Influence the industry through sophisticated package solutions, new material development, and spec definition 5% International travelBS and 10+ years of relevant industry experience or equivalentMS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling Deep experience in the Semiconductor Packaging field, with a proven track record taking packages from concept to HVM Established expertise in Wafer Level Packaging, 2.5D packaging, and 3D packaging technology. Lead packaging technology development, including advanced 2.5D / 3D packaging Own SoC package integration end-to-end, driving multi-functional teams across design, test, reliability, and product Drive package architecture and package integration innovation Partner with foundry and OSAT to bring packaging solutions from concept to HVM.