Senior Laser Packaging Engineer ESRhealthcare and EXEC STAFF RECRUITERSSenior Laser Packaging EngineerSan Diego, CaliforniaDesign, develop, analyze, document, and assist in testing resilient, precision opto-mechanical assemblies and laser packages. You'll have the opportunity to work on cutting edge technologies, work closely with leadership, and develop and implement engineering practices that support our mission and growth.
Photonics Packaging Engineer ESRhealthcare and EXEC STAFF RECRUITERSPhotonics Packaging EngineerSan Diego, CaliforniaDesign, develop, analyze, document, and assist in testing resilient, precision opto-mechanical assemblies and laser packages. You'll have the opportunity to work on cutting edge technologies, work closely with leadership, and develop and implement engineering practices that support our mission and growth.
NewSr. Packaging Engineer Mini-CircuitsSr. Packaging EngineerCarlsbad, CaliforniaMust have strong knowledge of microelectronic chip-and-wire manufacturing methods and techniques, including: wedge bonding, ball bonding, silver epoxy application, expansion coefficient and thermal conductivity of materials, plating, hard and soft substrate materials, printed circuit board manufacturing methods and techniques. Our products are also used in detection, measurement and imaging applications, including military communication, guidance and electronic countermeasure systems, commercial, scientific, military land, sea and aircraft; automotive systems, medical systems, and industrial test equipment.
Staff IC Packaging Engineer Qualcomm IncStaff IC Packaging EngineerSan Diego, CA$154,000–$231,000 / yearThe ideal candidate will possess deep expertise in advanced packaging architectures and assembly processes, and will lead technology development from concept through high-volume manufacturing (HVM) in collaboration with Outsourced Semiconductor Assembly and Test (OSAT) partners. Minimum Qualifications: Bachelor''s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
Entry Level Packaging Systems Design Engineer I (Start Summer 2027) External Dennis Group JobsEntry Level Packaging Systems Design Engineer I (Start Summer 2027)Carlsbad, CaliforniaAs such, our packaging engineers are involved with defining packaging equipment project requirements, estimating packaging equipment costs, creating packaging flow diagrams, providing onsite construction support, and start-up and commissioning of the packaging equipment. Packaging Engineers work closely with our process, controls, and building system engineers to scope, layout, install, and commission packaging equipment lines for our food and beverage industry clients.
Entry Level Packaging Systems Design Engineer I (Start Summer 2027) The Dennis Group IncEntry Level Packaging Systems Design Engineer I (Start Summer 2027)Carlsbad, CAAs such, our packaging engineers are involved with defining packaging equipment project requirements, estimating packaging equipment costs, creating packaging flow diagrams, providing onsite construction support, and start-up and commissioning of the packaging equipment. Packaging Engineers work closely with our process, controls, and building system engineers to scope, layout, install, and commission packaging equipment lines for our food and beverage industry clients.
Sr. IC Packaging Engineer - Mechanical Simulation Qualcomm IncSr. IC Packaging Engineer - Mechanical SimulationSan Diego, CA$127,200–$190,800 / yearThis role offers unique opportunity to impact Qualcomm''s current/future chipsets using FEA expertise, working closely with design, new product introduction (NPI) and Chip-Package Interaction (CPI) teams by providing mechanical simulation support for current HVM and advanced packaging technologies. This role requires development of mechanical FEA models (preferably using ANSYS APDL and Workbench), maintain APDL macros/workflows, establish FEA methodologies/BKM for test correlation, material characterization, and performing stress/mechanical analysis for IC package designs and failure prediction.
Senior Packaging Design Engineer, Silicon Google LLCSenior Packaging Design Engineer, SiliconSan Diego, CA$163,000–$237,000 / yearCollaborate closely with Signal Integrity (SI), Power Integrity (PI), Test, New Product Introduction (NPI), and Mechanical Engineering teams to refine and optimize product package architecture and design. Skip navigation links home Home work_outline Jobs noogler_hat Students google How we work handyman How we hire person_outline Your career help_outline Help.
Packaging Engineer II ORTHOFIX IncPackaging Engineer IICarlsbad, CA$85,000–$105,123 / yearWork within a project team to gather user needs and design inputs, then be responsible for the design of new packaging systems and related packaging process steps and processing equipment for a variety of spinal implants, Biologics, and surgical instruments. Our global team of over 1,600 employees brings to market highly innovative, cost-effective, and user-friendly medical technologies that heal musculoskeletal pathologies for patients and the healthcare professionals who treat them.
NewPhotonic Packaging Engineer CiscoPhotonic Packaging EngineerCarlsbad, CaliforniaThe applicable full salary ranges for this position, by specific state, are listed below: New York City Metro Area: $154,900.00 - $259,100.00 Non-Metro New York state & Washington state: $136,500.00 - $228,300.00 * For quota-based sales roles on Cisco’s sales plan, the ranges provided in this posting include base pay and sales target incentive compensation combined. Global Leadership & Collaboration: Partner with cross-functional hardware, software, and manufacturing teams globally to drive project delivery, support international deployments, and mentor engineers on AI-assisted tools.
