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Must have 2 years of experience in at least 2 of the following metrology used in semiconductor processing: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR). Must have 2 years of experience in at least 3 of the following: wafer cross section techniques; wafer fabrication processes; ion transport phenomena; dynamic random-access memory (DRAM); plasma etching; plasma simulation; semiconductor thin film deposition; Atomic Layer Deposition (ALD); 3D NAND Flash; Chemical Vapor Deposition (CVD); or Plasma Enhanced Chemical Vapor Deposition (PECVD).

Taiwan Semiconductor Manufacturing Co Ltd

Principal Process Engineer Job5277

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This role sits at the cutting edge of materials science and mechanical engineering, where you will innovate next-generation materials, qualify specialized assembly equipment, and collaborate with global teams to optimize assembly processes for quality, yield, and high-volume manufacturability. This position is part of Intel's Advanced Packaging Technology Manufacturing (APTM) division, which is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.

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Intel Corp.

Packaging Module Development Engineer

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The Measurements & Controls Maanger will build and develop a team of engineers and partner closely with Equipment Engineering, Process Engineering, Maintenance, Quality, IT, Operations, and equipment suppliers to improve equipment reliability, process control, measurement capability, safety, and manufacturing performance. Lead equipment data collection, MES interfaces, barcode and traceability systems, and process-monitoring signals used by Process and Quality Engineering to control and improve manufacturing performance; partner with IT and cybersecurity teams to maintain secure and reliable equipment connectivity.

Corning Inc

Measurements & Controls Manager (Phoenix, AZ, US, 85353)

This is an ideal first step for a motivated graduate with a Bachelor’s or Associate’s degree, preferably in Materials Science, or equivalent experience and training, who’s eager to enter the semiconductor industry and learn from top experts. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.

Engineering Technician II, Metrology

Working closely with Process, Mechanical, Electrical, Software, Firmware, and Manufacturing Engineering teams, this individual will develop experimental strategies, analyze complex datasets, troubleshoot plasma-related challenges, and support the qualification of new technologies from concept through deployment. The Systems Engineer II, Plasma is responsible for the development, characterization, integration, and deployment of plasma-based sensing, diagnostics, and process control technologies across ASM semiconductor manufacturing equipment.

Senior Engineer II, Systems Engineering - Plasma

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The Lab Technician Intern will gain meaningful, hands-on laboratory experience while working closely with Heraeus Engineers, Laboratory Technicians, and Research & Development teams. This role provides exposure to real-world product manufacturing processes, analytical techniques, and laboratory best practices within a highly regulated and safety-focused environment.

Heraeus Holding GmbH

Lab Tech Intern

Working closely with Process, Mechanical, Electrical, Software, Firmware, and Manufacturing Engineering teams, this individual will develop experimental strategies, analyze complex datasets, troubleshoot plasma-related challenges, and support the qualification of new technologies from concept through deployment. This role combines plasma science, systems engineering, process diagnostics, and technology development to drive innovation and continuous improvement across ASM product platforms.

ASM International NV

The ideal candidate will have several years of process development experience in etching (chemical etch, plasma etch, ion beam etch), deposition (electron beam evaporation, sputtering), lithography (photolithography, electron beam lithography) and metrology (SEM, AFM, TEM, stylus profilometry, white light interferometry). In this role, the candidate will work collaboratively with a cross functional team of process engineers, PIC designers, RF designers, and PIC characterization engineers to fabricate non-linear photonic integrated circuits based on thin film lithium niobate.

Quantum Computing

Senior Process Engineer - H1

5+ years of hands-on semiconductor process engineering experience, with expertise in at least one of the following areas: e-beam lithography, photolithography, plasma dry etching, wet etching and cleaning, chemical vapor deposition, physical vapor deposition, e-beam evaporation, or metal electroplating. Perform hands-on semiconductor and photonic device fabrication in a cleanroom environment using a range of nanofabrication tools, including e-beam and photolithography systems, plasma etchers, chemical and physical vapor deposition systems, e-beam evaporators, and metal electroplating equipment.

Ceramics Jobs in Phoenix, AZ

Principal Process Engineer Job5277 Taiwan Semiconductor Manufacturing Co Ltd

Packaging Module Development Engineer Intel Corp.

Measurements & Controls Manager (Phoenix, AZ, US, 85353) Corning Inc

Engineering Technician II, Metrology ASM

Senior Engineer II, Systems Engineering - Plasma ASM

Lab Tech Intern Heraeus Holding GmbH

Senior Engineer II, Systems Engineering - Plasma ASM International NV

Senior Process Engineer - H1 Quantum Computing

Process Engineer Quantum Computing

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