Manager, Electrical Engineering (Analog PCB Design) KLA CorporationManager, Electrical Engineering (Analog PCB Design)Milpitas, CA$153,300–$260,600 / yearEnabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world's leading technology providers to accelerate the delivery of tomorrow's electronic devices.
Experienced Wealth & Fiduciary Associate - Evercore Wealth Management (San Francisco) Evercore IncExperienced Wealth & Fiduciary Associate - Evercore Wealth Management (San Francisco)San Francisco, CA$80,000–$120,000 / yearWe are dedicated to helping our clients achieve superior results through trusted independent and innovative advice on matters of strategic significance to boards of directors, management teams, and shareholders - including mergers and acquisitions, shareholder advisory, restructurings, and capital structure. Evercore also assists clients in raising public, private capital, delivers equity research, equity sales and agency trading execution, in addition to providing wealth and investment management services to high-net-worth individuals.
Algorithm Engineer KLA CorporationAlgorithm EngineerMilpitas, CA$114,800–$195,200 / yearEnabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. SWIFT (Simultaneous Wafer Inspection at Fast Throughput) systems deliver all-wafer-surface (frontside, backside, and edge) macro inspection that is critical for automotive IC, MEMS, and advanced packaging processes as well as foundry/logic and memory fabs.