Principal Feol/Mol Integration Engineer Tokyo Electron LtdPrincipal Feol/Mol Integration EngineerAlbany, NY$148,319.86–$209,424.67 / yearMaster's degree in a related science/engineering field - preferably Electrical Engineering, Materials Science/Engineering, Chemical Engineering, Mechanical Engineering, Chemistry, or Physics - with a minimum of 8 years of related semiconductor-industry engineering experience; or PhD with a minimum of 5 years' experience; or Bachelor's degree with a minimum of 10 years' experience. This is a fab-facing role: you will define and stand up new process integration routes, build out electrical test (e-test) capability from the ground up, and serve as the principal technical owner for cross-business-unit (X-BU) programs that bring TEL's tool and process portfolio together on internal test vehicles.
Product Development Engineer Ross RecruitingProduct Development EngineerAlbany, New YorkAs an Electrical Product Development Engineer , you'll lead the design and development of power electronics from initial concept through production, owning projects that directly impact product performance, manufacturability, and long-term reliability. This is a highly visible, hands-on engineering position where you'll work directly with engineering leadership while collaborating with manufacturing, operations, and cross-functional teams to bring innovative products to market.
OE Transmission Line Engineers GFT.OE Transmission Line EngineersAlbany, New YorkRemote$100,000–$140,000 / yearFull timeAs an OE Transmission Line Engineer, you will lead and oversee transmission line project designs, serving as an Owner’s Engineer in transmission line engineering for one of our major utility clients. Our team excels in providing solutions for power transmission, distribution, and renewable energy, utilizing advanced technologies and creative problem-solving to meet today’s diverse energy needs.
Sr. Quantum Integration Engineer Global FoundriesSr. Quantum Integration EngineerMalta, NY$69,000–$120,000 / yearWorking closely with modality DRIs, Quantum AME, Fab 8, and Fab 9 engineering teams, this individual helps coordinate development lots, track action items, resolve execution barriers, and ensure manufacturing readiness activities are completed. About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor manufacturer providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies.
Quantum Ion Trap Advanced Manufacturing Engineer Global FoundriesQuantum Ion Trap Advanced Manufacturing EngineerMalta, NY$98,000–$176,000 / yearGlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. The role works cross-functionally with integration, device, and design enablement teams to translate process innovations into scalable semiconductor solutions.
NewSecurity Electronics Engineer III CHA Consulting IncSecurity Electronics Engineer IIIAlbany, NY$120,000–$140,000 / yearExperience with three or more of the following system types: access control, video surveillance, communications networks, telecommunications, structured cabling, life safety technologies, PLC-based systems, intercoms, public address systems, or other electronic infrastructure. Collaborate with multidisciplinary teams including mechanical, electrical, plumbing, fire protection, architectural, technology, and project management professionals to deliver integrated building solutions.
Principal FEOL/MOL integration Engineer TELPrincipal FEOL/MOL integration EngineerAlbany, New York$148,319.86–$209,424.67 / yearMaster's degree in a related science/engineering field — preferably Electrical Engineering, Materials Science/Engineering, Chemical Engineering, Mechanical Engineering, Chemistry, or Physics — with a minimum of 8 years of related semiconductor-industry engineering experience; or PhD with a minimum of 5 years' experience; or Bachelor's degree with a minimum of 10 years' experience. This is a fab-facing role: you will define and stand up new process integration routes, build out electrical test (e-test) capability from the ground up, and serve as the principal technical owner for cross-business-unit (X-BU) programs that bring TEL's tool and process portfolio together on internal test vehicles.
Tool BOD Ramp Engineer IPS-Integrated Project ServicesTool BOD Ramp EngineerAlbany, New York$88,000–$117,000 / yearFull timeArchitecture, Engineering, Construction Management, Project Management, Program Management, LEAN Project Delivery, Strategic Master Planning, Energy Conservation Management, Project Controls, Program/Project Management, Operations/Logistics Strategy and Planning, EPCM, and augmented resourcing services. About Us: Springtide Project Services is a full-service technical consultancy providing Architectural, Engineering, Construction, Project and Program Management, and Commissioning services to advanced technology industries, including the semiconductor, mission-critical data center, renewable energy, electric vehicle, and display sectors.
