Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, IncIntegrated Circuit - Packaging Architect EngineerSan Jose, CaliforniaSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Responsibilities: The Role : Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
Sr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging Amazon.com IncSr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon PackagingCupertino, CAWe pioneered cloud computing and never stopped innovating - that's why customers from the most successful startups to Global 500 companies trust our robust suite of products and services to power their businesses. Signal & Power Integrity Engineer to join our hardware team and drive the SI/PI analysis and optimization of advanced packaging solutions for next-generation machine learning and data center ASICs.
Packaging Engineer LanceSoft IncPackaging EngineerFoster City, CA$96.30 / hourThis position resides within the Packaging Development team, with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. B.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering, or a related scientific field.
Packaging Product Design Engineer Apple IncPackaging Product Design EngineerCupertino, CAThe Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products - from shippers to finished goods boxes. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
Memory Packaging Engineer MediaTek IncMemory Packaging EngineerSan Jose, CACollaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions. Roles and Responsibilities: Supports MediaTek's Memory packaging technology development including but not limited to HBM package, cHBM, LPDDR package for mobile applications, In Package Memory (IPM) for Edge AI, etc.
Software Engineer 5 - Ads Pricing & Packaging Netflix IncSoftware Engineer 5 - Ads Pricing & PackagingLos Gatos, CA$388,000–$619,000 / yearThe Ads Pricing and Packaging team is responsible for developing cutting-edge inventory management systems which support various monetization strategies, including dynamic pricing, rate card management, product packaging, inventory segmentation, and yield optimization. Skills & experience we're seeking: Professional experience in building inventory management solutions that support monetization strategies such as dynamic pricing, rate card management, product packaging, inventory split and yield management.
Senior Mechanical Engineer (Packaging And Integration) KLA CorporationSenior Mechanical Engineer (Packaging And Integration)Milpitas, CA$117,800–$200,300 / yearEnabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world's leading technology providers to accelerate the delivery of tomorrow's electronic devices.
Packaging Engineer I Exelixis Inc.Packaging Engineer IAlameda, CA$75,000–$106,500 / yearESSENTIAL DUTIES/RESPONSIBILITIES: Provide on-site/remote technical support for project activities such as commercial packaging, implementation/qualification of new packaging line equipment and introduction of components changes. EDUCATION/EXPERIENCE/KNOWLEDGE & SKILLS: Education: Bachelor's degree in related discipline and a minimum of 1 year of related experience; or, Equivalent combination of education and experience.
Director, Product Line Manager - Advanced Packaging & Metrology (E) KLA CorporationDirector, Product Line Manager - Advanced Packaging & Metrology (E)Milpitas, CA$210,900–$369,100 / yearThis hybrid role blends technical depth with market insight, requiring leadership in both product management and strategic marketing and will be responsible for defining product strategy, driving customer adoption, and managing the full lifecycle of Advanced Packaging products. The ideal candidate will have extensive experience in advanced packaging, metrology, or inspection technologies, and a proven ability to lead and build cross-functional teams to deliver innovative solutions that meet evolving customer needs.
Sr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E) KLA CorporationSr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E)Milpitas, CA$138,500–$235,500 / yearMinimum 10+ years of experience in semiconductor manufacturing, product marketing, product management, applications engineering, yield engineering, process control, or related technical commercial roles. Doctorate (Academic) Degree and related work experience of 3 years; Master's Level Degree and related work experience of 6 years; Bachelor's Level Degree and related work experience of 8 years.
Lab Packaging Test Engineer I Engineer In Training (Swing Shift) Artech LLCLab Packaging Test Engineer I Engineer In Training (Swing Shift)San Jose, CA$66,560–$70,720 / yearPerform testing duties within the designated workday hours according to requirements to ensure customer objectives are met through proactive communication, documentation, and customer service. Maintain responsive customer communication in email and in person regarding testing services provided, test status, updates, and results.
Lab Packaging Test Engineer I Engineer In Training (Swing Shift) Ryzen SolutionsLab Packaging Test Engineer I Engineer In Training (Swing Shift)San Jose, CA$66,560Perform testing duties within the designated workday hours according to requirements to ensure customer objectives are met through proactive communication, documentation, and customer service. Maintain responsive customer communication in email and in person regarding testing services provided, test status, updates, and results.
