27 Results for

Packaging Jobs in Casa Grande, AZ

Jobs

Tempe, AZ30+ days ago

$180,000–$220,000

In this role, you would lead all aspects of microelectronics packaging development, working closely with RFIC, MMIC, and module design teams to create advanced packaging solutions for devices ranging from ICs and System-in-Package (SiP) designs to complex modules and sub-assemblies. Summary: This position would place you as the key Microelectronics Packaging Engineer on a talented space electronics engineering team, responsible for developing next-generation packaging solutions for advanced RF communications products supporting cutting-edge space systems.

Tempe, Arizona30+ days ago

$155,500–$246,000 Per Year

The packaging development process includes package definition, stack-up, substrate layout, bond diagram, drawings, predictive modeling combined with system testing, technical risk/cost assessment, materials and process characterization, compilation of formal documentation, collaborating with sub-contractors and internal assembly and reliability resources, and final release of product. For specific work locations within San Jose, the San Francisco Bay area and New York City metropolitan area, the base pay range for this role is $193,500.00- $290,500.00/ annually : At Viasat, we consider many factors when it comes to compensation, including the scope of the position as well as your background and experience.

Chandler, Arizona11 days ago

Job Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: US, Oregon, HillsboroBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Technical knowledge and firsthand experience are critical for effective integration of cross functional efforts including Assembly Process technology, Package assembly Design Technology, design services, statistical model-based analysis and Yield and package reliability analysis.

Chandler, Arizona24 days ago

The Company’s three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles. Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.

Chandler, AZ23 days ago

$142,000–$214,000 Per Year

The Company's three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles. Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.

Chandler, AZ30+ days ago

$115,110–$219,550 Per Year

Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. The candidate should also exhibit the following behavioral traits and/or skills: Technical problem-solving, strong presentation and communication skills, fast-learning skills and solid expertise in their technical field, willingness to collaborate effectively as a team player across multiple teams.

Chandler, AZ30+ days ago

$105,650–$200,340 Per Year

Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Chandler, Arizona25 days ago

Job Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Chandler, AZ24 days ago

$105,650–$149,150 Per Year

Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Chandler, AZ24 days ago

$133,800–$188,890 Per Year

Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Current and future Metrology Engineers are expected to develop strong technical capabilities in the following areas: Operating, programming, troubleshooting, and optimizing automated inspection equipment, including hands-on interaction with hardware components such as lighting systems, cameras, transducers, robotic systems, and conveyors.

Chandler, AZ30+ days ago

$220,320–$311,040 Per Year

Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.

Chandler, AZ30+ days ago

Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. The TD team works at the intersection of design, materials, and manufacturing to translate architectural requirements into manufacturable and scalable package solutions, including 2.5D/3D integration, chiplet-based architectures, co-packaged optics (CPO), and advanced substrates.

Chandler, AZ30+ days ago

$160,980–$311,040 Per Year

Chandler, AZ30+ days ago

$133,800–$255,200 Per Year

Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum Qualifications and Experience: Candidate must possess a Masters degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry/Physics or related field and 5+ years of experience.

Chandler, Arizona17 days ago

Job Type: Experienced HireShift: Shift 4 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. This role is responsible for supporting lot movement through the manufacturing line, responding to process excursions, recovering from equipment errors, dispositioning lots, enabling new tools, and performing other operational activities required to support factory objectives.

Chandler, AZ30+ days ago

In addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

Chandler, AZ30+ days ago

In addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 3+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 2+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

Chandler, AZ30+ days ago

As an Advanced Packaging Design engineer, responsibilities include understanding of substrate or PCB design tools such as APD or Xpedition to generate advanced packaging solutions, along with knowledge of floor-planning and architectural considerations surrounding the routing of various interfaces through package substrates and interposers. The ideal candidate will possess a bachelor's degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or master's degree and/or PhD in Electrical Engineering with 3+ years of professional experience.

New!

Chandler, Arizona6 days ago

Chandler, Arizona12 days ago

Job Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: US, California, Folsom, US, California, Santa Clara, US, Colorado, Fort Collins, US, Massachusetts, Beaver Brook, US, New Mexico, Albuquerque, US, Oregon, Hillsboro, US, Texas, Austin, US, Washington, Multiple CitiesBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).

