NewPrincipal Engineer - Advanced Packaging Innovation Micron TechnologyPrincipal Engineer - Advanced Packaging InnovationBoise, IDIn this role, you will lead innovation efforts through strategic leadership, influencing the development of packaging technologies and ensuring alignment with business objectives. The position offers a dynamic environment focused on driving technological advancements and business value.#J-18808-Ljbffr.
NewProcess Integration Engineer Advanced Packaging & 3DIC Micron TechnologyProcess Integration Engineer Advanced Packaging & 3DICBoise, IDMicron Technology, Inc in Boise, Idaho seeks a Process Integration Engineer responsible for developing and deploying advanced interconnect technologies. Micron offers comprehensive medical and dental plans, paid time-off, and additional benefits to meet our team members' needs.#J-18808-Ljbffr.
NewStaff Product Engineer, Advanced Packaging Pathfinding Micron TechnologyStaff Product Engineer, Advanced Packaging PathfindingBoise, IDIn this role, you will collaborate with teams to develop advanced packaging technology solutions, mentor team members, and manage projects across multifunctional teams. D. in a relevant engineering field, have at least 10 years of experience in the semiconductor industry, and possess strong data analysis skills.
NewPrincipal Wet Process Engineer, Advanced Packaging SwiftCruitPrincipal Wet Process Engineer, Advanced PackagingBoise, IDRole ResponsibilitiesIdentify, diagnose, and resolve assembly process-related problemsCoordinate and implement process, equipment, and material evaluation/optimization initiatives and implement changes at process stepValidate and fan out innovative processes, tools, and/or materials for new product introductionDevelop, optimize, and characterize wet chemistry processes to meet the requirements of pioneering advanced packaging productsSupport SPC/FDC/RMS/APCSupport site-to-site portabilityManage and audit material suppliers to achieve quality, cost, and risk management objectivesSupport internal and external auditsMinimum QualificationsMS in Materials Science, Chemical Engineering, Chemistry, Physics, or a related field12+ years of direct experience working as a process development engineer with an Advanced Packaging focus on DRAM, NAND, or other memory productsExcellent data collection, organization, and analysis skills with experience using Python and statistics softwareSkills and experience with material properties and characterization techniquesExperience using statistics and model-based problem solving to find solutions to problemsSkilled at crafting valid tests and Design of Experiments (DOE)Preferred QualificationsPHD in Material Science, Chemical Engineering, or Chemistry with at least 10 years specifically in Advanced Packaging within the semiconductor industrySubstantial hands‑on experience with wet chemistry development in a cleanroom environmentExperience leveraging AI and automation for data analysis and process‑improvementBenefitsMicron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. As a Principal Wet Process Engineer, you will be primarily responsible for developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management.
Packaging & Material Handling System Engineer WSP Global IncPackaging & Material Handling System EngineerID$75,600–$108,130 / yearOur Facilities and Industrial Systems teams support clients across food & beverage, consumer products, and advanced manufacturing markets by designing efficient, reliable packaging and material handling systems. WSP USA is providing the compensation range that the company in good faith believes it might pay and offer for this position, based on the successful applicant's education, experience, knowledge, skills, abilities in addition to internal equity and specific geographic location.
Senior Packaging & Material Handling Systems Engineer WSP Global IncSenior Packaging & Material Handling Systems EngineerMeridian, ID$86,100–$125,510 / yearOur Facilities and Industrial Systems teams support clients across food & beverage, consumer products, and advanced manufacturing markets by designing efficient, reliable packaging and material handling systems. WSP USA is providing the compensation range that the company in good faith believes it might pay and offer for this position, based on the successful applicant's education, experience, knowledge, skills, abilities in addition to internal equity and specific geographic location.
Principal Engineer Advanced Packaging Micron Technology IncPrincipal Engineer Advanced PackagingBoise, IDMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Principal/ Staff Engineer, Advanced Packaging Process Integration Applied Materials IncPrincipal/ Staff Engineer, Advanced Packaging Process IntegrationBoise, IDThe SMTS will operate at the intersection of technology innovation, customer roadmaps, and ecosystem collaboration, translating emerging concepts into scalable, differentiated capabilities aligned with Applied Materials' long-term strategy. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.
