Packaging Engineer I Basic American FoodsPackaging Engineer IBlackfoot, IDRemote$80,000–$87,000 / yearAs part of R&D, the Packaging Engineer I works with Product Development, Operations, Engineering, Procurement, Quality, Regulatory, Marketing, packaging suppliers, and external manufacturing partners to help ensure packaging solutions meet food safety, quality, cost, manufacturability, and customer requirements. Ideal candidates are located near our Blackfoot, Idaho facility, but a fully remote role may be considered for applicants living in metro areas within easy traveling distance to southeast Idaho, such as Boise or Salt Lake City.
NewStaff Product Engineer, Advanced Packaging Pathfinding Micron TechnologyStaff Product Engineer, Advanced Packaging PathfindingBoise, IDIn this role, you will collaborate with teams to develop advanced packaging technology solutions, mentor team members, and manage projects across multifunctional teams. D. in a relevant engineering field, have at least 10 years of experience in the semiconductor industry, and possess strong data analysis skills.
NewPrincipal Engineer - Advanced Packaging Innovation Micron TechnologyPrincipal Engineer - Advanced Packaging InnovationBoise, IDIn this role, you will lead innovation efforts through strategic leadership, influencing the development of packaging technologies and ensuring alignment with business objectives. The position offers a dynamic environment focused on driving technological advancements and business value.#J-18808-Ljbffr.
NewProcess Integration Engineer Advanced Packaging & 3DIC Micron TechnologyProcess Integration Engineer Advanced Packaging & 3DICBoise, IDMicron Technology, Inc in Boise, Idaho seeks a Process Integration Engineer responsible for developing and deploying advanced interconnect technologies. Micron offers comprehensive medical and dental plans, paid time-off, and additional benefits to meet our team members' needs.#J-18808-Ljbffr.
NewPrincipal Wet Process Engineer, Advanced Packaging SwiftCruitPrincipal Wet Process Engineer, Advanced PackagingBoise, IDRole ResponsibilitiesIdentify, diagnose, and resolve assembly process-related problemsCoordinate and implement process, equipment, and material evaluation/optimization initiatives and implement changes at process stepValidate and fan out innovative processes, tools, and/or materials for new product introductionDevelop, optimize, and characterize wet chemistry processes to meet the requirements of pioneering advanced packaging productsSupport SPC/FDC/RMS/APCSupport site-to-site portabilityManage and audit material suppliers to achieve quality, cost, and risk management objectivesSupport internal and external auditsMinimum QualificationsMS in Materials Science, Chemical Engineering, Chemistry, Physics, or a related field12+ years of direct experience working as a process development engineer with an Advanced Packaging focus on DRAM, NAND, or other memory productsExcellent data collection, organization, and analysis skills with experience using Python and statistics softwareSkills and experience with material properties and characterization techniquesExperience using statistics and model-based problem solving to find solutions to problemsSkilled at crafting valid tests and Design of Experiments (DOE)Preferred QualificationsPHD in Material Science, Chemical Engineering, or Chemistry with at least 10 years specifically in Advanced Packaging within the semiconductor industrySubstantial hands‑on experience with wet chemistry development in a cleanroom environmentExperience leveraging AI and automation for data analysis and process‑improvementBenefitsMicron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. As a Principal Wet Process Engineer, you will be primarily responsible for developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management.
NewDMTS Process Integration Engineer - Advanced Packaging | Micron, Boise NanoHelpDMTS Process Integration Engineer - Advanced Packaging | Micron, BoiseBoise, IDWork Location Boise, Idaho, USAResearch Field Nanotechnology, Electronics, Materials Engineering, Electrical Engineering, Mechanical EngineeringFunding Info Industry-funded (Micron)Application Deadline RollingPosted Date July 2025Country United StatesResearcher Profile Advanced process integration expert in semiconductorsRequired Qualification MS or PhD in Engineering, Physics, Chemistry, or related fieldsRequired Experience Experience in DRAM/NAND/3DIC, hybrid bonding, integration, and yield optimizationSalary Details Competitive with US-based benefitsMicron Technology, a global leader in advanced memory and storage, is hiring a DMTS Process Integration Engineer for its Advanced Packaging Technology Development (APTD) team in Boise, Idaho. Home Vacancies DMTS Process Integration Engineer – Advanced Packaging | Micron, BoiseDMTS Process Integration Engineer – Advanced Packaging | Micron, BoiseDrive next-gen 3DIC and hybrid bonding integration in advanced memory packagingJuly 31, 2025Micron Boise is hiring a Process Integration Engineer to lead integration strategies for advanced memory packaging.
