This role is responsible for driving the thermal design and optimization of high‑performance computing (HPC) systems using advanced Multiphysics simulations and CAD‑based design support. The role focuses on thermal and CFD modeling to evaluate new concepts, materials, cooling architectures, and CAD models for high‑power‑density applications. By translating simulation insights into robust design recommendations, this position helps enable next‑generation HPC solutions. is responsible for assisting in the development of new products and manufacturing processes. Establishing a sound technical basis for these developments, this role will work closely with internal team members to understand material and manufacturing constraints. With a strong detail-orientation, this position will help document development processes, perform experimental processes, and track results.
Essential Functions:
Perform advanced Multiphysics simulations with a strong emphasis on thermal and CFD analyses for the thermal design of HPC systems and components.
Develop and optimize cooling concepts for high‑power‑density and high‑performance computing applications, including cold plates and system‑level thermal architectures.
Evaluate new product concepts, materials, and processes using simulation to guide thermal design decisions.
Create CAD models to support simulation setup, design evaluation, and optimization of thermal solutions.
Apply simulation‑based Design of Experiments (DoE) to assess sensitivities, tradeoffs, and robustness of thermal designs.
Support the development and refinement of thermal design rules and operating limits for HPC applications.
Collaborate closely with cross‑functional teams (R&D, engineering, sales, marketing) to translate customer and system requirements into effective thermal solutions.
Provide simulation expertise during technical discussions with customers to understand performance requirements and application challenges.
Monitor relevant technologies, tools, and market trends related to HPC cooling, thermal management, and Multiphysics simulation.
Review and evaluate external patents and publications related to thermal design, simulation methods, and cooling technologies.
Support development projects through clear technical documentation and regular status updates.
Qualifications:
Bachelor's, Master's, or PhD in Mechanical Engineering, Physics, Materials Science, or a related engineering discipline.
3+ years of professional experience in Multiphysics simulation, ideally gained in an industrial environment.
Strong hands‑on experience with Multiphysics simulations, with a clear focus on thermal and CFD modeling.
Experience applying simulation methods to thermal design of complex systems, preferably in HPC or high‑power‑density environments.
Experience using DoE or structured experimentation methods to evaluate and optimize thermal concepts is preferred.
Experience creating CAD models and applying strong CAD skills in support of simulation‑driven design and optimization.
Deep understanding of heat transfer, fluid dynamics, and thermal management principles.
Ability to translate simulation results into practical, design‑relevant recommendations.
Familiarity with HPC system architecture and cooling challenges is highly desirable.
Experience in power electronics or related applications is a plus.
Knowledge of Six Sigma or structured problem‑solving methods is an advantage.