Sr. Packaging Engineer Skyworks Solutions IncSr. Packaging EngineerIrvine, CA$91,200–$177,200 / yearAt Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location.
Packaging Engineer, Electromechanical Hardware ANDURIL INDUSTRIESPackaging Engineer, Electromechanical HardwareCosta Mesa, CA$129,000–$171,000 / yearTo ensure your safety and help you navigate your job search with confidence, please keep the following critical points in mind: No Financial Requests: Anduril will never solicit payment or demand personal financial details (such as banking information, credit card numbers, or social security numbers) at any stage of our hiring process. This third-party service provider provides risk-intelligence services that may include analysis of sanctions and watchlists, adverse media, public-record information, and other lawful open-source or commercial data sources.
Packaging Engineer Apple IncPackaging EngineerCalifornia, CASome hands-on knowledge in Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach, encapsulation/molding, under-fill, ball attach, package singulation and Tape & Reel. In this fast-paced environment, your role is to interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new packaging technologies.
IC Packaging Engineer - WLP Apple IncIC Packaging Engineer - WLPCalifornia, CAInfluence the industry through sophisticated package solutions, new material development, and spec definition 5% International travelBS and 10+ years of relevant industry experience or equivalentMS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling Deep experience in the Semiconductor Packaging field, with a proven track record taking packages from concept to HVM Established expertise in Wafer Level Packaging, 2.5D packaging, and 3D packaging technology. Lead packaging technology development, including advanced 2.5D / 3D packaging Own SoC package integration end-to-end, driving multi-functional teams across design, test, reliability, and product Drive package architecture and package integration innovation Partner with foundry and OSAT to bring packaging solutions from concept to HVM.
Principal Packaging Engineer (Irvine, CA, US) Skyworks Solutions, IncPrincipal Packaging Engineer (Irvine, CA, US)Irvine, CA$129,400–$247,800 / yearExperience in Advanced RF SiP Moldules: Dual Side BGA, Dual Side Mold Grid Array, EMI Shielding, Experience working with OSAT Assembly Factories in Asia. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking.
Sr. Packaging Engineer (Irvine, CA, US) Skyworks Solutions, IncSr. Packaging Engineer (Irvine, CA, US)Irvine, CA$91,200–$177,200 / yearAt Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location.
NewSr. Packaging Engineer Mini-CircuitsSr. Packaging EngineerCarlsbad, CaliforniaMust have strong knowledge of microelectronic chip-and-wire manufacturing methods and techniques, including: wedge bonding, ball bonding, silver epoxy application, expansion coefficient and thermal conductivity of materials, plating, hard and soft substrate materials, printed circuit board manufacturing methods and techniques. Our products are also used in detection, measurement and imaging applications, including military communication, guidance and electronic countermeasure systems, commercial, scientific, military land, sea and aircraft; automotive systems, medical systems, and industrial test equipment.
Entry Level Packaging Systems Design Engineer I (Start Summer 2027) External Dennis Group JobsEntry Level Packaging Systems Design Engineer I (Start Summer 2027)Carlsbad, CaliforniaAs such, our packaging engineers are involved with defining packaging equipment project requirements, estimating packaging equipment costs, creating packaging flow diagrams, providing onsite construction support, and start-up and commissioning of the packaging equipment. Packaging Engineers work closely with our process, controls, and building system engineers to scope, layout, install, and commission packaging equipment lines for our food and beverage industry clients.
Packaging Engineer, Sentry ANDURIL INDUSTRIESPackaging Engineer, SentryIrvine, CA$129,000–$171,000 / yearThis role works closely with design, manufacturing, and logistics teams to create packaging that meets the demanding requirements of defense applications, including protection against environmental conditions, rough handling, and transportation challenges. The right person for this role can demonstrate past holistic ownership of packaging solutions for complex technical products, with a proven ability to balance protection requirements with cost and material constraints in a fast-paced, resource-limited environment.
Entry Level Packaging Systems Design Engineer I (Start Summer 2027) The Dennis Group IncEntry Level Packaging Systems Design Engineer I (Start Summer 2027)Carlsbad, CAAs such, our packaging engineers are involved with defining packaging equipment project requirements, estimating packaging equipment costs, creating packaging flow diagrams, providing onsite construction support, and start-up and commissioning of the packaging equipment. Packaging Engineers work closely with our process, controls, and building system engineers to scope, layout, install, and commission packaging equipment lines for our food and beverage industry clients.
