Cross Section, Cross Sectional Analysis, Failure Analysis, Focused Ion Beam (FIB), Fourier-Transform Infrared Spectroscopy (FTIR), Instron Mechanical Testing, Materials Characterization, Microelectromechanical Systems (MEMS), Nanoindentation, Probe Cards, Quality Assurance (QA), Reliability Engineering, Reliability Testing, SAS JMP (Statistical Software), Scanning Electron Microscopy / Energy Dispersive X-Ray Spectroscopy (SEM/EDS), Semiconductors, Statistical Analysis, Statistical Process Control (SPC), Tribometers, Wafer Probing Education & Experience: Operating as a subject matter expert, this role leads complex technical investigations, develops reliability strategies for advanced semiconductor and MEMS technologies, and influences product and process decisions across multiple engineering disciplines.