The responsibility of the Plating Operator shall be to perform all aspects of utilization of the following PCB Plating equipment and processes: Electroless Copper, Electrolytic Copper, Electrolytic Tin, Etching, Resist Stripping, Electrolytic Gold, Electroless Ni/Au (ENIG), Co-bra Bond, Hot Air Levelling Solder (HALS). Established in 1967, we are a critical solutions provider to Fortune 500 corporations, government, and targeted OEMs in a variety of industries including Semiconductor Equipment Manufacturing, Medical and Life Science, Aerospace and Defense, Industrial, Electronics, and Energy.