Perform engineering analysis of complex scope, in the following areas: Wafer transfer methods including robotics, friction, particle control, vacuum and end effectors, Mechanism design in assemblies such as slit valves, lift pins, indexers, Wafer temperature management (in both process and transfer environments) including cooling stations, pedestals, ESC. Requirements: Knowledge of mechanical engineering design, mechanics, and material science concepts and techniques, including proficiency in solving engineering problems using analytical techniques and engineering knowledge such as thermodynamics, heat transfer, measurement control, stress analysis, Finite Element Analysis, or system integration.