Principal Engineer Advanced Packaging Micron Technology IncPrincipal Engineer Advanced PackagingBoise, IDMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Principal/ Staff Engineer, Advanced Packaging Process Integration Applied Materials IncPrincipal/ Staff Engineer, Advanced Packaging Process IntegrationBoise, IDThe SMTS will operate at the intersection of technology innovation, customer roadmaps, and ecosystem collaboration, translating emerging concepts into scalable, differentiated capabilities aligned with Applied Materials' long-term strategy. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.
Senior Packaging & Material Handling Systems Engineer WSP Global IncSenior Packaging & Material Handling Systems EngineerMeridian, ID$86,100–$125,510 / yearOur Facilities and Industrial Systems teams support clients across food & beverage, consumer products, and advanced manufacturing markets by designing efficient, reliable packaging and material handling systems. WSP USA is providing the compensation range that the company in good faith believes it might pay and offer for this position, based on the successful applicant's education, experience, knowledge, skills, abilities in addition to internal equity and specific geographic location.
Advanced Packaging Design Staff Engineer Marvell Technology IncAdvanced Packaging Design Staff EngineerBoise, IDThe group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability, involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
NewSenior CPI & DRAM Packaging Engineer, NPI to HVM Micron TechnologySenior CPI & DRAM Packaging Engineer, NPI to HVMBoise, IDMicron Technology in Boise, Idaho, is looking for a candidate responsible for managing CPI related issues for DRAM memory products from pathfinding to NPI startup. The ideal applicant will have strong knowledge in DRAM/NAND architecture, chip-package interaction, and a proven track record in quality and reliability assessments.
NewLead Wet Process Engineer - Advanced Packaging Innovator SwiftCruitLead Wet Process Engineer - Advanced Packaging InnovatorBoise, IDThe role involves developing and optimizing processes to enhance product quality and reliability, with responsibilities rooted in assembling process improvements, cost reduction, and risk management. Micron Technology is seeking a Principal Wet Process Engineer to innovate in the Advanced Packaging Technology Development department.
NewStaff Equipment Development Engineer - Advanced Packaging Micron TechnologyStaff Equipment Development Engineer - Advanced PackagingBoise, IDUnderstanding of related inline/electrical/probe failure.2+ years of experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysisAbility to resolve sophisticated issues through root-cause or model-based problem solving and a focus on meeting commitmentsHands on experience with wafer / assembly tools and overlay systemsPreferred Qualifications Ph. D. in Mechanical Engineering, Chemical Engineering, Electrical Engineering, or a related technical field, or equivalent experienceKnowledge of robotics, machine logic language, or new hardware design is desirable.
NewSenior Die Bonding Process Engineer - Packaging & Yield 1000 Micron TechnologySenior Die Bonding Process Engineer - Packaging & YieldBoise, IDThis role involves optimizing semiconductor processes to enhance quality and reliability, addressing manufacturing challenges, and leading continuous improvement initiatives. Applicants should possess a BS degree along with a minimum of 8 years of relevant experience, ideally with expertise in advanced packaging technologies.
