Essex Junction, VT30+ days ago
The candidate will bring a strong focus on assembly packaging inspection and characterization methods for SiPh Flip Chip packaging, including siph wafer level packaging features (v-grooves, cavities, bumps, RDL), assembly components (optical lens arrays, fibers, sockets, lids), and assembly process features (underfill fillets, chip edges). Essential Responsibilities: Develop and lead advanced inspection & characterization workflows for photonics packaging, including AOI, warpage analysis, and metrology across all assembly stages (die attach, underfill, lid attach, socket placement, fiber plug integration).