Process Metallurgy & Chemistry: Understanding the manufacturing nuances of electronic materials, such as solder joint fatigue validation (due to thermal cycling/vibration stress), underfill/staking applications, and conformal coating/potting processing to mitigate tin whiskers and withstand vacuum outgassing. Key responsibilities include technical execution across the full product lifecycle, encompassing requirements definition, electrical-mechanical space trade studies, radiation-mitigation packaging, material selection (vacuum compatibility/outgassing), design documentation, and rigorous space environments testing.