NewLead EPC Substation Project Engineer LeidosLead EPC Substation Project EngineerPortland, OR$107,900–$195,050These consulting services provide clients with overall project management tasks in the areas of comprehensive engineering design of electrical transmission and distribution, substation and transmission line projects nationwide. March 31, 2026 For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.
Principal Signal & Power Engineer (Die to Die and Chiplet Design) Microsoft CorpPrincipal Signal & Power Engineer (Die to Die and Chiplet Design)Hillsboro, OR$142,800–$274,800 / yearDrives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry best practices, and lessons learned from teams working across multiple product lines. IP design, voltage regulator, motherboard, CPU package, silicon, decoupling capacitor solutions, dielectric and copper loss, high-frequency discontinuities, timing budgets, power supply induced jitter, etc.) for data center processors and corresponding platforms to ensure optimized performance.
Principal Engineer, Module Development – CMP IntelPrincipal Engineer, Module Development – CMPHillsboro, OregonThe MDCE organization is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, and partnering closely with technology development, factory, and customer teams to ensure predictable, high-quality silicon delivery. Intel is seeking an experienced and highly influential Principal Engineer, Module Development with deep expertise in Chemical Mechanical Planarization (CMP) to provide module ownership, technical leadership, and development direction across Intel's advanced logic technologies.
NewPrincipal Engineer, Module Development - CMP Intel CorpPrincipal Engineer, Module Development - CMPHillsboro, OR$211,400–$298,440 / yearThe MDCE organization is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, and partnering closely with technology development, factory, and customer teams to ensure predictable, high-quality silicon delivery. Job Details: Job Description: Manufacturing Development and Customer Engineering (MDCE) is a strategic organization within Intel Foundry Technology Manufacturing focused on improving process capability across Intel's technology portfolio-from initial product qualification through high-volume manufacturing.
Principal Engineer, AMS IP Architecture Intel CorpPrincipal Engineer, AMS IP ArchitectureHillsboro, OR$220,920–$311,890 / yearD. in Electrical Engineering, Computer Engineering, or a related field with focus on high-speed communications, analog circuits, or signal processing • Deep expertise in one or more of the following: SerDes modeling in MATLAB or Simulink, high-speed analog CMOS design, DSP techniques for SerDes equalization and timing recovery, or communications theory including equalization, coding, and noise filtering • Experience analyzing and closing link budgets for NRZ or PAM4 signaling at 100Gbps or higher, accounting for transmitter impairments, channel loss, reflection, crosstalk, and receiver noise • Hands-on work with SerDes transmitter and receiver architectures, equalization techniques such as FFE, DFE, and CTLE, or CDR loop dynamics and jitter tolerance • Ability to correlate models with silicon measurements, debug discrepancies systematically, and update models to reflect real-world behavior • Familiarity with C, Verilog-A, or SystemVerilog for co-simulation or algorithm prototyping is a plus. Business group: The Central Engineering Group (CEG) is Intel''s data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies).
Principal Engineer, Hybrid Bonding Module Intel CorpPrincipal Engineer, Hybrid Bonding ModuleHillsboro, OR$211,400–$298,440 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Your work will directly impact Intel's ability to execute advanced packaging roadmaps by delivering state-of-the-art hybrid bonding solutions with industry-leading performance, reliability, and cost efficiency, while shaping both internal strategy and the external ecosystem.
Principal Engineer - Analog and Mixed-Signal Physical Design Microsoft CorpPrincipal Engineer - Analog and Mixed-Signal Physical DesignHillsboro, OR$142,800–$274,800 / yearDoctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. The ideal candidate brings deep Fusion Compiler-based physical implementation expertise, strong timing closure and physical verification experience, and sufficient custom layout understanding to partner effectively with analog design and layout teams while directly executing critical implementation and debug work.
Principal Engineer, Digital IC Design and Architecture Analog Devices IncPrincipal Engineer, Digital IC Design and ArchitectureBeaverton, OR$157,080–$227,460 / yearADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. Responsibilities: Digital Architecture and Design: Architect and design digital blocks and subsystems of complex high-speed SerDes ICs, including Gigabit‑speed serial interfaces and video and data routing solutions.
Principal Engineer - Standard Cell Design IntelPrincipal Engineer - Standard Cell DesignHillsboro, CaliforniaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, California, Santa Clara Additional Locations: US, Arizona, Phoenix, US, California, Folsom, US, Oregon, Hillsboro, US, Texas, Austin Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
NewPrincipal Firmware Architect Microsoft CorpPrincipal Firmware ArchitectHillsboro, OR$142,800–$274,800 / yearRequired Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
Principal Embedded Software Engineer PanthalassaPrincipal Embedded Software EngineerPortland, Oregon$210,000–$290,000 / yearThe embedded software – device drivers, baremetal firmware, and embedded Linux – is what bridges the gap between hardware and the systems above it: giving the Node the ability to sense, actuate, follow commands from shore, and operate autonomously. We are a renewable energy and ocean technology company committed to rapidly developing and deploying technologies that will ensure a sustainable future for Earth by unlocking the vast energy potential of its oceans.
