the semiconductor industry.
Senior Process Engineer - Lithography 5427Senior Process Engineer - Lithography 5427 Taiwan Semiconductor Manufacturing Co LtdSenior Process Engineer - Lithography 5427Senior Process Engineer - Lithography 5427Phoenix, AZMust have 1 year of experience in at least 5 of the following semiconductor photolithography tools or processes: N4 and N5 IC manufacturing process; DUV Photolithography 193nm and 248nm (ASML Twinscan Scanners); 193nm immersion multiple patterning processes including litho-etch-litho-etch (LELE) and self-aligned double patterning (SADP); JMP (statistical analysis software); ASML Yield Star; Overlay modeling, alignment, optics and focus control for semiconductor lithography; Defect Source Investigation; 6-Sigma FAB EHS (Environment, Health and Safety); or Photoresists. Must have 1 year of experience in at least 1 of the following metrology used in semiconductor processing: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR).
Senior Process Engineer 1657 Taiwan Semiconductor Manufacturing Co LtdSenior Process Engineer 1657Phoenix, AZMust have education or experience in at least 2 of the following metrology used in semiconductor processing: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR). Must have education or experience in at least 3 of the following: wafer cross section techniques; wafer fabrication processes; ion transport phenomena; dynamic random-access memory (DRAM); plasma etching; plasma simulation; semiconductor thin film deposition; Atomic Layer Deposition (ALD); 3D NAND Flash; Chemical Vapor Deposition (CVD); or Plasma Enhanced Chemical Vapor Deposition (PECVD).