Typical ownership spans block diagrams and high-level concept of operations definition, requirements capture, part selection and schematic capture, PCB layout oversight, signal and power integrity analysis, supply chain and vendor engagement, hardware bring up and qualification, production test definition, troubleshooting and failure analysis, review of hardware performance on orbit, and the incorporation of lessons learned and design improvements for the next generation. Common design elements include high power mixed-signal ASICs, cutting edge PAM4 SerDes, fully custom RF front ends and antenna elements, highly reliable and dense power conversion and distribution, extreme temperature environments, custom copper and optoelectronic interconnect, and tight electromechanical/thermal integration designed for mass manufacturing.