Packaging Engineer, Sentry Anduril Industries IncPackaging Engineer, SentryIrvine, CA$129,000–$171,000 / yearThis role works closely with design, manufacturing, and logistics teams to create packaging that meets the demanding requirements of defense applications, including protection against environmental conditions, rough handling, and transportation challenges. The right person for this role can demonstrate past holistic ownership of packaging solutions for complex technical products, with a proven ability to balance protection requirements with cost and material constraints in a fast-paced, resource-limited environment.
Packaging Engineer II ORTHOFIX IncPackaging Engineer IICarlsbad, CA$85,000–$105,123 / yearWork within a project team to gather user needs and design inputs, then be responsible for the design of new packaging systems and related packaging process steps and processing equipment for a variety of spinal implants, Biologics, and surgical instruments. Our global team of over 1,600 employees brings to market highly innovative, cost-effective, and user-friendly medical technologies that heal musculoskeletal pathologies for patients and the healthcare professionals who treat them.
NewPhotonic Packaging Engineer CiscoPhotonic Packaging EngineerCarlsbad, CaliforniaThe applicable full salary ranges for this position, by specific state, are listed below: New York City Metro Area: $154,900.00 - $259,100.00 Non-Metro New York state & Washington state: $136,500.00 - $228,300.00 * For quota-based sales roles on Cisco’s sales plan, the ranges provided in this posting include base pay and sales target incentive compensation combined. Global Leadership & Collaboration: Partner with cross-functional hardware, software, and manufacturing teams globally to drive project delivery, support international deployments, and mentor engineers on AI-assisted tools.
IC Packaging Thermal / Mechanical Simulation Co-Op (Winter/Spring, January - June 2027) Skyworks Solutions IncIC Packaging Thermal / Mechanical Simulation Co-Op (Winter/Spring, January - June 2027)Irvine, CA$26–$47.50 / hourThis internship will focus on integrated cirucit (IC) packaging process flow and support the development and reliability assessment of advanced semiconductor packages through thermal and mechanical finite element analysis (FEA). At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking.
IC Packaging Thermal / Mechanical Simulation Co-Op (Winter/Spring, January - June 2027) (Irvine, CA, US) Skyworks Solutions, IncIC Packaging Thermal / Mechanical Simulation Co-Op (Winter/Spring, January - June 2027) (Irvine, CA, US)Irvine, CA$26–$47.50 / hourThis internship will focus on integrated cirucit (IC) packaging process flow and support the development and reliability assessment of advanced semiconductor packages through thermal and mechanical finite element analysis (FEA). At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking.
Engineer, Packaging III SitOnItEngineer, Packaging IIICypress, CA$100,971–$151,457 / yearPosition Summary: The Packaging Engineer III leads packaging development from concept through production, delivering structural packaging solutions that protect products, enhance brand experience, and meet cost, quality, and sustainability targets. 30 years later, Exemplis continues to lead, innovate and disrupt an array of industries through its growing family of brands - including SitOnIt Seating, Timbuk2, X-Chair, Maverick, Mavix, Edloe Finch, and Albany Park.
IC Packaging Integration Engineer Apple IncIC Packaging Integration EngineerCalifornia, CATravel - 5-10%Lead package co-design efforts with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical, thermal, reliability and fit requirements. Drive package technology development which has broad impact (new technology, structure development, enhanced performance, lower cost) Co-work with assembly partners on new packages from development, NPI, Qualification to high volume production.
Engineer, Packaging III EXEMPLIS CORPORATIONEngineer, Packaging IIICypress, CA$100,971–$151,457 / yearPosition Summary: The Packaging Engineer III leads packaging development from concept through production, delivering structural packaging solutions that protect products, enhance brand experience, and meet cost, quality, and sustainability targets. 30 years later, Exemplis continues to lead, innovate and disrupt an array of industries through its growing family of brands - including SitOnIt Seating, Timbuk2, X-Chair, Maverick, Mavix, Edloe Finch, and Albany Park.
Packaging Engineer II Orthofix Medical IncPackaging Engineer IICarlsbad, CA$85,000–$105,123 / yearWork within a project team to gather user needs and design inputs, then be responsible for the design of new packaging systems and related packaging process steps and processing equipment for a variety of spinal implants, Biologics, and surgical instruments. Our global team of over 1,600 employees brings to market highly innovative, cost-effective, and user-friendly medical technologies that heal musculoskeletal pathologies for patients and the healthcare professionals who treat them.
Advanced Packaging Development Engineer Broadcom CorporationAdvanced Packaging Development EngineerIrvine, CA$127,100–$203,400 / yearThis position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. We are hiring a talent to develop and enable advanced packaging technology to integrate memory dies and SoC dies into one package for AI related products.