Senior Sales Engineer Eaton CorporationSenior Sales EngineerClifton Park, NY$107,500–$157,500 / yearAfter making a conditional offer and running a background check, if Eaton is concerned about conviction that is directly related to the job, you will be given the chance to explain the circumstances surrounding the conviction, provide mitigating evidence, or challenge the accuracy of the background report. Please note that specific programs and options available to an employee may depend on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.
Integration & Deployment Engineer GE VernovaIntegration & Deployment EngineerSchenectady, NYRemote$85,600–$128,400 / yearGE Vernova Inc. or its affiliates (collectively or individually, “GE Vernova”) sponsor certain employee benefit plans or programs GE Vernova reserves the right to terminate, amend, suspend, replace, or modify its benefit plans and programs at any time and for any reason, in its sole discretion. Leveraging GridOS, GE Vernova’s end to end grid orchestration platform, you will help utilities transition to more flexible, resilient, and intelligent distribution networks - enabling secure, reliable operations while supporting the clean energy grid of the future.
Process Integration Engineer III - Early In Career, Doctorate (Albany, NY) Applied MaterialsProcess Integration Engineer III - Early In Career, Doctorate (Albany, NY)Albany, NY$108,000–$148,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.
Process Integration/Lithography Engineer XanaduProcess Integration/Lithography EngineerAlbany, NY$110,000–$150,000 / yearWith your deep technical expertise and strong experience in photonics fabrication process development and process integration, you will be responsible for developing process integration schemes used to build critical components of Xanadu's quantum computing hardware. Process Integration & Quantum Hardware Development: Coordinate between several internal component teams to ensure all hardware requirements are satisfied in delivered chips and circuits.
Advanced Photonics Engineer Global FoundriesAdvanced Photonics EngineerMalta, NY$166,500–$319,000 / yearThe Silicon Photonics Product Line is seeking a highly motivated and experienced photonics engineer for the Advanced Photonics team that is focused on driving the definition and realization of next-generation photonic devices and system architectures that are closely aligned with near-term customer and market needs. About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies.
Quantum TSV Integration Engineer Global FoundriesQuantum TSV Integration EngineerMalta, NY$98,000–$176,000 / yearGlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. The primary responsibility of this position is to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing.
Quantum PDK Engineer Global FoundriesQuantum PDK EngineerMalta, NY$98,000–$176,000 / yearThis position supports development of Process Design Kits (PDKs), compact models, and design enablement infrastructure that bridge advanced quantum device physics with semiconductor manufacturing and circuit design, including cryogenic control and readout ICs. The position emphasizes hands-on technical execution, automation, and strong cross-functional collaboration across device engineering, process integration, modeling, and design teams to enable scalable and high-performance quantum systems.
Principal Quantum Integration Engineer Global FoundriesPrincipal Quantum Integration EngineerMalta, NY$85,000–$146,000 / yearAbout GlobalFoundries: GlobalFoundries is a leading full-service semiconductor manufacturer providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets.
Quantum Superconducting Materials Engineer Global FoundriesQuantum Superconducting Materials EngineerMalta, NY$143,000–$247,000 / yearGlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. Required Qualifications: Education- Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
3D Heterogeneous Integration Engineer Global Foundries3D Heterogeneous Integration EngineerMalta, NY$98,000–$176,000 / yearEssential Responsibilities: Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g., multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.). Summary of Role: GlobalFoundries Fab8 is seeking an experienced and dedicated R&D engineer, joining Advanced Packaging Lab (APL) to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives spanning multiple application domains.
Quantum Superconducting Interconnect Integration Engineer Global FoundriesQuantum Superconducting Interconnect Integration EngineerMalta, NY$118,000–$210,000 / yearGlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. Education- Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate) Global Foundries3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate)Malta, NY$79,100–$145,800 / yearAdvanced packaging liaison to the DM and PDK (Process Design Kit) teams to translate packaging requirements to a device enablement specification covering: design rules, library device(TSV) layouts, layout vs schematic(LVS) requirements, device model terminals. This role will entail 3D heterogeneous integration (3DHI) design enablement to enable our next-generation advanced packaging R&D efforts, which include wafer-to-wafer bonding, die-to-wafer bonding, TSV/TOV and interposer development.