NewDMTS Process Integration Engineer - Advanced Packaging | Micron, Boise NanoHelpDMTS Process Integration Engineer - Advanced Packaging | Micron, BoiseBoise, IDWork Location Boise, Idaho, USAResearch Field Nanotechnology, Electronics, Materials Engineering, Electrical Engineering, Mechanical EngineeringFunding Info Industry-funded (Micron)Application Deadline RollingPosted Date July 2025Country United StatesResearcher Profile Advanced process integration expert in semiconductorsRequired Qualification MS or PhD in Engineering, Physics, Chemistry, or related fieldsRequired Experience Experience in DRAM/NAND/3DIC, hybrid bonding, integration, and yield optimizationSalary Details Competitive with US-based benefitsMicron Technology, a global leader in advanced memory and storage, is hiring a DMTS Process Integration Engineer for its Advanced Packaging Technology Development (APTD) team in Boise, Idaho. Home Vacancies DMTS Process Integration Engineer – Advanced Packaging | Micron, BoiseDMTS Process Integration Engineer – Advanced Packaging | Micron, BoiseDrive next-gen 3DIC and hybrid bonding integration in advanced memory packagingJuly 31, 2025Micron Boise is hiring a Process Integration Engineer to lead integration strategies for advanced memory packaging.
Advanced Packaging Design Staff Engineer Marvell Technology IncAdvanced Packaging Design Staff EngineerBoise, IDThe group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability, involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
NewSenior CPI & DRAM Packaging Engineer, NPI to HVM Micron TechnologySenior CPI & DRAM Packaging Engineer, NPI to HVMBoise, IDMicron Technology in Boise, Idaho, is looking for a candidate responsible for managing CPI related issues for DRAM memory products from pathfinding to NPI startup. The ideal applicant will have strong knowledge in DRAM/NAND architecture, chip-package interaction, and a proven track record in quality and reliability assessments.
NewLead Wet Process Engineer - Advanced Packaging Innovator SwiftCruitLead Wet Process Engineer - Advanced Packaging InnovatorBoise, IDThe role involves developing and optimizing processes to enhance product quality and reliability, with responsibilities rooted in assembling process improvements, cost reduction, and risk management. Micron Technology is seeking a Principal Wet Process Engineer to innovate in the Advanced Packaging Technology Development department.
NewSenior Wet Process Engineer, Advanced Packaging Micron TechnologySenior Wet Process Engineer, Advanced PackagingBoise, IDA minimum of 12 years of experience in process development related to DRAM or NAND is required, along with a strong background in data analysis and wet chemistry. This role focuses on developing and optimizing processes to improve product quality and reliability in advanced packaging.
NewPrincipal Wet Process Engineer, Advanced Packaging Micron TechnologyPrincipal Wet Process Engineer, Advanced PackagingBoise, IDRole Responsibilities: Identify, diagnose, and resolve assembly process‑related problemsCoordinate and implement process, equipment, and material evaluation/optimization initiatives and implement changes at process stepValidate and fan out innovative processes, tools, and/or materials for new product introductionDevelop, optimize, and characterize wet chemistry processes to meet the requirements of pioneering advanced packaging productsSupport SPC/FDC/RMS/APCSupport site‑to‑site portabilityManage and audit material suppliers to achieve quality, cost, and risk management objectivesSupport internal and external auditsMinimum Qualifications: BS or MS in Materials Science, Chemical Engineering, Chemistry, Physics, or a related field7-13 years of direct experience working as a process development engineer with an Advanced Packaging focus on DRAM, NAND, or other memory productsExcellent data collection, organization, and analysis skills with experience using Python and statistics softwareSkills and experience with material properties and characterization techniquesExperience using statistics and model‑based problem solving to find solutions to problemsSkilled at crafting valid tests and Design of Experiments (DOE)Preferred Qualifications: PHD in Material Science, Chemical Engineering, or Chemistry with at least 10 years specifically in Advanced Packaging within the semiconductor industrySubstantial hands‑on experience with wet chemistry development in a cleanroom environmentExperience leveraging AI and automation for data analysis and process‑improvementJob Profile(s): Semiconductor Process Engineer 4 - Semiconductor Process Engineer 5Relocation Level: TBDBenefits: Micron offers medical, dental, vision, disability, paid time‑off, paid holidays, and paid family leave. Role Summary: As a Principal Wet Process Engineer, you will be primarily responsible for developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management.
NewSenior Die Bonding Process Engineer - Packaging & Yield 1000 Micron TechnologySenior Die Bonding Process Engineer - Packaging & YieldBoise, IDThis role involves optimizing semiconductor processes to enhance quality and reliability, addressing manufacturing challenges, and leading continuous improvement initiatives. Applicants should possess a BS degree along with a minimum of 8 years of relevant experience, ideally with expertise in advanced packaging technologies.
