43 Results for

Packaging Jobs in Gresham, OR

Jobs

Packaging Helper Madden Industrial Craftsmen

Tualatin, OR

$20–$21 / hour
Quick Apply

Help with Stacking and Packaging – this is a GREAT starting point for anyone wanting to learn new skills, and offers a fast-track plan with on-the-job training! Madden Industrial Craftsmen is looking for someone interested in starting a career or continuing training with industrial operations for a heat treating client in Tualatin, OR.

Today

Staff Product Engineer, Tray & Packaging Marmon Holdings, Inc

Hillsboro, OR

The Staff Product Engineer, Tray & Packaging develops, designs, and tests sterile and non-sterile packaging solutions that protect Acumed products during transport, storage, and surgery. This role leads technical activities from research and concept development through specifications, testing, validation, and implementation, while supporting existing packaging solutions and continuous improvement efforts.

9 days ago

Staff Product Engineer, Tray & Packaging Marmon Holdings Inc

Hillsboro, OR

9 days ago

Packaging Engineer International Flavors & Fragrances

Clackamas, OR

The Packaging Engineer will provide technical leadership for finished format packaging operations, including oversight of equipment, packaging materials, and inputs to contract manufacturing partners. Define and maintain critical material specifications (e.g., coefficient of friction, seal strength, thickness tolerance, heat resistance) to ensure consistent line performance.

3 days ago

Quantum Packaging Signal/Power Integrity (SI/PI) Engineer Intel

Hillsboro, Oregon

$141,910–$200,340 / year

Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing- Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers.

14 days ago

Quantum Packaging Signal/Power Integrity (Si/Pi) Engineer Intel Corp.

Hillsboro, OR

$141,910–$200,340 / year

We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors.

15 days ago

Packaging Module Development Engineer Intel

Hillsboro, Oregon

$115,110–$219,550 / year

Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure materials technology, quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods. Job Description: We are seeking a highly motivated, self-driven individual to join Materials Technology Development (MTD), bringing a strong technical background and a demonstrated ability to collaborate effectively across cross-functional teams to drive materials technology development for advanced packaging.

7 days ago

Staff Product Engineer, Tray & Packaging Marmon Holdings

Hillsboro, Oregon

10 days ago

Silicon Packaging Design Engineer Intel Corp.

Hillsboro, OR

$105,650–$200,340 / year

Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

30+ days ago

Quantum Packaging Thermal Architect Intel

Hillsboro, Oregon

$141,910–$200,340 / year

We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.

14 days ago

Senior System And Manufacturing Codesign Architect - Power, Thermal And Packaging Nvidia

Hillsboro, OR

What you'll be doing: Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do. System-Manufacturing Co-Design: Drive improvements in product performance, performance-per-watt, and provisioning efficiency through system-manufacturing co-design, with the scope to follow the work wherever the highest-impact opportunities lead, whether that's power, thermal, or adjacent domains.

19 days ago

Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging NVIDIA

Hillsboro, California

System-Manufacturing Co-Design: Drive improvements in product performance, performance-per-watt, and provisioning efficiency through system-manufacturing co-design, with the scope to follow the work wherever the highest-impact opportunities lead, whether that's power, thermal, or adjacent domains. You wouldn't be maintaining existing solutions, you'd be identifying where physical constraints will erode NVIDIA's competitive edge before anyone else sees it coming, then building the cross-domain responses that ensure the next generation leapfrogs those limits entirely.

16 days ago

Foundry Advanced Packaging Customer Engineer Intel Corp.

Hillsboro, OR

$220,320–$311,040 / year

As a Foundry Platform Product Manager Advanced Packaging Customer Engineer, you will play a pivotal role in driving the development, launch, and management of cutting-edge semiconductor technologies and services. Your day-to-day responsibilities will include collaborating with cross-functional teams to define product strategies, aligning with market trends, and ensuring innovative solutions meet customer needs.

24 days ago

Senior Advanced Packaging Defect Inspection Engineer Intel Corp.

Hillsboro, OR

$115,110–$219,550 / year

Remain current on relevant industry process, materials, and metrology trends - developing a forward-looking view of future technology needs and partnering with the vendor ecosystem to build a cost-sensitive, capability-driven roadmap that pushes the industry forward. This is a role that demands technical depth, industry awareness, and the ability to lead with influence across a wide range of partners - from process integration and module engineering to advanced process control, AI and automation, and senior program leadership.