Advanced Packaging Integration Engineer Applied MaterialsAdvanced Packaging Integration EngineerSanta Clara, CA$161,000–$221,000 / yearJoin the Photonics Platform Business Group at Applied Materials located in Santa Clara headquarters, work with a high caliber cross-functional research team to develop advanced packaging solutions for next-generation smart glasses and high‑performance optical interconnects. In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes.
FEA Packaging Engineer CspeedFEA Packaging EngineerPalo Alto, CaliforniaOur executive team has a demonstrated track record of building and scaling category-defining semiconductor and infrastructure businesses at companies like Broadcom, Lumentum, Tesla, Apple, Samsung, Intel, and VMware. Expert proficiency in one commercial FEA or CFD tool and working proficiency in a second covering the other domain — for example Ansys Mechanical or Abaqus alongside Icepak, Fluent, Flotherm, or Celsius.
Sr. Packaging Engineer NEXTracker IncSr. Packaging EngineerFremont, CA$160,000–$175,000 / yearThis role goes beyond traditional packaging design, focusing on end-to-end packaging systems, including returnable packaging, reverse logistics, cost modeling, and network-wide performance. Our talented worldwide teams are redefining how solar power plants are designed, built, and operated every day with smart technology, data-driven insights, and advanced automation.
Advanced Packaging Engineer — Fiber Array Integration CspeedAdvanced Packaging Engineer — Fiber Array IntegrationPalo Alto, CaliforniaA permanently bonded fiber array constrains the downstream flow in three respects: the engine cannot be optically qualified before fiber attach, a single failed channel scraps an assembly containing multiple high-value die, and manual fiber handling limits automation. This position owns the detachable optical interface for CspeedIO optical engines: the on-package element, the coupling optics, the alignment features, and the high-volume assembly process that joins fiber to engine without per-unit active alignment.
Cloud Hardware Development, Packaging, Network Product Development - Optics Amazon.com IncCloud Hardware Development, Packaging, Network Product Development - OpticsCupertino, CAYou will perform high-quality design, development, validation, and sustaining engineering of IC and SOC packages for high-speed applications, working closely with design teams, manufacturing partners, and cross-functional stakeholders to deliver robust solutions at scale. Within AWS Networking the NPD (Network Product Development) organization is responsible for, designing the hardware, building the software, and owning the interconnects for the routers that power the global AWS network.
Director of Advanced IC Packaging Development Renesas Electronics CorpDirector of Advanced IC Packaging DevelopmentSan Jose, CAWith a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules and Wide Bandgap (SiC/GaN) solutions.
Packaging And Labeling Technician - Shockwave Medical Johnson & JohnsonPackaging And Labeling Technician - Shockwave MedicalSanta Clara, CA$40,250–$64,802.50 / yearRequired Skills: Preferred Skills: Agile Manufacturing, Analytical Reasoning, Detail-Oriented, Equipment Maintenance, Good Manufacturing Practices (GMP), Issue Escalation, Manufacturing Equipment, Plant Operations, Predictive Maintenance, Problem Management, Process Oriented, Product Installation, Professional Ethics, Repair Management, Time Management, Troubleshooting. Employees and/or eligible dependents may be eligible to participate in the following Company sponsored employee benefit programs: medical, dental, vision, life insurance, short- and long-term disability, business accident insurance, and group legal insurance.
Packaging and Labeling Technician - Shockwave Medical Johnson & JohnsonPackaging and Labeling Technician - Shockwave MedicalSanta Clara, CA$40,250–$64,802.50 / yearRequired Skills: Preferred Skills: Agile Manufacturing, Analytical Reasoning, Detail-Oriented, Equipment Maintenance, Good Manufacturing Practices (GMP), Issue Escalation, Manufacturing Equipment, Plant Operations, Predictive Maintenance, Problem Management, Process Oriented, Product Installation, Professional Ethics, Repair Management, Time Management, Troubleshooting. Employees and/or eligible dependents may be eligible to participate in the following Company sponsored employee benefit programs: medical, dental, vision, life insurance, short- and long-term disability, business accident insurance, and group legal insurance.