Our solutions create healthier air travel, more fuel-efficient and better-maintained aircraft, more direct and on-time flight arrivals, safer skies and airports, and more comfortable flights, along with several innovations and services that reflect exciting and emerging new transportation methods such as autonomous and supersonic flight. Prior knowledge of wire bonding operations using 0007, 001, 0005 thick X 2 through 25 mil wide gold wire and ribbons to capacitors, diodes, IC's and transistors, using MEI and Westbond ball and wedge bonders.