NewPrincipal Software Engineer – Sensor, Telemetry & Observability (Hybrid) CrowdstrikePrincipal Software Engineer – Sensor, Telemetry & Observability (Hybrid)Lake Oswego, OR$195,000–$290,000 / yearDeep, hands-on experience architecting at-scale telemetry, observability, or crash-reporting platforms end-to-end — agent SDK through cloud ingestion and analytics — with systems you designed running in production. You will own the architecture and direction for how the sensor collects, transports, and surfaces reliability data end-to-end — from the on-endpoint collection SDK through cloud ingestion and analytics — across Windows, macOS, and Linux.
NewLead Engineer (Breach & Attack Simulation) JobotLead Engineer (Breach & Attack Simulation)Portland, ORRemote$250,000–$400,000 / yearIts broader platform helps organizations discover and understand the AI systems operating throughout their environments, protect AI applications at runtime, secure LLM/chatbot and agent workflows, simulate attacks against AI systems, monitor emerging coding-agent activity, and understand compliance with organizational and government security requirements. Rather than large teams executing against predefined tickets, engineering is moving toward small, highly empowered three-person pods that own problems from customer discovery through architecture, development, validation, and production delivery.
Principal Engineer, Module Development – CMP IntelPrincipal Engineer, Module Development – CMPHillsboro, Oregon$211,400–$298,440 / yearThe MDCE organization is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, and partnering closely with technology development, factory, and customer teams to ensure predictable, high-quality silicon delivery. Intel is seeking an experienced and highly influential Principal Engineer, Module Development with deep expertise in Chemical Mechanical Planarization (CMP) to provide module ownership, technical leadership, and development direction across Intel's advanced logic technologies.
Principal Engineer, Module Development - CMP Intel Corp.Principal Engineer, Module Development - CMPHillsboro, OR$211,400–$298,440 / yearThe MDCE organization is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, and partnering closely with technology development, factory, and customer teams to ensure predictable, high-quality silicon delivery. Job Details: Job Description: Manufacturing Development and Customer Engineering (MDCE) is a strategic organization within Intel Foundry Technology Manufacturing focused on improving process capability across Intel's technology portfolio-from initial product qualification through high-volume manufacturing.
Principal/Senior Principal Process Engineer, Aseptic Operations/Filling Genentech IncPrincipal/Senior Principal Process Engineer, Aseptic Operations/FillingHillsboro, OR$114,380–$212,420 / yearGenentech's Hillsboro Technical Operations (HTO), located in Hillsboro Oregon, is Drug Product manufacturing (Component Prep & Compounding, Liquid/Lyophilized Filling, Automated/Manual Inspection, Packaging/Finished Products and Distribution). Who are you: You hold a BS/MS in Engineering, Pharmaceutical Sciences, or a related eld, and have the minimum years of relevant experience (Principal Engineer = minimum 8, Senior Principal Engineer = minimum 12).
Principal Engineer, Hybrid Bonding Module Intel Corp.Principal Engineer, Hybrid Bonding ModuleHillsboro, OR$211,400–$298,440 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Your work will directly impact Intel's ability to execute advanced packaging roadmaps by delivering state-of-the-art hybrid bonding solutions with industry-leading performance, reliability, and cost efficiency, while shaping both internal strategy and the external ecosystem.
Principal Engineer-Td Foundry Engineering Intel Corp.Principal Engineer-Td Foundry EngineeringHillsboro, OR$220,920–$311,890 / yearJob Details: Job Description: As the world's largest chip manufacturer, and a global leader in innovation and new technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. This high-impact role provides executive technical leadership, engages directly with customers, drives the success of multi-billion-dollar programs, and helps shape the future of the global semiconductor industry in the AI innovation era.
Principal Engineer-TD Foundry Engineering IntelPrincipal Engineer-TD Foundry EngineeringHillsboro, Oregon$220,920–$311,890 / yearJob Description: As the world's largest chip manufacturer, and a global leader in innovation and new technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. This high-impact role provides executive technical leadership, engages directly with customers, drives the success of multi-billion-dollar programs, and helps shape the future of the global semiconductor industry in the AI innovation era.
Principal Engineer - Standard Cell Design Intel Corp.Principal Engineer - Standard Cell DesignHillsboro, OR$220,920–$311,890 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Principal Engineer, Digital IC Design and Architecture Analog DevicesPrincipal Engineer, Digital IC Design and ArchitectureBeaverton, OregonADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. Responsibilities: · Digital Architecture and Design: Architect and design digital blocks and subsystems of complex high-speed SerDes ICs, including Gigabit‑speed serial interfaces and video and data routing solutions.
Principal Electrical Engineer, AI Hardware Microsoft CorpPrincipal Electrical Engineer, AI HardwareHillsboro, OR$142,800–$274,800 / yearRequired Qualifications: Doctorate in Electrical Engineering, Computer Engineering, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, or related field AND 8+ years technical engineering experience OR equivalent experience. To achieve this goal, the Cloud Hardware Systems Engineering (CHSE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware.