NewStaff Equipment Development Engineer - Advanced Packaging Micron TechnologyStaff Equipment Development Engineer - Advanced PackagingBoise, IDUnderstanding of related inline/electrical/probe failure.2+ years of experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysisAbility to resolve sophisticated issues through root-cause or model-based problem solving and a focus on meeting commitmentsHands on experience with wafer / assembly tools and overlay systemsPreferred Qualifications Ph. D. in Mechanical Engineering, Chemical Engineering, Electrical Engineering, or a related technical field, or equivalent experienceKnowledge of robotics, machine logic language, or new hardware design is desirable.
NewStaff Process Engineer: Advanced Packaging Lithography Micron TechnologyStaff Process Engineer: Advanced Packaging LithographyBoise, IDThe successful candidate will have strong semiconductor photolithography experience, a relevant Master's or PhD, and a passion for driving yield improvements through structured problem-solving.#J-18808-Ljbffr. Micron Technology, Inc in Boise, Idaho is seeking a Process Engineer focused on Advanced Packaging Photolithography.
NewPrincipal Engineer, Advanced Packaging Innovation Micron TechnologyPrincipal Engineer, Advanced Packaging InnovationBoise, IDCandidates should possess over 5 years of experience in this field and a relevant degree with specific knowledge in high bandwidth memory and 3D integration strategies. A leading semiconductor firm in Boise seeks a Principal Engineer to join its Advanced Package Technology Development team.
Packaging & Material Handling System Designer WSP Global IncPackaging & Material Handling System DesignerMeridian, ID$23.85–$34.52 / hourOur Facilities and Industrial Systems teams support clients across food & beverage, consumer products, and advanced manufacturing markets by designing efficient, reliable packaging and material handling systems. This role is ideal for an experienced designer who brings strong technical expertise, leadership capability, and the ability to deliver high-quality packaging system designs from concept through construction.
Senior Packaging & Material Handling Systems Designer WSP Global IncSenior Packaging & Material Handling Systems DesignerMeridian, ID$35.15–$51.25 / hourOur Facilities and Industrial Systems teams support clients across food & beverage, consumer products, and advanced manufacturing markets by designing efficient, reliable packaging and material handling systems. This role is ideal for an experienced designer who brings strong technical expertise, leadership capability, and the ability to deliver high-quality packaging system designs from concept through construction.
Principal Thin Films Engineer, Advanced Packaging MicronPrincipal Thin Films Engineer, Advanced PackagingBoise, IdahoWe offer a highly collaborative and innovative atmosphere, allowing you to interact with various groups including process integration, electrical failure analysis, yield enhancement, manufacturing, and various semiconductor equipment manufacturers. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Sr RDA Engineer, Advanced Packaging MicronSr RDA Engineer, Advanced PackagingBoise, IdahoBy collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information.
Staff Equipment Development Engineer - Advanced Packaging MicronStaff Equipment Development Engineer - Advanced PackagingBoise, IdahoMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will develop and optimize next-generation, first-of-a-kind (FAOK) wafer and die equipment.
Process Technician, Advanced Packaging Micron Technology IncProcess Technician, Advanced PackagingBoise, IDBy collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron''s leadership in the industry. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Equipment Technician, Advanced Packaging Micron Technology IncEquipment Technician, Advanced PackagingBoise, IDAs an Equipment Technician, some of your job duties may require physical activity, including but not limited to: Standing and walking for long periods of time, stooping, crouching, kneeling, or crawling on uneven terrain, working in confined spaces, and using hand tools with arms raised above head level. As an Equipment Technician, you will be responsible for monitoring, sustaining, and improving the equipment in our assigned area while working in partnership with Shift Operations team members, area equipment engineers, and tool vendors!
Manufacturing Process Technician Advanced Packaging Micron Technology IncManufacturing Process Technician Advanced PackagingBoise, IDBy collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information.
Packaging Associate I - String Pack Department Lactalis American Group, Inc.Packaging Associate I - String Pack DepartmentNAMPA, IDIn the US, we proudly offer an unrivaled house of beloved brands, including Galbani® Italian cheeses and ricotta, Président® specialty cheeses and butters, Kraft® natural and grated cheeses, Breakstone's® cottage cheese, Cracker Barrel®, Black Diamond® cheddar, and Parmalat® milk. Our yogurt portfolio includes siggi's®, Stonyfield Organic®, Brown Cow, Oui®, Yoplait®, Go-Gurt®, ratio®, Green Mountain Creamery®, and Mountain High®, along with a growing family of ethnic favorites like Karoun®, Gopi®, and Arz®.
