EDA Tools Hardware Engineer IntelEDA Tools Hardware EngineerHillsboro, CaliforniaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, California, Santa Clara Additional Locations: US, California, Folsom, US, Oregon, Hillsboro, US, Texas, Austin Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
EDA Design Flow Development Engineer IntelEDA Design Flow Development EngineerHillsboro, CaliforniaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, California, Santa Clara Additional Locations: US, California, Folsom, US, Oregon, Hillsboro, US, Texas, Austin Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We are seeking an experienced EDA CAD / Tool Flow Development Engineer to develop and maintain transistor-level electromigration (EM) and IR drop analysis flows for custom IPs, embedded memories, SRAMs, analog/mixed-signal interfaces, and high-performance custom macros across advanced semiconductor technologies.
Module Development Engineer IntelModule Development EngineerHillsboro, OregonJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix, US, California, Folsom, US, California, Santa Clara, US, Texas, Austin Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions.
Staff Process Engineer, Dry Etch IntelStaff Process Engineer, Dry EtchHillsboro, OregonJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. This position provides a unique platform to shape the future of Intel's semiconductor solutions while directly supporting the company's efforts to meet diverse industry needs and maintain leadership in high-volume manufacturing.
Electrical Project Engineer - Global Construction Engineering IntelElectrical Project Engineer - Global Construction EngineeringHillsboro, OregonJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Global Operations Supply Chain Engineer - Oregon Intel Corp.Global Operations Supply Chain Engineer - OregonHillsboro, OR$120,860–$231,670 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Working with factory modules and factory leadership to improve cost structures, drive performance to contracts, and identify cost savings contracting opportunities across the functional areas within the local factory.
Principal Collateral Device Engineer Intel Corp.Principal Collateral Device EngineerHillsboro, OR$224,970–$317,600 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Device Engineer Intel Corp.Device EngineerHillsboro, OR$161,550–$228,070 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Job Details: Job Description: About MDCE: Manufacturing Development and Customer Engineering (MDCE) organization serves as the bridge between advanced technology development and practical, scalable manufacturing, ensuring that innovative solutions can be successfully produced and delivered to foundry customers.
Director, Process Engineer - Dry Etch Intel Corp.Director, Process Engineer - Dry EtchHillsboro, OR$211,400–$298,440 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. The Dry Etch Engineer will be a strong technical contributor with expertise in plasma processing, etch equipment, process integration, metrology interpretation, and collaboration with Integration, Lithography, Thin Films, Cleans, Yield, Defect Metrology, and supplier teams to deliver modular solutions that meet technology targets.
Principal Engineer - Standard Cell Design IntelPrincipal Engineer - Standard Cell DesignHillsboro, California$220,920–$311,890 / yearJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, California, Santa Clara Additional Locations: US, Arizona, Phoenix, US, California, Folsom, US, Oregon, Hillsboro, US, Texas, Austin Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Director, Process Engineer – Dry Etch IntelDirector, Process Engineer – Dry EtchHillsboro, Oregon$211,400–$298,440 / yearJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. The Dry Etch Engineer will be a strong technical contributor with expertise in plasma processing, etch equipment, process integration, metrology interpretation, and collaboration with Integration, Lithography, Thin Films, Cleans, Yield, Defect Metrology, and supplier teams to deliver modular solutions that meet technology targets.
Senior Process Integration Development Engineer Intel CorpSenior Process Integration Development EngineerHillsboro, OR$133,800–$255,200 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Working within Intel's Manufacturing Development and Customer Engineering (MDCE) organization, you will leverage industry-leading tools, collaborate across multidisciplinary teams, and tackle complex engineering challenges that advance Intel's IDM 2.0 strategy.
Process Integration Development Engineer IntelProcess Integration Development EngineerHillsboro, OregonJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. D. degree with 4+ years of semiconductor industry experience OR Masters with 6+ years of semiconductor industry, process and yield engineering experience in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics, or semiconductor-related Scientific STEM (Science Technology Engineering Math) field of study.
EHS Engineer IntelEHS EngineerHillsboro, OregonWhat We're Looking For Minimum Qualifications • Bachelor's degree in Ergonomics, Industrial Hygiene, Safety Engineering, or a related science • 6+ years of hands-on experience conducting technical ergonomics, industrial hygiene, and safety assessments in a field environment Preferred Qualifications • Master's degree in Ergonomics, Industrial Hygiene, Safety Engineering, or a related science • 4+ years of experience with field assessments, technical analysis, and communicating EHS requirements to diverse stakeholders • Demonstrated experience with: o Ergonomic evaluations o Chemical exposure assessments o Job Hazard Analysis (JHA) o Process Hazard Analysis (PHA) and other advanced technical safety analyses • Background in semiconductor manufacturing, advanced manufacturing, or technology development environments • Active professional certification: Certified Professional Ergonomist (CPE), Certified Industrial Hygienist (CIH), and/or Certified Safety Professional (CSP) A successful candidate will be a technically strong, collaborative safety professional who thrives in a fast-paced, innovation-driven environment. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
Principal Engineer, Hybrid Bonding Module IntelPrincipal Engineer, Hybrid Bonding ModuleHillsboro, OregonJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Your work will directly impact Intel's ability to execute advanced packaging roadmaps by delivering state-of-the-art hybrid bonding solutions with industry-leading performance, reliability, and cost efficiency, while shaping both internal strategy and the external ecosystem.
Senior AI Algorithm Engineer in oneDNN IntelSenior AI Algorithm Engineer in oneDNNHillsboro, OregonJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, California, Santa Clara Business group: Silicon and Platform Engineering Group (SPE): Deliver breakthrough silicon and platform solutions that deliver industry-leading products today while also defining the next generation of computing experiences. This is a unique opportunity to work at the intersection of AI algorithms, low‑level performance engineering, and cutting‑edge Intel hardware, enabling state‑of‑the‑art neural network performance across CPUs, integrated graphics, and discrete GPUs.
Senior Silicon Photonics TD Reliability Engineer Intel Corp.Senior Silicon Photonics TD Reliability EngineerHillsboro, OR$141,910–$232,190 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Your new team, (SiPh TD QnR), is at the forefront of silicon photonics technology development, working closely and collaborating with the SiPh fab process integration, Integrated Photonics Solutions (IPS) R&D design team, Foundry Q&R teams and other organizations to ensure reliability for internal and external SiPh device technologies, process certification, and product qualifications.
Analog And Mixed Signal Design Engineer Intel Corp.Analog And Mixed Signal Design EngineerHillsboro, OR$164,470–$269,100 / yearPreferred Qualifications: Experience in one or more of the following areas is preferred: GPIOs, high speed parallel or serial IO links and their subcomponents (data path, TX, RX, etc.), clock distribution, clock conditioning, clock recovery circuits, voltage regulators, voltage reference circuits, ADCs/DACs, inductors, transmission lines, RF and millimeter-wave circuits, test of custom analog and mixed-signal circuits. Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
Senior AI Algorithm Engineer In Onednn Intel Corp.Senior AI Algorithm Engineer In OnednnHillsboro, OR$195,200–$275,580 / yearThis is a unique opportunity to work at the intersection of AI algorithms, low‑level performance engineering, and cutting‑edge Intel hardware, enabling state‑of‑the‑art neural network performance across CPUs, integrated graphics, and discrete GPUs. Business group: Silicon and Platform Engineering Group (SPE): Deliver breakthrough silicon and platform solutions that deliver industry-leading products today while also defining the next generation of computing experiences.
Silicon Packaging Design Engineer Intel Corp.Silicon Packaging Design EngineerHillsboro, OR$105,650–$200,340 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.