Develop and execute robust qualification plans covering front-end, back-end, and test, including wafer-level reliability testing, package qualification, high temperature operating life testing, highly accelerated stress testing, thermal cycling, electromigration testing, and full silicon test coverage validation. Assess supplier manufacturing capabilities across front-end and back-end processes, including wafer fabrication capacity, process stability, equipment suitability, process windows, yield learning, and overall technical readiness for high-volume silicon production including wafer fabrication, dicing, bumping, assembly, and packaging.