New!

Chandler, Arizona6 days ago

Job Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: US, California, Santa Clara, US, Oregon, HillsboroBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience OR- Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience OR- PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience.

Coolidge, AZ17 days ago

While performing the duties of this job, the employee is frequently required to remain in a stationary position, move and/or position oneself, communicate, operate and/or prepare, place, position objects, tools, or controls. As a Packaging Specialist, you are responsible accurately weighing, packing, and labeling cannabis flower, infused edibles, and cannabis extracts for shipment to retail dispensaries.

Casa Grande, AZ30+ days ago

In the US, we offer an unrivaled house of beloved brands, including Galbani Italian cheeses and ricotta, Président specialty cheeses and butters, Kraft natural and grated cheeses, Breakstones cottage cheese, Cracker Barrel, Black Diamond cheddar, and Parmalat milk. Our yogurt portfolio includes siggis, Stonyfield Organic, Brown Cow, Oui, Yoplait, Go-Gurt, ratio, Green Mountain Creamery, and Mountain High, along with sour cream and a growing family of ethnic favorites like Karoun, Gopi, and Arz.

Chandler, Arizona19 days ago

Job Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. This is a hands-on position that requires extensive work with supplier teams (through F2F meetings with local reps, phone/Teams meetings, and international travel to supplier factories), internal integration teams, and process module engineering teams to achieve new capacity qualification and ramp production on-time.

Chandler, Arizona10 days ago

We’re currently hiring Packaging Line Operators and Team Members who are excited to grow with us, thrive in a collaborative environment, and take pride in producing products that make a difference in people’s lives. Set up, operate, and monitor packaging machinery (bottle fillers, cappers, labelers, sealers, pouch fillers, etc.).

Chandler, AZ30+ days ago

Primary Focus: • Advanced semiconductor packaging technologies beyond conventional approaches • 3D packaging innovations and chiplet integration • High-performance computing packaging for data centers and AI applications • Heterogeneous integration across diverse chip technologies • Scaling packaging density while enhancing thermal and electrical performance. Test Module Development Engineer responsibilities include but are not limited to: • Executes test technology development and enablement for high-mix, low-volume testing and future technologies, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.

Chandler, Arizona17 days ago

Job Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. PhD in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, Chemical Engineering, or a related technical field; OR a Master's degree in one of these disciplines with 2+ years of experience in thermal engineering, thermal sciences, or a related field.

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Packaging Jobs in Casa Grande, AZ

Senior Packaging Engineer (Microelectronics) Kforce Inc.

RF/Microelectronics Packaging Engineer Viasat, Inc.

Assembly Packaging Technical Integrator - Intel Foundry Services MAG Intel

Packaging Process Engineer – Microdisplay Snap

Packaging Process Engineer - Microdisplay Snap Inc

Packaging Module Development Engineer Intel Corp

Silicon Packaging Design Engineer Intel Corp

Mechanical Design Engineer – Semiconductor Packaging Intel

Mechanical Design Engineer - Semiconductor Packaging Intel Corp

Packaging Module Equipment Development Engineer Intel Corp

Foundry Services Advanced Packaging Account Technical Solutions Engineer Intel Corp

Senior Staff Engineer, Advanced Packaging Technology Development (TD) Marvell Technology Inc

Senior Technical Solutions Engineer - Advanced Packaging Intel Corp

Senior Yield Engineer - Substrate & Advanced Packaging Intel Corp

Advanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift) Intel

Advanced Packaging SI/PI Senior Staff Engineer Marvell Technology Inc

Advanced Packaging SI/PI Staff Engineer Marvell Technology Inc

Advanced Packaging Design Marvell Technology Inc

Packaging Module Engineer Intel

ADCE Packaging Design Architect Intel

Silicon Packaging Engineering Manager Intel

Packaging Specialist Verano Holdings Corp

Packaging Machine Operator - Food Manufacturing Lactalis American Group, Inc.

Advanced Packaging Supplier Technology Development Program Manager Intel

Packaging Associate Gummi World

Test Module Development Engineer Intel Corp

Thermal data Analysis Engineer Intel

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