Engineer (Sr II, Principal) PacifiCorpEngineer (Sr II, Principal)PORTLAND, OR$109,700–$161,370 / yearDevelops advanced engineering studies, plans, specifications, calculations, evaluations, design documents, and performance assessments associated with the planning, design, licensing, construction, operation, and maintenance of the company's generation, transmission lines and assets, distribution lines and assets, telecommunication assets, or other utility facilities/systems. Analyze and design engineering methods for power line design including but not limited to wood, fiberglass, and steel structures, various conductor types, insulators, shield wire, optical overhead ground wire, guy wire, anchors, connection hardware, structural supports such as braces, steel and wood crossarms.
Principal Engineer, AI Applied Research IntelPrincipal Engineer, AI Applied ResearchHillsboro, OregonConduct applied research to design and implement innovative AI models, including machine learning, deep learning, reinforcement learning, natural language processing, computer vision, and other areas. This role is part of Intel's advanced research and engineering organization, focused on pioneering AI solutions that enable Intel's technologies to remain at the forefront of innovation.
Principal AI Network Hardware Systems Engineer Microsoft CorpPrincipal AI Network Hardware Systems EngineerHillsboro, OR$142,800–$274,800 / yearThe Platform Systems Engineering (PSE) team is seeking a Principal AI Network Hardware Systems Engineer to lead the architecture, bring-up, validation, optimization, and deployment of networking infrastructure for Microsofts MAIA AI platform. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
Principal Electrical Engineer — Avionics and Command & Data Handling Lead AscendArcPrincipal Electrical Engineer — Avionics and Command & Data Handling LeadBeaverton, OregonRemoteWhen determining an individual’s compensation, we consider several factors including skillset, experience, job scope, and current market data, so pay for this role may vary from the amounts listed. Command and data handling: on-board computing, telemetry and command architecture, data bus topology, and discrete, analog and serial signal accommodation.
Principal Engineer, Identity & Authorization NIKE IncPrincipal Engineer, Identity & AuthorizationBeaverton, ORRemoteThis role will lead the transformation from fragmented, application-specific access controls to a modern, enterprise-wide authorization platform where access decisions are defined as policy, evaluated centrally, and consistently enforced across applications, APIs, cloud platforms, data systems, and business processes. Success in this role requires the ability to translate business intent, security requirements, and governance controls into reusable authorization services and policy frameworks that enable agility, strengthen security, and reduce operational complexity across Nike's global technology ecosystem.
Senior Principal Engineer PBS Engineering and Environmental Inc.Senior Principal EngineerVancouver, WA$150,000–$200,000 / yearIn addition to leading the infrastructure practice, this individual will also serve as a senior level engineering and project management resource to support Apex staff growth initiatives through implementation of industry best practices in partnership with Apex Regional Commercial Leadership (RCL) marketing team and the company wide Project Management Office (PMO) team. You will play a key role in managing client relationships, actively participating in the seller-doer model by developing new business opportunities, expanding existing client relationships, and mentoring the next generation of project managers and engineers to successfully deliver projects.
Senior Principal Engineer Apex CompaniesSenior Principal EngineerPortland, Oregon$150,000–$200,000 / yearIn addition to leading the infrastructure practice, this individual will also serve as a senior level engineering and project management resource to support Apex staff growth initiatives through implementation of industry best practices in partnership with Apex Regional Commercial Leadership (RCL) marketing team and the company wide Project Management Office (PMO) team. You will play a key role in managing client relationships, actively participating in the seller-doer model by developing new business opportunities, expanding existing client relationships, and mentoring the next generation of project managers and engineers to successfully deliver projects.
Substation Principal Engineer - Remote WSP Global IncSubstation Principal Engineer - RemoteLake Oswego, ORRemoteWell-developed critical thinking and problem-solving skills required to apply technical knowledge to reach conclusions from testing results, data collation, computations, statistical analysis and arriving at the most effective, economical, and logical solution. This position is responsible for SME innovation and administration, ensuring corporate compliance with all Local, State, and Federal engineering, construction, and safety regulations, and providing pragmatic directions to address current and future challenges in a rapidly changing and complex business climate.
Principal Applications Engineer (SiPh) FormFactorPrincipal Applications Engineer (SiPh)Beaverton, OregonThis role serves as a critical link between customers, Product Marketing, Engineering, Manufacturing, and Field Applications teams, ensuring FormFactor products address emerging market and technology needs. FormFactor is seeking a Principal Applications Engineer (Silicon Photonics - SiPh) to serve as a recognized technical expert in advanced semiconductor test and measurement solutions, with a primary focus on Silicon Photonics (SiPh) applications.