Prior experience at semiconductor capital equipment companies (e.g., Applied Materials, Lam Research, KLA, ASML, Tokyo Electron), chip designers/foundries (e.g., NVIDIA, AMD, Intel, TSMC, Samsung, Qualcomm, Broadcom), or EDA/simulation companies serving semiconductor. Multi-physics fluency across semiconductor disciplines: EDA, thermal and chip-package-board co-analysis, electromagnetics, signal and power integrity, fluid dynamics for fab equipment, structural mechanics, or multi-physics optimization.