NewPrincipal Wet Process Engineer, Advanced Packaging Micron TechnologyPrincipal Wet Process Engineer, Advanced PackagingBoise, IDRole Responsibilities: Identify, diagnose, and resolve assembly process‑related problemsCoordinate and implement process, equipment, and material evaluation/optimization initiatives and implement changes at process stepValidate and fan out innovative processes, tools, and/or materials for new product introductionDevelop, optimize, and characterize wet chemistry processes to meet the requirements of pioneering advanced packaging productsSupport SPC/FDC/RMS/APCSupport site‑to‑site portabilityManage and audit material suppliers to achieve quality, cost, and risk management objectivesSupport internal and external auditsMinimum Qualifications: BS or MS in Materials Science, Chemical Engineering, Chemistry, Physics, or a related field7-13 years of direct experience working as a process development engineer with an Advanced Packaging focus on DRAM, NAND, or other memory productsExcellent data collection, organization, and analysis skills with experience using Python and statistics softwareSkills and experience with material properties and characterization techniquesExperience using statistics and model‑based problem solving to find solutions to problemsSkilled at crafting valid tests and Design of Experiments (DOE)Preferred Qualifications: PHD in Material Science, Chemical Engineering, or Chemistry with at least 10 years specifically in Advanced Packaging within the semiconductor industrySubstantial hands‑on experience with wet chemistry development in a cleanroom environmentExperience leveraging AI and automation for data analysis and process‑improvementJob Profile(s): Semiconductor Process Engineer 4 - Semiconductor Process Engineer 5Relocation Level: TBDBenefits: Micron offers medical, dental, vision, disability, paid time‑off, paid holidays, and paid family leave. Role Summary: As a Principal Wet Process Engineer, you will be primarily responsible for developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management.
NewSenior Wet Process Engineer, Advanced Packaging Micron TechnologySenior Wet Process Engineer, Advanced PackagingBoise, IDA minimum of 12 years of experience in process development related to DRAM or NAND is required, along with a strong background in data analysis and wet chemistry. This role focuses on developing and optimizing processes to improve product quality and reliability in advanced packaging.
NewStaff Process Engineer: Advanced Packaging Lithography Micron TechnologyStaff Process Engineer: Advanced Packaging LithographyBoise, IDThe successful candidate will have strong semiconductor photolithography experience, a relevant Master's or PhD, and a passion for driving yield improvements through structured problem-solving.#J-18808-Ljbffr. Micron Technology, Inc in Boise, Idaho is seeking a Process Engineer focused on Advanced Packaging Photolithography.
NewPrincipal Engineer, Advanced Packaging Innovation Micron TechnologyPrincipal Engineer, Advanced Packaging InnovationBoise, IDCandidates should possess over 5 years of experience in this field and a relevant degree with specific knowledge in high bandwidth memory and 3D integration strategies. A leading semiconductor firm in Boise seeks a Principal Engineer to join its Advanced Package Technology Development team.
Strategic Category Buyer - Packaging (On-site) Idahoan Foods LLCStrategic Category Buyer - Packaging (On-site)Idaho Falls, ID$80,000–$115,000 / yearThe majority of our roles are primarily located in one of our manufacturing facilities or in our corporate office in Idaho Falls, Idaho, offering us the ability to effectively collaborate, innovate, and develop the next leaders of Idahoan Foods. As a top 20 household penetration CPG brand, when you join our table, you're joining a team that aims high and values collaboration, continuous improvement, sustainable sourcing and innovation, active engagement in the community, and doing the right thing.
Senior Packaging & Material Handling Systems Designer WSP Global IncSenior Packaging & Material Handling Systems DesignerMeridian, ID$35.15–$51.25 / hourOur Facilities and Industrial Systems teams support clients across food & beverage, consumer products, and advanced manufacturing markets by designing efficient, reliable packaging and material handling systems. This role is ideal for an experienced designer who brings strong technical expertise, leadership capability, and the ability to deliver high-quality packaging system designs from concept through construction.
Packaging & Material Handling System Designer WSP Global IncPackaging & Material Handling System DesignerMeridian, ID$23.85–$34.52 / hourOur Facilities and Industrial Systems teams support clients across food & beverage, consumer products, and advanced manufacturing markets by designing efficient, reliable packaging and material handling systems. This role is ideal for an experienced designer who brings strong technical expertise, leadership capability, and the ability to deliver high-quality packaging system designs from concept through construction.
Systems Engineer II (Application Packaging) TMC Technologies IncSystems Engineer II (Application Packaging)Pocatello, IDPackaging will consist of building silent installation packages in a MSI/MST format and performing initial installation testing on Windows 10 or other Window Server 2016/2019 before handing off to the client for user acceptance testing and eventual deployment through Microsoft Endpoint Manager, BigFix, or Microsoft ACT package shimming. Complete packages in a timely manner and is responsible for COTS, GOTS, and FBI developed custom applications using AdminStudio and/or InstallShield following an established process and workflow.
