Semiconductor Packaging Engineer Fab2Semiconductor Packaging EngineerAustin, Texas$110,000–$155,000 / yearThis person will play a critical role in developing and optimizing processes that leverage 3D printing to create innovative packaging solutions, ensuring they meet performance, reliability, and manufacturability requirements. We are seeking an experienced Semiconductor Packaging Engineer with deep expertise in packaging methods and a passion for exploring new technologies.
Packaging engineer Info Way Solutions LLCPackaging engineerAustin, TXsuccessful candidate must have the ability to work quickly and efficiently with a high level of precision, have strong interpersonal and communication skills, be detail oriented, and not afraid to re-define. • Apply industrial design techniques of CAD, technical drawings, including datum structure, GD&T and tolerance stack up analysis.
Principal Packaging Engineer VelauraPrincipal Packaging EngineerAustin, TexasThis role will lead packaging from concept through production, working across silicon, board, system, thermal, mechanical, and manufacturing teams to deliver high-performance, cost-effective, and manufacturable products. You will work alongside experienced leaders, architects, engineers, and operators who have delivered industry-defining products across mobile, cloud, semiconductor, and AI platforms.
NewPackaging Engineer, Service Tesla IncPackaging Engineer, ServiceAustin, TXPartner with Design Engineering, Manufacturing, Quality, Supply Chain, Logistics, Warehouse Operations, and Service teams to gather requirements and deliver packaging that meets quality, cost, and timeline goals for sustaining service projects. This role will be focused on sustaining density, costm and quality improvements, and helping to ensure sage, efficient material flow from suppliers and factories through distribution centers to service centers.
Entry Level Packaging Systems Design Engineer I (Start Summer 2027) External Dennis Group JobsEntry Level Packaging Systems Design Engineer I (Start Summer 2027)Austin, TexasAs such, our packaging engineers are involved with defining packaging equipment project requirements, estimating packaging equipment costs, creating packaging flow diagrams, providing onsite construction support, and start-up and commissioning of the packaging equipment. Packaging Engineers work closely with our process, controls, and building system engineers to scope, layout, install, and commission packaging equipment lines for our food and beverage industry clients.
Packaging Engineer I YETIPackaging Engineer IAustin, TXWork cross functionally with Program Managers, Product Managers, Design & Industrial Engineering, Marketing, Merchandising, Sourcing, Operations, International team members, packaging and manufacturing suppliers to execute on-time packaging solutions. As a Packaging Engineer, you will support the design and development of premium out-of-box experiences for YETI products while considering performance, sustainability, and cost; ensuring YETI packaging delivers our premium brand aesthetic throughout its full lifecycle.
Packaging Engineer I YETI CoolersPackaging Engineer IAustin, TexasWork cross functionally with Program Managers, Product Managers, Design & Industrial Engineering, Marketing, Merchandising, Sourcing, Operations, International team members, packaging and manufacturing suppliers to execute on-time packaging solutions. As a Packaging Engineer, you will support the design and development of premium out-of-box experiences for YETI products while considering performance, sustainability, and cost; ensuring YETI packaging delivers our premium brand aesthetic throughout its full lifecycle.
Packaging and Graphic Designer 2 Dell Technologies IncPackaging and Graphic Designer 2Austin, TX$102,000–$132,000 / yearCreate compelling visual design solutions including packaging graphics, product graphics, visual identities, branded assets, and digital content including wallpaper that strengthen brand consistency across physical and digital touchpoints. Strong visualization and rendering skills, including the ability to create photorealistic renderings and compelling visual stories using tools such as KeyShot, Blender, Cinema 4D, Maya, or equivalent, with experience leveraging AI-assisted creative tools.
Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, IncIntegrated Circuit - Packaging Architect EngineerAustin, TexasSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Education : BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalent This role is not eligible for visa sponsorship.
Packaging Substrate Development Engineer Advanced Micro Devices, IncPackaging Substrate Development EngineerAustin, TexasWhether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. · Proven track record in developing advanced packaging technologies at a substrate supplier, OSAT or Fabless/IDM, as well as identifying and enabling new substrate and PCB vendors.
