Design and develop package and interconnect methods for Renesas's packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded die/capacitor and power device packaging. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.