Equipment Technician, Advanced Packaging Micron Technology IncEquipment Technician, Advanced PackagingBoise, IDAs an Equipment Technician, some of your job duties may require physical activity, including but not limited to: Standing and walking for long periods of time, stooping, crouching, kneeling, or crawling on uneven terrain, working in confined spaces, and using hand tools with arms raised above head level. As an Equipment Technician, you will be responsible for monitoring, sustaining, and improving the equipment in our assigned area while working in partnership with Shift Operations team members, area equipment engineers, and tool vendors!
Manufacturing Process Technician Advanced Packaging Micron Technology IncManufacturing Process Technician Advanced PackagingBoise, IDBy collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information.
Process Technician, Advanced Packaging Micron Technology IncProcess Technician, Advanced PackagingBoise, IDBy collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron''s leadership in the industry. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Staff Equipment Development Engineer - Advanced Packaging MicronStaff Equipment Development Engineer - Advanced PackagingBoise, IdahoMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will develop and optimize next-generation, first-of-a-kind (FAOK) wafer and die equipment.
Sr RDA Engineer, Advanced Packaging MicronSr RDA Engineer, Advanced PackagingBoise, IdahoBy collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information.
Principal Thin Films Engineer, Advanced Packaging MicronPrincipal Thin Films Engineer, Advanced PackagingBoise, IdahoWe offer a highly collaborative and innovative atmosphere, allowing you to interact with various groups including process integration, electrical failure analysis, yield enhancement, manufacturing, and various semiconductor equipment manufacturers. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Packaging Operator B1C McCain Foods LtdPackaging Operator B1CBurley, IDThis role plays a key part in maintaining production flow, equipment performance, and team coordination on a 12-hour night shift at the Burley, Idaho facility. We focus on understanding customer needs, driving innovation, empowering people, and taking ownership to clear obstacles and deliver results.
Packaging Associate I - String Pack Department Lactalis American Group, Inc.Packaging Associate I - String Pack DepartmentNAMPA, IDIn the US, we proudly offer an unrivaled house of beloved brands, including Galbani® Italian cheeses and ricotta, Président® specialty cheeses and butters, Kraft® natural and grated cheeses, Breakstone's® cottage cheese, Cracker Barrel®, Black Diamond® cheddar, and Parmalat® milk. Our yogurt portfolio includes siggi's®, Stonyfield Organic®, Brown Cow, Oui®, Yoplait®, Go-Gurt®, ratio®, Green Mountain Creamery®, and Mountain High®, along with a growing family of ethnic favorites like Karoun®, Gopi®, and Arz®.
Product Marketing Manager - Pricing and Packaging Relativity ODA LLCProduct Marketing Manager - Pricing and PackagingID$106,000–$158,000 / yearPreferred qualifications Understanding of the e-Discovery industry Experience in strategy consulting Demonstrated ability to work effectively cross-functionally and with executive leadership Minimum qualifications 3+ years in a product marketing or strategy role at a SaaS company, or experience in consulting Strong analytical and communication skills Relativity is committed to competitive, fair, and equitable compensation practices. Posting Type Hybrid Job Overview The Product Marketing Manager - Pricing & Packaging is responsible for developing pricing and packaging strategies and business case development required to support pricing decisions for existing products and new product launches, including generative AI-powered initiatives.
Senior Packaging Engineering Manager Chobani LLCSenior Packaging Engineering ManagerTwin Falls, IDFollowing the 2023 acquisition of La Colombe, a leading coffee roaster with a shared commitment to quality, craftmanship and impact, the Company began selling cold-pressed espresso and lattes on tap at cafés nationwide, as well as Ready to Drink (RTD) coffee beverages at retail. In support of this mission, Chobani is a purpose-driven, people-first, food-and-wellness-focused company, and has been since its founding in 2005 by Hamdi Ulukaya, an immigrant to the U.S. The Company manufactures yogurt, oat milk, and creamers - Chobani yogurt is Americas No.1 yogurt brand, made with natural ingredients without artificial preservatives.
NewSenior Product Development Engineer, DRAM CPI & Packaging Micron TechnologySenior Product Development Engineer, DRAM CPI & PackagingBoise, IDYou will be responsible for CPI related issues for Micron's DRAM memory products and establish package program plans for new fab technology. You must understand chip-package interaction and have experience in electrical data analysis related to DRAM/NAND devices.#J-18808-Ljbffr.
