Director, Pricing and Packaging Strategy McAfeeDirector, Pricing and Packaging StrategySan Jose, CaliforniaFull timeReporting to the Head of Pricing and partnering closely with executive leaders across Marketing, Retention, Product, and Retail, you’ll set the vision and frameworks that govern how we price, package, and promote across every channel and stage of the customer lifecycle – from acquisition through renewal – ensuring strategic coherence while maximizing long-term value. You’ll lead a high-impact pricing function, influence executive decisions on monetization strategy, and shape how millions of customers experience McAfee – from the first marketing touchpoint, through product packaging, into renewals and win-back, and across our retail ecosystem.
Advanced Packaging Engineer — Fiber Array Integration CspeedAdvanced Packaging Engineer — Fiber Array IntegrationPalo Alto, CaliforniaA permanently bonded fiber array constrains the downstream flow in three respects: the engine cannot be optically qualified before fiber attach, a single failed channel scraps an assembly containing multiple high-value die, and manual fiber handling limits automation. This position owns the detachable optical interface for CspeedIO optical engines: the on-package element, the coupling optics, the alignment features, and the high-volume assembly process that joins fiber to engine without per-unit active alignment.
FEA Packaging Engineer CspeedFEA Packaging EngineerPalo Alto, CaliforniaOur executive team has a demonstrated track record of building and scaling category-defining semiconductor and infrastructure businesses at companies like Broadcom, Lumentum, Tesla, Apple, Samsung, Intel, and VMware. Expert proficiency in one commercial FEA or CFD tool and working proficiency in a second covering the other domain — for example Ansys Mechanical or Abaqus alongside Icepak, Fluent, Flotherm, or Celsius.
HR Business Partner V - Advanced Packaging Applied MaterialsHR Business Partner V - Advanced PackagingSanta Clara, CA$154,000–$212,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
Structural, Thermal & Packaging Analyst (Semiconductor Fea) V Applied MaterialsStructural, Thermal & Packaging Analyst (Semiconductor Fea) VSanta Clara, CA$176,000–$242,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. Function as specialist for physics/scientists issues, while influencing and utilizing expertise in interfacing with external and internal customers, lead and/or develop and execute system projects, troubleshooting system problems, and defining system specifications and schedules.
Director, Advanced Packaging Disruptive Technology (Based In Singapore) Applied MaterialsDirector, Advanced Packaging Disruptive Technology (Based In Singapore)Santa Clara, CAThe Director will build and lead a high-impact team focused on exploratory, pre-product technologies, developing solutions such as D2W, RDL, CoWoS, TSV, etc and connecting emerging technology inflections to customer and market roadmaps. Based in Singapore, this role is responsible for defining and driving pathfinding strategy for N+2 and beyond advanced packaging technologies, leading disruptive innovation that shapes future integration architectures and unlocks new value creation opportunities.
Senior Director, Advanced Packaging Disruptive Technology Applied MaterialsSenior Director, Advanced Packaging Disruptive TechnologySanta Clara, CA$200,000–$275,000 / yearThis role leads cross-functional alignment to accelerate panel-level form factor scaling, RDL scaling, and ecosystem readiness-connecting customer needs to integrated equipment/process solutions and strategic partnerships. The Senior Director, Principal MTS is a senior technical leader responsible for defining and driving panel scaling technology strategy and customer-facing execution across next-generation advanced packaging and substrate platforms.
Senior Technical Marketing Manager - Advanced Packaging Applied MaterialsSenior Technical Marketing Manager - Advanced PackagingSanta Clara, CA$174,000–$239,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This role is responsible for defining product value propositions, building competitive positioning, driving customer adoption, and enabling sales teams for advanced semiconductor packaging solutions.
Technical Project/Program Management Director - Advanced Packaging Applied MaterialsTechnical Project/Program Management Director - Advanced PackagingSanta Clara, CA$172,000–$237,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. Leads multifunctional teams across internal and external stakeholders to execute complex programs, providing technical and operational leadership to achieve program milestones.
Process Engineer - Advanced Packaging Applied MaterialsProcess Engineer - Advanced PackagingSanta Clara, CA$147,000–$202,500 / yearRole Responsibilities: Design, collect data, analyze, and compile results for complex process engineering experiments across multiple process modules; apply findings to establish process baseline, monitor performance and stability. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor.