NewPrincipal AI Network Hardware Systems Engineer Microsoft CorpPrincipal AI Network Hardware Systems EngineerHillsboro, OR$142,800–$274,800 / yearThe Platform Systems Engineering (PSE) team is seeking a Principal AI Network Hardware Systems Engineer to lead the architecture, bring-up, validation, optimization, and deployment of networking infrastructure for Microsofts MAIA AI platform. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
["Senior Principal Engineer - AI/ML Architect","Senior Principal Engineer - AI/ML Architect"] Celestica["Senior Principal Engineer - AI/ML Architect","Senior Principal Engineer - AI/ML Architect"]PortlandRemoteAs a leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development - from drawing board to full-scale production and after-market services for products from advanced medical devices, to highly engineered aviation systems, to next-generation hardware platform solutions for the Cloud. Assystem architect,one will define the architecture of leading and competitive AI systems, lead new technologyresearch, study market trend, customers interface and lead Celestica's design team in the AI/ML infrastructure space.
Principal IC Design Engineer, Analog Gateway RecruitingPrincipal IC Design Engineer, AnalogPortland, ORDesign of novel, robust, ultra-low power, low-voltage analog/mixed-signal IC functional blocks including but not limited to voltage/current references, operational amplifiers, comparators, switched-capacitor circuits (amplifiers, filters, charge pumps, etc.), ADCs and DACs, oscillators, switching power circuits, communication circuits, etc. Active involvement in all aspects of IC design, including the development of functional concepts and specifications, top-level design architecture, design partitioning and block level design, detailed circuit design and simulation, layout floor-planning and transistor level layout, bench verification and testing, test-vector development, and documentation.
Senior Principal Software Engineer NIKE IncSenior Principal Software EngineerBeaverton, ORYou will collaborate regularly with software and machine learning engineers in Reporting & Intelligence, principal engineers in partner domains, product managers, and engineering directors to activate technical designs and plans. Driving adoption of modern engineering methodologies, including automation, continuous integration and delivery (CI/CD), MLOps/DevOps practices, test-driven development, and agile frameworks to accelerate innovation and delivery.
Principal Systems Engineer Onto Innovation IncPrincipal Systems EngineerHillsboro, OROnto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. We are seeking a highly experienced Principal Systems Engineer to lead the architecture, integration, and validation of complex systems for advanced semiconductor Films and OCD metrology equipment.
Principal Engineer - Analog IP Tech Lead Microchip Technology IncPrincipal Engineer - Analog IP Tech LeadGresham, OR$75,000–$232,000 / yearAs a Mixed-Signal IP Technical Lead/Architect in the Mixed-Signal Development Group, you will be responsible for the end-to-end technical leadership of mixed-signal IPs-including IP licensing, integration, and silicon validation support-across a range of advanced SoC projects. Requirements/Qualifications: Qualifications: Bachelor's degree in electrical engineering or related field with strong analog/mixed-signal background and at least 10 years of experience in analog/mixed-signal IP design, integration, and validation for SoC applications, or a Master's degree with at least 7.5 years of such experience.
Staff - Principal Engineer - Oak Grove Plant VistraStaff - Principal Engineer - Oak Grove PlantOak Grove, OregonCollect and analyze plant operational and cost data to identify gaps in performance, develop potential solutions and gain consensus on path forward. We are a company of people committed to: Exceeding Customer Expectations, Great People, Teamwork, Competitive Spirit and Effective Communication.
Substation Principal Engineer - Remote WSP Global IncSubstation Principal Engineer - RemoteLake Oswego, ORRemoteWell-developed critical thinking and problem-solving skills required to apply technical knowledge to reach conclusions from testing results, data collation, computations, statistical analysis and arriving at the most effective, economical, and logical solution. This position is responsible for SME innovation and administration, ensuring corporate compliance with all Local, State, and Federal engineering, construction, and safety regulations, and providing pragmatic directions to address current and future challenges in a rapidly changing and complex business climate.
Principal Applications Engineer (SiPh) FormFactor IncPrincipal Applications Engineer (SiPh)Beaverton, OR$94,100–$123,480 / yearThis role serves as a critical link between customers, Product Marketing, Engineering, Manufacturing, and Field Applications teams, ensuring FormFactor products address emerging market and technology needs. Job Description: FormFactor is seeking a Principal Applications Engineer (Silicon Photonics - SiPh) to serve as a recognized technical expert in advanced semiconductor test and measurement solutions, with a primary focus on Silicon Photonics (SiPh) applications.