NewStaff Process Engineer - APTD Bonding & Advanced Packaging Micron TechnologyStaff Process Engineer - APTD Bonding & Advanced PackagingBoise, IDIn this role, you will improve product quality and reliability by developing and optimizing processes, resolving manufacturing line problems, and implementing changes effectively. The ideal candidate has a BS in a relevant STEM field and at least 5 years of industry experience.
NewSenior Equipment Development Engineer, Advanced Packaging Micron TechnologySenior Equipment Development Engineer, Advanced PackagingBoise, IDMicron Technology, Inc in Boise, Idaho, is seeking a Staff Equipment Development Engineer to lead the development of next-generation wafer and die equipment. You'll be responsible for creating strategies for equipment optimization, collaborating with process teams, and conducting comprehensive analyses.
Equipment Technician, Advanced Packaging MicronEquipment Technician, Advanced PackagingBoise, IdahoAs an Equipment Technician, some of your job duties may require physical activity, including but not limited to: Standing and walking for long periods of time, stooping, crouching, kneeling, or crawling on uneven terrain, working in confined spaces, and using hand tools with arms raised above head level. As an Equipment Technician, you will be responsible for monitoring, sustaining, and improving the equipment in our assigned area while working in partnership with Shift Operations team members, area equipment engineers, and tool vendors!
Process Technician, Advanced Packaging MicronProcess Technician, Advanced PackagingBoise, IdahoBy collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Packaging Operator - Whey Lactalis American Group, Inc.Packaging Operator - WheyNAMPA, IDIn the US, we proudly offer an unrivaled house of beloved brands, including Galbani Italian cheeses and ricotta, Président specialty cheeses and butters, Kraft natural and grated cheeses, Breakstone's cottage cheese, Cracker Barrel, Black Diamond cheddar, and Parmalat milk. Our yogurt portfolio includes siggi's, Stonyfield Organic, Brown Cow, Oui, Yoplait, Go-Gurt, ratio, Green Mountain Creamery, and Mountain High, along with a growing family of ethnic favorites like Karoun, Gopi, and Arz.
Forklift Operator - Packaging McCain Foods LtdForklift Operator - PackagingBurley, IDThis includes transferring inventory from delivery trucks to designated storage areas, maintaining proper FIFO practices, and supporting production teams by staging and delivering dry goods as needed. You'll be part of the operations and warehouse support team at our Burley, Idaho facility, a large-scale food manufacturing site supporting frozen potato production.
NewPackaging Operator (Nights) 0500pm-0500am Milk Specialties CompanyPackaging Operator (Nights) 0500pm-0500amJerome, IDPart timeEach day, we collectively explore new, innovative ways to enhance product performance and value through our broad human and animal nutrition portfolios. Ideal candidates will have previous exposure to a manufacturing environment and are happy with rolling up their sleeves to do whatever it takes to be a team player.
NewPackaging Associate (Heavy Lifting)-Mozzarella Pack Lactalis American Group, Inc.Packaging Associate (Heavy Lifting)-Mozzarella PackNAMPA, IDIn the US, we proudly offer an unrivaled house of beloved brands, including Galbani Italian cheeses and ricotta, Président specialty cheeses and butter s, Kraft natural and grated cheeses, Breakstone's cottage cheese, Cracker Barrel, Black Diamond cheddar, and Parmalat milk. Our yogurt portfolio includes siggi's, Stonyfield Organic, Brown Cow, Oui, Yoplait, Go-Gurt, ratio, Green Mountain Creamery, and Mountain High, along with a growing family of ethnic favorites like Karoun, Gopi, and Arz.
NewPackaging Runner C Shift Nights G3 Chobani LLCPackaging Runner C Shift Nights G3Twin Falls, IDFollowing the 2023 acquisition of La Colombe, a leading coffee roaster with a shared commitment to quality, craftmanship and impact, the Company began selling cold-pressed espresso and lattes on tap at cafés nationwide, as well as Ready to Drink (RTD) coffee beverages at retail. In support of this mission, Chobani is a purpose-driven, people-first, food-and-wellness-focused company, and has been since its founding in 2005 by Hamdi Ulukaya, an immigrant to the U.S. The Company manufactures yogurt, oat milk, and creamers - Chobani yogurt is Americas No.1 yogurt brand, made with natural ingredients without artificial preservatives.