Product Marketing Manager - Pricing and Packaging Relativity ODA LLCProduct Marketing Manager - Pricing and PackagingID$106,000–$158,000 / yearPreferred qualifications Understanding of the e-Discovery industry Experience in strategy consulting Demonstrated ability to work effectively cross-functionally and with executive leadership Minimum qualifications 3+ years in a product marketing or strategy role at a SaaS company, or experience in consulting Strong analytical and communication skills Relativity is committed to competitive, fair, and equitable compensation practices. Posting Type Hybrid Job Overview The Product Marketing Manager - Pricing & Packaging is responsible for developing pricing and packaging strategies and business case development required to support pricing decisions for existing products and new product launches, including generative AI-powered initiatives.
NewSenior Product Development Engineer, DRAM CPI & Packaging Micron TechnologySenior Product Development Engineer, DRAM CPI & PackagingBoise, IDYou will be responsible for CPI related issues for Micron's DRAM memory products and establish package program plans for new fab technology. You must understand chip-package interaction and have experience in electrical data analysis related to DRAM/NAND devices.#J-18808-Ljbffr.
NewStaff Process Engineer - APTD Bonding & Advanced Packaging Micron TechnologyStaff Process Engineer - APTD Bonding & Advanced PackagingBoise, IDIn this role, you will improve product quality and reliability by developing and optimizing processes, resolving manufacturing line problems, and implementing changes effectively. The ideal candidate has a BS in a relevant STEM field and at least 5 years of industry experience.
NewSenior Equipment Development Engineer, Advanced Packaging Micron TechnologySenior Equipment Development Engineer, Advanced PackagingBoise, IDMicron Technology, Inc in Boise, Idaho, is seeking a Staff Equipment Development Engineer to lead the development of next-generation wafer and die equipment. You'll be responsible for creating strategies for equipment optimization, collaborating with process teams, and conducting comprehensive analyses.
Process Technician, Advanced Packaging MicronProcess Technician, Advanced PackagingBoise, IdahoBy collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Equipment Technician, Advanced Packaging MicronEquipment Technician, Advanced PackagingBoise, IdahoAs an Equipment Technician, some of your job duties may require physical activity, including but not limited to: Standing and walking for long periods of time, stooping, crouching, kneeling, or crawling on uneven terrain, working in confined spaces, and using hand tools with arms raised above head level. As an Equipment Technician, you will be responsible for monitoring, sustaining, and improving the equipment in our assigned area while working in partnership with Shift Operations team members, area equipment engineers, and tool vendors!
Packaging Operator - Whey Lactalis American Group, Inc.Packaging Operator - WheyNAMPA, IDIn the US, we proudly offer an unrivaled house of beloved brands, including Galbani Italian cheeses and ricotta, Président specialty cheeses and butters, Kraft natural and grated cheeses, Breakstone's cottage cheese, Cracker Barrel, Black Diamond cheddar, and Parmalat milk. Our yogurt portfolio includes siggi's, Stonyfield Organic, Brown Cow, Oui, Yoplait, Go-Gurt, ratio, Green Mountain Creamery, and Mountain High, along with a growing family of ethnic favorites like Karoun, Gopi, and Arz.
NewPackaging Associate (Heavy Lifting)-Mozzarella Pack Lactalis American Group, Inc.Packaging Associate (Heavy Lifting)-Mozzarella PackNAMPA, IDIn the US, we proudly offer an unrivaled house of beloved brands, including Galbani Italian cheeses and ricotta, Président specialty cheeses and butter s, Kraft natural and grated cheeses, Breakstone's cottage cheese, Cracker Barrel, Black Diamond cheddar, and Parmalat milk. Our yogurt portfolio includes siggi's, Stonyfield Organic, Brown Cow, Oui, Yoplait, Go-Gurt, ratio, Green Mountain Creamery, and Mountain High, along with a growing family of ethnic favorites like Karoun, Gopi, and Arz.
NewElectromechanical Packaging Lead - Simulation & Design Schweitzer Engineering LaboratoriesElectromechanical Packaging Lead - Simulation & DesignBoise, IDSchweitzer Engineering Laboratories, Inc. is hiring a Lead Mechanical Engineer to join their team in Pullman, WA or consider candidates from Boise, ID. Candidates should have a B.S. in Mechanical Engineering, 6+ years in electromechanical design, and a strong grasp of simulation methods.
NewPackage Architect Advanced Packaging & System Exploration 1000 Micron TechnologyPackage Architect Advanced Packaging & System ExplorationBoise, ID$177,000–$387,000 / year1000 Micron Technology, Inc. in Boise, ID is seeking an experienced engineer to define and explore advanced package architectures for next-gen memory systems. The position offers a competitive salary range of $177,000 - $387,000, along with comprehensive benefits that include medical, dental, vision plans, and paid time-off.#J-18808-Ljbffr.
