## The group you'll be a part of
WETS
## The impact you'll make
Be a part of the exciting Sabre 3D process development and engineering team. Our mission is to advance and innovate WFE (wafer fab equipment) electrodeposition process and technology, in the field of advanced packaging, including through Silicon via, through glass via, panel level plating and grain engineering
## What you'll do
Participate in projects applying engineering and electrodeposition methodologies towards developing features on Lam SABRE 3D system to further enhance equipment and reactor performance. Supports in the testing and characterization on development of new or modified process formulations, product development and technology support. These duties include setting up of and running bench scale experiments, operations of application lab deposition development tool, chemistry and material analysis, and use of metrology tools to measure and characterize on wafer deposition performance. Further R&D support activities can also include data compilation and organization and conducting scientific journal research.
## Who we're looking for
We are seeking highly motivated, high-energy individuals who are eager to learn and contribute to a rapidly growing organization. The ideal candidate is driven to take on complex technical challenges and is passionate about developing and implementing world-class solutions.This role is best suited for candidates with strong analytical and problem-solving skills, including experience in modeling and simulation. A solid understanding of grain growth mechanisms, along with hands-on experience in electrochemical plating processes, is highly desirable. The ability to bridge theoretical understanding with practical process development will be critical for success in this role.
## Preferred qualifications
## Our commitment
We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.
Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.
Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories - On-site Flex and Virtual Flex. 'On-site Flex' you'll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. 'Virtual Flex' you'll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.
Our Perks and Benefits
At Lam, our people make amazing things possible. That's why we invest in you throughout the phases of your life with a comprehensive set of outstanding benefits.
From smartphones and tablets to wearables and automobiles, it’s hard to go more than a few hours without using a semiconductor-enabled device. The semiconductor industry touches nearly every person on the planet, and chipmakers continue to advance the technology that powers it all.
As a trusted partner to the world’s leading semiconductor companies, we welcome challenges and we deliver. That’s why, today, nearly every advanced chip is built with Lam technology.
Our innovative wafer fabrication equipment and services allow chipmakers to build smaller and better performing devices. We combine superior systems engineering, technology leadership, and a strong values-based culture, with an unwavering commitment to our customers.