NewElectromechanical Packaging Lead - Simulation & Design Schweitzer Engineering LaboratoriesElectromechanical Packaging Lead - Simulation & DesignBoise, IDSchweitzer Engineering Laboratories, Inc. is hiring a Lead Mechanical Engineer to join their team in Pullman, WA or consider candidates from Boise, ID. Candidates should have a B.S. in Mechanical Engineering, 6+ years in electromechanical design, and a strong grasp of simulation methods.
NewPackage Architect Advanced Packaging & System Exploration 1000 Micron TechnologyPackage Architect Advanced Packaging & System ExplorationBoise, ID$177,000–$387,000 / year1000 Micron Technology, Inc. in Boise, ID is seeking an experienced engineer to define and explore advanced package architectures for next-gen memory systems. The position offers a competitive salary range of $177,000 - $387,000, along with comprehensive benefits that include medical, dental, vision plans, and paid time-off.#J-18808-Ljbffr.
Director, Advanced Packaging Disruptive Technology (Based in Singapore) Applied Materials IncDirector, Advanced Packaging Disruptive Technology (Based in Singapore)Boise, IDThe Director will build and lead a high-impact team focused on exploratory, pre-product technologies, developing solutions such as D2W, RDL, CoWoS, TSV, etc and connecting emerging technology inflections to customer and market roadmaps. Based in Singapore, this role is responsible for defining and driving pathfinding strategy for N+2 and beyond advanced packaging technologies, leading disruptive innovation that shapes future integration architectures and unlocks new value creation opportunities.
Senior Director, Pricing & Packaging Gainsight, Inc.Senior Director, Pricing & PackagingID$215,000–$230,000 / yearThis is a great opportunity for someone who thrives in a highly strategic, data-driven SaaS environment and enjoys working cross-functionally with teams like Product, Sales, Finance, Marketing, and Customer Success. In this role, you'll play a key role in driving Gainsight's monetization strategy and long-term revenue growth by leading the evolution of pricing and packaging across its product portfolio, including the transition to usage- and value-based models.
Packaging Operator - Clif Bar Mondelez InternationalPackaging Operator - Clif BarKimberly, Idaho$24–$24.73We're leading the future of snacking with iconic global and local brands such as Oreo, Ritz, LU, Clif Bar and Tate's Bake Shop biscuits and baked snacks, as well as Cadbury Dairy Milk, Milka and Toblerone chocolate. About Mondelez International: Empowering People to Snack RightMondelz International empowers people to snack right in over 150 countries around the world.
Glanbia Packaging Nights -Richfield BBSIGlanbia Packaging Nights -RichfieldRICHFIELD, IDSpecific vision requirements for this job include close vision (clear vision at 20 inches or less); distance vision (clear vision at 20 feet or more), color vision (ability to identify and distinguish colors), peripheral vision (ability to observe an area that can be seen up and down or to the left and right while eyes are fixed on a given point); depth perception (three-dimensional vision, ability to judge distances and spatial relationships); ability to adjust focus (ability to adjust the eye to bring an object into sharp focus). Delivering on Glanbia’s Values:“Showing Respect” - Research issues & incidents with internal teams, business partners and customers in a collaborative manner that includes professional, honest and transparent communication.
Glanbia Packaging Days - Richfield BBSIGlanbia Packaging Days - RichfieldRICHFIELD, IDSpecific vision requirements for this job include close vision (clear vision at 20 inches or less); distance vision (clear vision at 20 feet or more), color vision (ability to identify and distinguish colors), peripheral vision (ability to observe an area that can be seen up and down or to the left and right while eyes are fixed on a given point); depth perception (three-dimensional vision, ability to judge distances and spatial relationships); ability to adjust focus (ability to adjust the eye to bring an object into sharp focus). Glanbia Richfield is one of the largest dedicated whey processing plants in the United States, producing 18 million pounds of dairy ingredients annually.
NewSenior Process Integration Lead, Advanced Packaging Micron TechnologySenior Process Integration Lead, Advanced PackagingBoise, IDA global technology leader is seeking a Process Integration Lead to drive innovation in advanced packaging technologies in Boise, Idaho. The ideal candidate will exhibit strong leadership skills, sound engineering judgment, and a passion for cost efficiency.