Senior Director, Pricing & Packaging Gainsight, Inc.Senior Director, Pricing & PackagingID$215,000–$230,000 / yearThis is a great opportunity for someone who thrives in a highly strategic, data-driven SaaS environment and enjoys working cross-functionally with teams like Product, Sales, Finance, Marketing, and Customer Success. In this role, you'll play a key role in driving Gainsight's monetization strategy and long-term revenue growth by leading the evolution of pricing and packaging across its product portfolio, including the transition to usage- and value-based models.
Director, Advanced Packaging Disruptive Technology (Based in Singapore) Applied Materials IncDirector, Advanced Packaging Disruptive Technology (Based in Singapore)Boise, IDThe Director will build and lead a high-impact team focused on exploratory, pre-product technologies, developing solutions such as D2W, RDL, CoWoS, TSV, etc and connecting emerging technology inflections to customer and market roadmaps. Based in Singapore, this role is responsible for defining and driving pathfinding strategy for N+2 and beyond advanced packaging technologies, leading disruptive innovation that shapes future integration architectures and unlocks new value creation opportunities.
NewPackage Architect - Advanced Packaging & System Exploration Micron TechnologyPackage Architect - Advanced Packaging & System ExplorationBoise, ID$177,000–$387,000 / yearResponsibilities Define and explore advanced package architectures for future memory systemsPerform package‑level trade‑off studies across SI, PI, thermals, cost, and scalabilityCreate hands‑on package designs and models for early feasibility analysisRun SI/PI and thermal simulations and translate results into architecture guidanceDefine package requirements and act as extension architecture and engineeringMinimum Qualifications Bachelor's degree or equivalent practical experience in EE, ME, Materials, or related field10+ years of hands‑on experience in package design or package‑level simulationStrong experience with package SI modeling and analysisAbility to independently build models and drive conclusionsPreferred Qualifications Master's degree in a related technical fieldExperience supporting architecture or pre‑silicon exploration teamsFamiliarity with system‑level co‑design across silicon, package, and boardExperience with multi‑die or heterogeneous integrationJob Profile(s) Systems Design Engineering SMTS – Systems Design Engineering SMTSCompensation US base salary range: $177,000.00 – $387,000.00 a year. Additional compensation may include benefits, bonuses, and equity.
NewSenior Package Architect - Advanced Packaging & Systems Micron TechnologySenior Package Architect - Advanced Packaging & SystemsBoise, ID$177,000–$387,000 / yearThe offered salary range is between $177,000 and $387,000 annually, in addition to potential benefits and bonuses, reinforcing Micron's commitment to diversity and inclusion in the workplace.#J-18808-Ljbffr. The role involves defining advanced package architectures and conducting trade-off studies for future memory systems.
NewSenior Process Integration Lead, Advanced Packaging Micron TechnologySenior Process Integration Lead, Advanced PackagingBoise, IDA global technology leader is seeking a Process Integration Lead to drive innovation in advanced packaging technologies in Boise, Idaho. The ideal candidate will exhibit strong leadership skills, sound engineering judgment, and a passion for cost efficiency.
Sales Representative - Packaging Veritiv CorpSales Representative - PackagingIDJob Purpose: Our Sales Representative will be responsible for developing and executing the sales strategy for selling Veritiv products and services within a designated geography or industry. • Develop and implement a customer contact plan to communicate product launches and engage the potential customers in relevant sales campaigns to build new relationships.
Package Architect – Advanced Packaging & System Exploration MicronPackage Architect – Advanced Packaging & System ExplorationBoise, IdahoFraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Warehousing Lead Solutions Design Engineer (remote) Ryder System IncWarehousing Lead Solutions Design Engineer (remote)Boise, IDRemoteWarehouse Design:Extensive knowledge of Warehouse Management operations, data analytics, Industrial Engineering, warehouse types (ambient, temp control, warehouse layout/ design and Lean methodsRequired knowledge of material handling solutions and automation types such as: powered industrial truck (PIT) applications; racking and other storage solution designs, packaging equipment; conveyor and sortation equipment; and other automation solutions (e.gAS/RS)Warehouse Design Tools e.g. Transportation Design:Extensive knowledge of Dedicated Services and Managed Transportation NetworksRequired knowledge of all available equipment types such as; dry van, temperature control, flat bed, other specialized equipmentTransportation Design Tools ie; JDA, Appian, Network Design Tools ie; Llamasoft, Transportation Management Systems ie; JDA, OTM,, Mapping Software ie; Tableau expert required.