2+ years of hands-on semiconductor process engineering experience, with expertise in at least one of the following areas: e-beam lithography, photolithography, plasma dry etching, wet etching and cleaning, chemical vapor deposition, physical vapor deposition, e-beam evaporation, or metal electroplating. Operate nanofabrication and metrology equipment, including e-beam and photolithography systems, plasma etchers, deposition systems, CD-SEM, AFM, ellipsometry, profilometry, and optical interferometry, after completing the required training and qualification.