NewSenior System And Manufacturing Codesign Architect - Power, Thermal And Packaging NvidiaSenior System And Manufacturing Codesign Architect - Power, Thermal And PackagingSanta Clara, CAWhat you'll be doing: Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do. System-Manufacturing Co-Design: Drive improvements in product performance, performance-per-watt, and provisioning efficiency through system-manufacturing co-design, with the scope to follow the work wherever the highest-impact opportunities lead, whether that's power, thermal, or adjacent domains.
Process Engineer, Advanced Packaging Applied MaterialsProcess Engineer, Advanced PackagingSanta Clara, CA$124,000–$171,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
Senior Engineer, Semi Packaging Engineering Analog DevicesSenior Engineer, Semi Packaging EngineeringSan Jose, CaliforniaADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. This role will work closely with Business Units, global operations, and external partners to deliver robust, scalable NPI packaging solutions while enabling supply chain resilience and continuous improvement in our development systems.
Senior Power Integrity Engineer - LPU Packaging NvidiaSenior Power Integrity Engineer - LPU PackagingSanta Clara, CAWe have some of the most forward-thinking and hardworking people in the world working with us and our product lines are growing fast in some of the hottest state of the art fields such as Artificial Intelligence, Deep Learning, Autonomous Vehicles, and Robotics. A deep understanding of board-level PDN design, including stack-up definition, plane partitioning, and VRM placement on high-layer-count accelerator boards.
Senior Signal Integrity Engineer - LPU Packaging NvidiaSenior Signal Integrity Engineer - LPU PackagingSanta Clara, CADevelop and execute simulation flows for advanced packaging technologies, including 2.5D, 3D, and multi-die integration, with strong focus on channel loss, discontinuities, return path behavior, and crosstalk. We have some of the most forward-thinking and hardworking people in the world working for us and, due to unprecedented growth, our world-class engineering teams are growing fast.
Global Product Support (Gps) Engineer - Advanced Packaging Applied MaterialsGlobal Product Support (Gps) Engineer - Advanced PackagingSanta Clara, CA$124,000–$171,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities, BESI, Applied Materials product engineering teams, and CTO process development teams.
NewPackaging and Labeling Technician - Shockwave Medical 6947-SHOCKWAVE MEDICAL Legal EntityPackaging and Labeling Technician - Shockwave MedicalSanta Clara, CaliforniaAgile Manufacturing, Analytical Reasoning, Detail-Oriented, Equipment Maintenance, Good Manufacturing Practices (GMP), Issue Escalation, Manufacturing Equipment, Plant Operations, Predictive Maintenance, Problem Management, Process Oriented, Product Installation, Professional Ethics, Repair Management, Time Management, Troubleshooting . Employees and/or eligible dependents may be eligible to participate in the following Company sponsored employee benefit programs: medical, dental, vision, life insurance, short- and long-term disability, business accident insurance, and group legal insurance.
Advanced Packaging Integration Engineer Applied MaterialsAdvanced Packaging Integration EngineerSanta Clara, CA$161,000–$221,000 / yearJoin the Photonics Platform Business Group at Applied Materials located in Santa Clara headquarters, work with a high caliber cross-functional research team to develop advanced packaging solutions for next-generation smart glasses and high‑performance optical interconnects. In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes.
Packaging Utility Worker Threshold EnterprisesPackaging Utility WorkerScotts Valley, CASummary of Job Duties: Responsibility for this position include, assisting with the following processes: set-up, bottle filling, cotton and desiccant insertion, and capping, labeling, and packing of filled bottles. Complete all documentation required for packaging in a cGMP compliant manner, including: Packaging batch records (Travelers), box labels, room and equipment cleaning logbooks, and in-process documentation.
Senior IC Packaging Development Engineer NvidiaSenior IC Packaging Development EngineerSanta Clara, CAWith competitive salaries and a generous benefits package, we are widely considered to be one of the technology world's most desirable employers; we have some of the most forward-thinking and hardworking people in the world working for us and, due to unparalleled growth, best-in-class teams are rapidly growing. This will include planning & driving related R&D with multiple internal and external partners and you will be responsible for establishing advanced packaging processes needed to meet our NPI goals regarding packaging turn-around-time, reliability, and chip-package interaction.