REQUIRED SKILLSMinimum years of total experience: 5 years3+ years of hands-on experience in the design, simulation, and layout of PICs for visible or IR wavelengths on platforms such as Si, SiN, LiNbO, or BTO.3+ years of experience utilizing photonic device simulation and electromagnetic modeling tools for both component and circuit-level analysis (e.g., Lumerical FDTD/MODE/DEVICE, Ansys Photonics, Synopsys RSoft, or COMSOL Multiphysics).2+ years of experience with PIC layout tools and GDSII generation (e.g., KLayout, Cadence Virtuoso, gdsfactory, or equivalent), including familiarity with foundry PDK integration and design rule verification.2+ years of experience with scientific programming (e.g., Python or MATLAB) for scripting, design automation, and analysis.1+ years of experience supporting or executing PIC tapeouts at a commercial semiconductor foundry, including an understanding of fabrication process constraints (e.g., propagation losses, sidewall roughness, etch non-idealities).NICE-TO-HAVE SKILLS1.Active PIC Design & Validation: Experience in active PIC design, fabrication, and validation, especially for visible wavelengths. PREFERRED SKILLS3+ years experience in active PIC design, fabrication, and validation, particularly for visible wavelengths on LiNbO or BTO platforms.3+ years of experience in design space exploration, sensitivity analysis, and statistical performance/yield modeling for photonic circuits.3+ years of experience with one or more major photonic simulation tool suites (e.g., Lumerical, Synopsys, COMSOL, or equivalent).2+ years of experience utilizing photonic circuit-level simulation tools (e.g., Lumerical Interconnect, Synopsys OptSim, or VPIphotonics) for system-level performance evaluation.2+ years of experience in photonic device characterization and test, including both optical and electro-optic measurements.1+ years experience with fiber optics, free-space optics, PIC packaging, and comprehensive device characterization.1+ years experience with semiconductor fabrication processes and a deep understanding of process-induced performance limitations, such as optical losses, sidewall roughness, and process variability.