Sr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind) SpaceXSr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind)Bastrop, TXSpaceX is leveraging its experience deploying and operating the world’s largest satellite constellation to develop Starmind, a new constellation of satellites capturing solar energy in space to power low-cost, high-performance AI compute for Earth. We develop nearly every key piece of technology in house – from the satellites’ flight computers and power systems to the fully custom compute electronics, memory, and networking that form the brain of our on-orbit data centers.
Sr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind) Space Exploration TechnologiesSr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind)Bastrop, TXSpaceX is leveraging its experience deploying and operating the world's largest satellite constellation to develop Starmind, a new constellation of satellites capturing solar energy in space to power low-cost, high-performance AI compute for Earth. We develop nearly every key piece of technology in house - from the satellites' flight computers and power systems to the fully custom compute electronics, memory, and networking that form the brain of our on-orbit data centers.
AI Automation Design Packaging Lead Advanced Micro Devices, IncAI Automation Design Packaging LeadAustin, TexasThe successful candidate must be a proven leader and a technical innovator who can bridge the gap between physical design requirements and software automation to generate AI driven workflows. We are looking for a forward-thinking candidate to drive and lead the team for the development and deployment of next-generation packaging design automation and AI-Driven workflows.
Senior Packaging Designer Bakery AgencySenior Packaging DesignerAustin, TX$90,000–$130,000You'll need a sharp eye for brand storytelling and structural design in equal measure: comfortable moving between flat layout work in Illustrator and Photoshop and thinking in three dimensions about how a shape, fold, or container actually performs on shelf. Proficiency in Adobe Creative Cloud (Illustrator, Photoshop, InDesign) for flat design, plus working knowledge of 3D visualization tools like ArtiosCAD or Cinema 4D to see a design as a real object before it's produced.
Thermal Mechanical Test Engineer, Silicon Packaging (Starlink) SpaceXThermal Mechanical Test Engineer, Silicon Packaging (Starlink)Bastrop, TXWe provide reliable and fast internet to millions of users worldwide, including populations with little or no connectivity, rural communities, aircraft, watercraft, and places where existing services are unreliable, too expensive, or disconnected by natural disasters. You will support the silicon packaging process engineering organization by characterizing package and board thermal performance, validating mechanical robustness, and correlating simulation results with physical test data to enable high-volume production of reliable Starlink hardware.
Sr. Silicon Packaging Process Engineer, Silicon Technology (Starlink) SpaceXSr. Silicon Packaging Process Engineer, Silicon Technology (Starlink)Bastrop, TXDevelop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach. To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.
Sr. IC Packaging Test Engineer, Silicon Technology (Starlink) SpaceXSr. IC Packaging Test Engineer, Silicon Technology (Starlink)Bastrop, TXTo conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing.
NewSr. IC Packaging Test Engineer, Silicon Technology (Starlink) Space Exploration TechnologiesSr. IC Packaging Test Engineer, Silicon Technology (Starlink)Bastrop, TXITAR REQUIREMENTS: To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing.
NewSr. Silicon Packaging Process Engineer, Silicon Technology (Starlink) Space Exploration TechnologiesSr. Silicon Packaging Process Engineer, Silicon Technology (Starlink)Bastrop, TXDevelop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach. ITAR REQUIREMENTS: To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.
NewThermal Mechanical Test Engineer, Silicon Packaging (Starlink) Space Exploration TechnologiesThermal Mechanical Test Engineer, Silicon Packaging (Starlink)Bastrop, TXWe provide reliable and fast internet to millions of users worldwide, including populations with little or no connectivity, rural communities, aircraft, watercraft, and places where existing services are unreliable, too expensive, or disconnected by natural disasters. You will support the silicon packaging process engineering organization by characterizing package and board thermal performance, validating mechanical robustness, and correlating simulation results with physical test data to enable high-volume production of reliable Starlink hardware.