Must have strong knowledge of microelectronic chip-and-wire manufacturing methods and techniques, including: wedge bonding, ball bonding, silver epoxy application, expansion coefficient and thermal conductivity of materials, plating, hard and soft substrate materials, printed circuit board manufacturing methods and techniques. Our products are also used in detection, measurement and imaging applications, including military communication, guidance and electronic countermeasure systems, commercial, scientific, military land, sea and aircraft; automotive systems, medical systems, and industrial test equipment.