14 days ago

Principal Project Engineer Packaging & Device Assembly (US) Genentech

Hillsboro, Oregon

You possess a Bachelor’s Degree in Mechanical Engineering, Chemical Engineering, or a related discipline with 8+ of experience, or a Master’s Degree with 6+ years of experience in device assembly or finished goods packaging equipment; an MS in Engineering and/or an MBA is preferred. This role is an integral part of our Equipment Engineering team, dedicated to delivering cutting-edge solutions for Device Assembly and Finished Goods Packaging systems that ensure safe, efficient, and compliant pharmaceutical manufacturing.

4 days ago

Semiconductor Packaging Integration Research Manager Intel Corp

Portland, OR

$220,920–$311,890 / year

The manager guides exploratory concepts from research to pathfinding through feasibility demonstration, prototype learning, technology readiness assessment, and transfer to development or manufacturing teams, while partnering closely with device, design, process, materials, reliability, modeling, test, manufacturing, university, supplier, and foundry ecosystem partners. Strong understanding of package-system integration, chiplet architectures, advanced interconnects, substrates, interposers, assembly materials, wafer-level processes, thermal-mechanical behavior, power delivery, signal integrity, reliability, and manufacturability trade-offs.

27 days ago

Advanced Packaging Metrology Engineering Manager Intel

Hillsboro, Oregon

$155,520–$255,200 / year

Bachelor’s degree in science, engineering, or a related STEM field with 6+ years of relevant experience; OR Master's degree in a related STEM field with 4+ years of relevant experience; OR PhD in a related STEM field with 4+ years of relevant experience. We are seeking a visionary and technically accomplished Advanced Packaging Metrology Engineering Manager to lead a high-performing team of engineers at the cutting edge of advanced semiconductor packaging.

8 days ago

ADCE Packaging Design Architect Intel Corp

Hillsboro, OR

$220,920–$311,890 / year

Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).

30+ days ago

Adce Packaging Design Architect Intel Corp.

Hillsboro, OR

$220,920–$311,890 / year

Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx). Additional Locations: US, California, Folsom, US, California, Santa Clara, US, Colorado, Fort Collins, US, Massachusetts, Beaver Brook, US, New Mexico, Albuquerque, US, Oregon, Hillsboro, US, Texas, Austin, US, Washington, Multiple Cities.

28 days ago

Packaging Assistant Lets Work LLC

Hillsboro, OR

$17–$19 / hour
Quick Apply

If you meet the qualifications and are interested in joining our team as a Packaging Assistant, please submit your resume and OLCC marijuana license for consideration. The Packaging Assistant will work closely with the production team to support the efficient operation of the facility.

30+ days ago

Resume Resources

Free Resume Templates Free Resume Builder

See More Jobs

Browse All Packaging Locations

Browse Jobs Near Gresham, OR

Get noticed by top employers!

Upload your resume to let employers know you're open to Packaging job opportunities. Plus, receive relevant job recommendations in your inbox.

Create A Free Account

Packaging Jobs in Gresham, OR

Packaging Helper Madden Industrial Craftsmen

Staff Product Engineer, Tray & Packaging Marmon Holdings, Inc

Staff Product Engineer, Tray & Packaging Marmon Holdings Inc

Packaging Engineer International Flavors & Fragrances

Quantum Packaging Signal/Power Integrity (SI/PI) Engineer Intel

Quantum Packaging Signal/Power Integrity (Si/Pi) Engineer Intel Corp.

Packaging Module Development Engineer Intel

Staff Product Engineer, Tray & Packaging Marmon Holdings

Silicon Packaging Design Engineer Intel Corp.

Quantum Packaging Thermal Architect Intel

Senior System And Manufacturing Codesign Architect - Power, Thermal And Packaging Nvidia

Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging NVIDIA

Foundry Advanced Packaging Customer Engineer Intel Corp.

Senior Advanced Packaging Defect Inspection Engineer Intel Corp.

Principal Project Engineer Packaging & Device Assembly (US) Genentech

Semiconductor Packaging Integration Research Manager Intel Corp

Advanced Packaging Metrology Engineering Manager Intel

ADCE Packaging Design Architect Intel Corp

Adce Packaging Design Architect Intel Corp.

Packaging Assistant Lets Work LLC

Resume Resources

Similar Job Searches

See More Jobs