Silicon Packaging Design Engineer IntelSilicon Packaging Design EngineerChandler, ArizonaJob Description: As a Silicon Packaging Design Engineer, you will play a pivotal role in driving the development of advanced substrate designs, contributing to the creation of cutting-edge technology that fuels Intel's innovation. This position provides an exciting opportunity to work collaboratively with silicon and hardware teams, directly impacting Intel's success in delivering world-class solutions for high-performance applications.
Facilities Site Manager IntelFacilities Site ManagerChandler, ArizonaThis role is part of Intel's Frontend Facilities Engineering and Operations (FFEO) organization, which is dedicated to providing innovative, sustainable, and efficient solutions that support Intel's business objectives and create an outstanding experience for employees. As a Facilities Engineering Manager, you will lead a team of managers, engineers, and technicians responsible for ensuring the structural, mechanical, electrical, and environmental integrity of Intel's corporate facilities.
Module Equipment Technician IntelModule Equipment TechnicianChandler, Arizona$51,710–$85,340 / yearWork from technical manuals, specifications, drawings/diagrams, schematics, written and verbal instructions utilizing a variety of tools, test equipment, problem solving techniques and communication. The candidate must possess at least one of the following educational or experience requirements: HS/GED or higher non-semi degree AND 1+ year technical certification or related (1) trade school.
Senior Density Fill Development Engineer Intel Corp.Senior Density Fill Development EngineerAustin, TX$128,880–$245,160 / yearStrong preference for candidates with experience from semiconductor foundries, advanced packaging organizations (OSATs), integrated device manufacturers (IDMs), or EDA vendors, where they have contributed to physical verification, density-fill methodology development, process design kits (PDKs), or manufacturing-driven design solutions. 5+ years of hands-on experience developing, deploying, or supporting density fill methodologies for semiconductor technologies at 16nm and below, including ownership of fill rule implementation, density compliance, or manufacturability optimization.
Sr. Director, Software Engineering IntelSr. Director, Software EngineeringCaliforniaJob Description: The Role and Impact: As a Software Engineering Manager, you will lead a team of talented software engineers and architects dedicated to developing and validating cutting-edge software solutions for Intel's product segments or technologies. - Oversee the design, development, validation, debugging, and optimization of software across multiple layers of the technology stack, including firmware, drivers, operating systems, applications, and platforms.
Back End( BE) Process Integration Engineer Intel Corp.Back End( BE) Process Integration EngineerHillsboro, OR$103,730–$170,630 / yearJob Details: Job Description: As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. PhD in Electrical Engineering, Physics, Applied Physics, Materials Science, Chemical Engineering, Mechanical Engineering, Chemistry, Optics, or a closely related semiconductor field of study.
Module Equipment Technician Intel Corp.Module Equipment TechnicianPhoenix, AZ$60,450–$116,640 / yearWork from technical manuals, specifications, drawings/diagrams, schematics, written and verbal instructions utilizing a variety of tools, test equipment, problem solving techniques and communication. Job Details: Job Description: As a Module Equipment Technician, you will play a critical role in Intel's high-tech manufacturing process, ensuring our tools are optimized for world-class production.
Data Center And AI Brand Strategist Intel Corp.Data Center And AI Brand StrategistSanta Clara, CA$145,850–$247,930 / yearWorking technical fluency in data center and AI infrastructure - a clear understanding of how CPUs, GPUs, and AI accelerators differ and complement each other, how heterogeneous compute systems are architected, and how software (frameworks, compilers, runtime libraries, and orchestration tools) enables portability and performance across training, fine-tuning, and inference workloads. Stakeholder Management: Effectively manage senior stakeholders across business units, engineering, sales, and marketing teams - including Data Center and AI Group leadership - to drive alignment on long-term brand decisions for a fast-moving, competitive category.
Module Equipment Technician IntelModule Equipment TechnicianChandler, Arizona$51,710–$85,340 / yearWork from technical manuals, specifications, drawings/diagrams, schematics, written and verbal instructions utilizing a variety of tools, test equipment, problem solving techniques and communication. Annual Salary Range for jobs which could be performed in the US: $51,710.00-85,340.00 USD (Hourly Role)The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
Foundry Device Engineer Intel Corp.Foundry Device EngineerSanta Clara, CA$161,550–$317,600 / yearKey Responsibilities: Collaborate with the Technology Development team to develop new device technologies and customize newly developed device architectures to meet specific foundry customer needs. With cutting-edge facilities across the United States and globally, Intel Foundry is uniquely positioned to serve the next generation of chip design companies and technology leaders.
