Information Technology Specialist (InfoSec) U.S. Department of Homeland SecurityInformation Technology Specialist (InfoSec)Chandler, AZ$131,568–$187,093 / yearCustomer Service: Works with clients and customers (that is, any individuals who use or receive the services or products that your work unit produces, including the general public, individuals who work in the agency, other agencies, or organizations outside the Government) to assess their needs, provide information or assistance, resolve their problems, or satisfy their expectations; knows about available products and services; is committed to providing quality products and services. Oral Communication: Expresses information (for example, ideas or facts) to individuals or groups effectively, taking into account the audience and nature of the information (for example, technical, sensitive, controversial); makes clear and convincing oral presentations; listens to others, attends to nonverbal cues, and responds appropriately.
Senior Technology Manager Global Data-Network Operations Bank of America CorpSenior Technology Manager Global Data-Network OperationsChandler, AZThis role leads a large, distributed organization providing deeply technical level 2 and level 3 network operational support for our datacenter network, core network, branch, campus and SD-WAN networks, wireless and network Access Authentication and Authorization environments (AAA) that operates 24x7, ensuring secure, resilient, and performant connectivity across data centers, cloud, branches, trading floors and end-user environments. Required Qualifications:15+ years in large-scale network operations, infrastructure engineering, or related domains, with at least 7+ years in senior leadership roles in complex, multi-vendor, regulated enterprises (preferably global financial services).Proven track record leading global 24x7 follow the sun operations teams and major incident management for mission critical environments.
Teacher - Technology Teacher/Media Specialist CHANDLER UNIFIED SCHOOL DISTRICTTeacher - Technology Teacher/Media SpecialistChandler, AZNew Hire Education Credit: $80/hour of graduate level credits: BA +96 hours max, MA +96 hours max, $1250 for first advanced degree,$500 for each additional advanced degree. Prepare and deliver instruction appropriate to the student population including curriculum that addresses learning styles, abilities, interests, behavior problems and student with special needs.
Manufacturing Student Technician - Intel Contract Employee Ocotillo Technology Fabrication (OTF) Intel CorpManufacturing Student Technician - Intel Contract Employee Ocotillo Technology Fabrication (OTF)Chandler, AZ$52,000–$200,000 / hourAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum 3 months of experience with Semiconductor Related Fields include plumbing, welding, electrical, mechanics (diesel, car, avionics), HVAC, water treatment, life safety systems, robotics, instrumental, machinist, microelectronics, and/or electronic engineering technology.
Senior Staff Engineer, Advanced Packaging Technology Development (TD) Marvell Technology IncSenior Staff Engineer, Advanced Packaging Technology Development (TD)Chandler, AZHighlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. The TD team works at the intersection of design, materials, and manufacturing to translate architectural requirements into manufacturable and scalable package solutions, including 2.5D/3D integration, chiplet-based architectures, co-packaged optics (CPO), and advanced substrates.