As a Silicon spin Interposer Process Integration Engineer, you will be responsible for integrating, optimizing, and sustaining end‑to‑end process flows required to manufacture superconducting interposers and advanced wafer‑level components in support of IBM's silicon spin quantum computing efforts. This role is highly cross‑functional, requiring stronger hands‑on engagement with deposition, etch, lithography, bonding, and finishing technologies, along with the ability to characterize and model complex process flows for performance, yield, and throughput.