Rebates Global Process Owner Analyst Intel Corp.Rebates Global Process Owner AnalystHillsboro, OR$116,160–$195,980 / yearThis role partners closely across CAO, IT, SMG regional reps, rebate analysts (RAs), and audit/compliance stakeholders to ensure scalable, well controlled execution and audit readiness as processes and tooling evolve. Partner with COE/controls stakeholders to ensure process changes remain SOX relevant, documented, and auditable, including alignment with audit expectations when introducing new technologies or changing operating models.
Senior CPU Front End Methodology Engineer Intel Corp.Senior CPU Front End Methodology EngineerHillsboro, OR$164,470–$311,890 / yearCPU RTL Methodology Engineer your responsibilities will include but are not limited to: Demonstrated leadership and hands-on experience in leveraging AI tools and methodologies to drive significant efficiency gains and improvements in RTL coding and other areas of silicon development. Develops and implements strategies, tools, and techniques for RTL development and logic optimization, ensuring designs meet power, performance, area, and timing targets, as well as physical design integrity.
Ocotillo Failure Analysis Technician - TEM Prep Intel Corp.Ocotillo Failure Analysis Technician - TEM PrepPhoenix, AZ$44,230–$85,340 / yearo Operates Dual Beam FIB/PFIB to perform site-specific cross sectioning and prepare TEM samples, including site marking, depositing protective materials, de-layering, imaging and TEM lamella preparation. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.
Senior Technical Program Integration Manager - Satas Program Intel Corp.Senior Technical Program Integration Manager - Satas ProgramPhoenix, AZ$52,000–$200,000 / year7+ years of experience in technical program management, semiconductor manufacturing, equipment engineering, factory automation, systems integration, or related fields, with a proven track record of leading complex cross-functional programs and driving alignment across internal and external stakeholders. This U.S.-based ICE role will provide integrated program execution, operating cadence, technical coordination, dashboard ownership, and cross-swimlane alignment across Intel teams, Japan-based partners, equipment suppliers, and external stakeholders.
Silicon Packaging Design Engineer IntelSilicon Packaging Design EngineerChandler, Arizona$105,650–$149,150 / yearAnnual Salary Range for jobs which could be performed in the US: $105,650.00-149,150.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Job Description: As a Silicon Packaging Design Engineer, you will play a pivotal role in driving the development of advanced substrate designs, contributing to the creation of cutting-edge technology that fuels Intel's innovation.
Senior Density Fill Development Engineer Intel Corp.Senior Density Fill Development EngineerSanta Clara, CA$128,880–$245,160 / yearStrong preference for candidates with experience from semiconductor foundries, advanced packaging organizations (OSATs), integrated device manufacturers (IDMs), or EDA vendors, where they have contributed to physical verification, density-fill methodology development, process design kits (PDKs), or manufacturing-driven design solutions. 5+ years of hands-on experience developing, deploying, or supporting density fill methodologies for semiconductor technologies at 16nm and below, including ownership of fill rule implementation, density compliance, or manufacturability optimization.
FCO Strategic/Development Functional Area Industrial Engineer Intel Corp.FCO Strategic/Development Functional Area Industrial EngineerAlbuquerque, NM$120,860–$170,630 / yearKey Responsibilities • Collaborate with organizational leadership and cross-functional teams to analyze complex business data, identify risks and opportunities, and develop data-driven models and reports. You will work closely with organizational leadership and cross-functional teams to optimize capacity and capital, solve complex challenges, and influence business strategies with data-driven insights.
Facilities Site Manager IntelFacilities Site ManagerChandler, Arizona$191,220–$269,950 / yearBusiness group This role is part of Intel's Frontend Facilities Engineering and Operations (FFEO) organization, which is dedicated to providing innovative, sustainable, and efficient solutions that support Intel's business objectives and create an outstanding experience for employees. Job Description: The Role and Impact As a Facilities Engineering Manager, you will lead a team of managers, engineers, and technicians responsible for ensuring the structural, mechanical, electrical, and environmental integrity of Intel's corporate facilities.
HPC Dev Ops Engineer Intel Corp.HPC Dev Ops EngineerHillsboro, OR$100,550–$194,270 / year1+ year of experience with Bachelors, 0 years of experience with Master's degree working with Large Enterprise NAS environment, including NetApp Storage protocols including one or more of the following: NFS, SMB/CIFS, iSCSI, and/or FCP Automation, troubleshooting and maintaining Python/Bash/PowerShell scripts NetApp products specially FAS /AFF storage devices. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.
Module Development Engineer - RF Test Intel Corp.Module Development Engineer - RF TestPhoenix, AZ$155,520–$219,550 / yearWith a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. Collaborating across teams, you will influence design-for-test (DFT) initiatives, optimize production testing, and support product development from feasibility through production ramp.