Senior Engineer, NPI Packaging Murata Electronics North America, Inc.Senior Engineer, NPI PackagingSan Diego, CA$122,199.70–$158,868.41 / yearCollaborates with internal support personnel and other key supply chain partners including wafer fabs, offshore assembly and test contractors, and 3rd party service providers with service needs for specific technology or product developments. Familiarity with Microelectronic packaging technologies such as flip chip bumping, wafer backend processing, SMT, flip chip attach, flux cleaning, overmold, package marking, dicing, test, and packaging for shipment.
Photonics Process Development Engineer 2 Packaging and Tooling Monarch QuantumPhotonics Process Development Engineer 2 Packaging and ToolingSan Diego, California$85,000–$125,000 / yearYou will collaborate closely with device, optical, electrical, mechanical, and manufacturing engineers to transform delicate photonic designs into robust, manufacturable, high-yield products. 5+ years with demonstrated ownership of manufacturing process equipment such as die bonders, wire bonders, vacuum reflow systems, active alignment platforms, or laser welding systems.
Photonics Process Development Engineer 2 Packaging And Tooling Monarch QuantumPhotonics Process Development Engineer 2 Packaging And ToolingSan Diego, CA$85,000–$125,000 / yearYou will collaborate closely with device, optical, electrical, mechanical, and manufacturing engineers to transform delicate photonic designs into robust, manufacturable, high-yield products. 5+ years with demonstrated ownership of manufacturing process equipment such as die bonders, wire bonders, vacuum reflow systems, active alignment platforms, or laser welding systems.
Senior Photonics Process Development Engineer Packaging And Tooling Monarch QuantumSenior Photonics Process Development Engineer Packaging And ToolingSan Diego, CA$125,000–$175,000 / yearYou will collaborate closely with device, optical, electrical, mechanical, and manufacturing engineers to transform delicate photonic designs into robust, manufacturable, high-yield products. 3+ years of experience using manufacturing process equipment such as die bonders, wire bonders, vacuum reflow systems, active alignment platforms, or laser welding systems.
Senior Photonics Process Development Engineer Packaging and Tooling Monarch QuantumSenior Photonics Process Development Engineer Packaging and ToolingSan Diego, California$125,000–$175,000 / yearYou will collaborate closely with device, optical, electrical, mechanical, and manufacturing engineers to transform delicate photonic designs into robust, manufacturable, high-yield products. 5-10 years of experience using manufacturing process equipment such as die bonders, wire bonders, vacuum reflow systems, active alignment platforms, or laser welding systems.
Senior ASICS Packaging Engineer Qualcomm IncSenior ASICS Packaging EngineerSan Diego, CA$129,165–$190,800 / yearGeneral Summary: This individual independently plans, performs the moderately-defined responsibility for new product development risk analysis, characterization, and mitigation of electronic packages working with internal design and engineering teams and external suppliers to ensure manufacturing readiness for volume production. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Packaging Engineer II Orthofix Medical IncPackaging Engineer IICarlsbad, CA$85,000–$105,123 / yearWork within a project team to gather user needs and design inputs, then be responsible for the design of new packaging systems and related packaging process steps and processing equipment for a variety of spinal implants, Biologics, and surgical instruments. Our global team of over 1,600 employees brings to market highly innovative, cost-effective, and user-friendly medical technologies that heal musculoskeletal pathologies for patients and the healthcare professionals who treat them.
Associate Warehouse Packaging & Assembly Support Cobra Golf Puma SEAssociate Warehouse Packaging & Assembly Support Cobra GolfCarlsbad, CASPEED & SPIRIT is what we look for in our candidates, defined by some simple values that inspire us to BE DRIVEN in our performance, BE VIBRANT in our sporting legacy, BE TOGETHER in our team spirit, and to let our individual talent and experience shine. Maintain grip station operations by refilling solvent, monitoring solvent supply, and notifying supervisor when additional supply is needed.
Director, IC Packaging Engineering - Mechanical Simulation Qualcomm IncDirector, IC Packaging Engineering - Mechanical SimulationSan Diego, CA$227,300–$340,900 / yearThe Director will drive strategic alignment across IC package design/architecture, New Product Introduction (NPI), assembly, and Chip-Package Interaction (CPI) teams, ensuring high-quality mechanical simulation support across High Volume Manufacturing (HVM) and advanced packaging programs. Core technical responsibilities include overseeing the development and validation of mechanical FEA models (ANSYS APDL), establishing BKM methodology for test correlation and material characterization, and guiding stress/mechanical analysis for IC package designs.
Senior Engineer, Oral Solid Dose Packaging Development Neurocrine Biosciences Inc.Senior Engineer, Oral Solid Dose Packaging DevelopmentSan Diego, CA$97,000–$133,000 / yearThe company's diverse portfolio includes FDA-approved treatments for tardive dyskinesia, chorea associated with Huntington's disease, classic congenital adrenal hyperplasia, hyperphagia in Prader-Willi syndrome, endometriosis and uterine fibroids , as well as a robust pipeline including multiple compounds in mid- to late-phase clinical development across our core therapeutic areas. Lead technical investigations for packaging related deviations, and nonconformances, and retain post launch technical ownership for lifecycle changes, troubleshooting, packaging vendors and CPO transfers, and continuous improvement in partnership with Packaging Operations.